Skip Nav Destination

Issues

Select Decade

Select Year

Issue

Volume 145, Issue 3

September 2023

Previous Issue
Next Issue

ISSN 1043-7398

EISSN 1528-9044

In this Issue

Research Papers
Technical Briefs

Research Papers

Study on the Microstructure Evolution and Mechanical Properties of Cu/Cu₄₁Sn₁₁/Cu Solder Joint During High-Temperature Aging

Gangli Yang, Xiaoyan Li, Xu Han, Hu Zhang, Linjie Wen, Shanshan Li

J. Electron. Packag. September 2023, 145(3): 031001. doi: https://doi.org/10.1115/1.4056329

Abstract

View articletitled, Study on the Microstructure Evolution and Mechanical Properties of Cu/Cu<sub>41</sub>Sn<sub>11</sub>/Cu Solder Joint During High-Temperature Aging

Open the PDF for in another window

Topics: Mechanical properties , Solder joints , Tin , High temperature , Shear strength

Numerical Analysis of Flow and Heat Transfer Characteristics of Lattice-Based Compact Heat Sinks

Inderjot Kaur, Shiraz Mujahid, YubRaj Paudel, Hongjoo Rhee, Prashant Singh

J. Electron. Packag. September 2023, 145(3): 031002. doi: https://doi.org/10.1115/1.4056305

Abstract

View articletitled, Numerical Analysis of Flow and Heat Transfer Characteristics of Lattice-Based Compact Heat Sinks

Open the PDF for in another window

Topics: Flow (Dynamics) , Fluids , Heat transfer , Heat transfer coefficients , Topology , Temperature

Multi-Physics Models of a Low-Voltage Power Semiconductor System-in-Package for Automotive Applications

Giuseppe Mauromicale, Michele Calabretta, Giuseppe Scarcella, Giacomo Scelba, Alessandro Sitta

J. Electron. Packag. September 2023, 145(3): 031003. doi: https://doi.org/10.1115/1.4056413

Abstract

View articletitled, Multi-Physics Models of a Low-Voltage Power Semiconductor System-in-Package for Automotive Applications

Open the PDF for in another window

Topics: Power semiconductor devices , Simulation , Design , Automotive industry , System-in-package , Thermomechanics , Cycles

Mandrel Bend Test of Screen-Printed Silver Conductors

Rui Chen, Justin Chow, Yi Zhou, Suresh K. Sitaraman

J. Electron. Packag. September 2023, 145(3): 031004. doi: https://doi.org/10.1115/1.4056530

Abstract

View articletitled, Mandrel Bend Test of Screen-Printed Silver Conductors

Open the PDF for in another window

Topics: Cycles , Flexible electronics , Silver , Reliability , Inks , Damage , Imaging

Assessing the SAC305 Solder Joint Fatigue in Ball Grid Array Assembly Using Strain-Controlled and Stress-Controlled Approaches

Xin Wei, Sa'd Hamasha, Ali Alahmer, Mohamed El Amine Belhadi

J. Electron. Packag. September 2023, 145(3): 031005. doi: https://doi.org/10.1115/1.4056559

Abstract

View articletitled, Assessing the SAC305 Solder Joint Fatigue in Ball Grid Array Assembly Using Strain-Controlled and Stress-Controlled Approaches

Open the PDF for in another window

Topics: Ball-Grid-Array packaging , Cycles , Fatigue , Finishes , Solder joints , Stress , Fatigue life , Solders , Alloys

Investigation of Electromechanical Reliability and Radio Frequency Performance of a Highly Stretchable Liquid Metal Conductor for Wearable Electronics

Behnam Garakani, Udara S. Somarathna, Ashraf Umar, Gurvinder Singh Khinda, Mohamed Youssef M. Abdelatty, El Mehdi Abbara, Sari Al Zerey, Mike Hopkins, Sai Srinivas, Chuck Kinzel, Christopher Halseth, Mark Ronay, Mark D. Poliks

J. Electron. Packag. September 2023, 145(3): 031006. doi: https://doi.org/10.1115/1.4056640

Abstract

View articletitled, Investigation of Electromechanical Reliability and Radio Frequency Performance of a Highly Stretchable Liquid Metal Conductor for Wearable Electronics

Open the PDF for in another window

Topics: Fatigue , Liquid metals , Tension , Transmission lines , Cycles , Fatigue testing , Reliability , Wearable devices , Metals , Simulation

A Time Frequency Domain Based Approach for Ball Grid Array Solder Joint Fatigue Analysis Using Global Local Modeling Technique

Sushil Doranga, Dongji Xie, Jeffrey Lee, Andy Zhang, Xue Shi, Valeriy Khaldarov

J. Electron. Packag. September 2023, 145(3): 031007. doi: https://doi.org/10.1115/1.4056886

Abstract

View articletitled, A Time Frequency Domain Based Approach for Ball Grid Array Solder Joint Fatigue Analysis Using Global Local Modeling Technique

Open the PDF for in another window

Topics: Excitation , Fatigue life , Fatigue testing , Finite element analysis , Finite element model , Modeling , Resonance , Simulation , Solder joints , Stress

Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics Applications

Khalid Alzoubi, Alexander Hensel, Felix Häußler, Bettina Ottinger, Marcel Sippel, Jörg Franke

J. Electron. Packag. September 2023, 145(3): 031008. doi: https://doi.org/10.1115/1.4056992

Abstract

View articletitled, Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics Applications

Open the PDF for in another window

Topics: Electronics , Experimental design , Intermetallic compounds , Optimization , Pressure , Shear strength , Silver , Sintering , Temperature , Failure

High Gain and Wideband Antenna-in-Package Solution Using Fan-Out Technology

Xuesong Zhang, Qian Wang, Chenhui Xia, Chaojie Zhou, Gang Wang, Jian Cai

J. Electron. Packag. September 2023, 145(3): 031009. doi: https://doi.org/10.1115/1.4056991

Abstract

View articletitled, High Gain and Wideband Antenna-in-Package Solution Using Fan-Out Technology

Open the PDF for in another window

Topics: Design , Dipoles (Electromagnetism) , Manufacturing , Millimeter waves , Packaging , Radiation (Physics) , Signals , Simulation , Warping , Waveguides

Model Establishment of Chip Air Cooling Process and Its Proportional Integral Differential Tuning

Linmeng Xu, Wanying Zhao, Junhui Li

J. Electron. Packag. September 2023, 145(3): 031010. doi: https://doi.org/10.1115/1.4062530

Abstract

View articletitled, Model Establishment of Chip Air Cooling Process and Its Proportional Integral Differential Tuning

Open the PDF for in another window

Topics: Convection , Cooling , Cycles , Heat , Temperature , Heat conduction , Optimization , Thermal resistance , Matlab , Energy dissipation

Numerical Study of Two-Stage Temperature Control Strategy for High-Temperature Stability of Satellite-Borne Fiber Optic Gyroscope

Kaifeng Chang, Yun-Ze Li, Weishu Wang

J. Electron. Packag. September 2023, 145(3): 031011. doi: https://doi.org/10.1115/1.4062108

Abstract

View articletitled, Numerical Study of Two-Stage Temperature Control Strategy for High-Temperature Stability of Satellite-Borne Fiber Optic Gyroscope

Open the PDF for in another window

Topics: Fibers , Heat , Satellites , Temperature , Temperature control , Thermoelectric coolers , Temperature controls

Technical Briefs

Artificial Intelligence for Power Electronics in Electric Vehicles: Challenges and Opportunities

Paul Paret, Donal Finegan, Sreekant Narumanchi

J. Electron. Packag. September 2023, 145(3): 034501. doi: https://doi.org/10.1115/1.4056306

Abstract

View articletitled, Artificial Intelligence for Power Electronics in Electric Vehicles: Challenges and Opportunities

Open the PDF for in another window

Topics: Artificial intelligence , Design , Electric vehicles , Electronics , Thermal management , Semiconductor devices , Reliability , Manufacturing , Semiconductors (Materials)

A Comparison of Biaxial Bending Strength of Thin Silicon Dies in the Ball-on-Ring and PoEF Tests

M. Y. Tsai, T. C. Kuo

J. Electron. Packag. September 2023, 145(3): 034502. doi: https://doi.org/10.1115/1.4056717

Abstract

View articletitled, A Comparison of Biaxial Bending Strength of Thin Silicon Dies in the Ball-on-Ring and PoEF Tests

Open the PDF for in another window

Topics: Bending strength , Silicon , Stress , Displacement , Failure mechanisms

All Issues

Email alerts

Accepted Manuscript Alert

New Issue Alert

RSS Feeds

Open Issues RSS Feed

Latest
Most Read
Most Cited

Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation

J. Electron. Packag (December 2024)

Special Issue on InterPACK2023

J. Electron. Packag

Extreme Drop Durability of Sintered Silver Traces Printed With Extrusion and Aerosol Jet Processes

J. Electron. Packag (December 2024)

Experimental Method to Measure High-Temperature Hygroscopic Swelling in Epoxy Mold Compounds and Dielectric Build-Up Films

J. Electron. Packag (March 2025)

Application of the Nonlinear Fracture Mechanics Parameter

Δ

T* to Wire-Liftoff Lifetime Estimation of Power Modules at Elevated Temperatures

J. Electron. Packag (March 2025)

Research Papers

Study on the Microstructure Evolution and Mechanical Properties of Cu/Cu₄₁Sn₁₁/Cu Solder Joint During High-Temperature Aging

Numerical Analysis of Flow and Heat Transfer Characteristics of Lattice-Based Compact Heat Sinks

Multi-Physics Models of a Low-Voltage Power Semiconductor System-in-Package for Automotive Applications

Mandrel Bend Test of Screen-Printed Silver Conductors

Assessing the SAC305 Solder Joint Fatigue in Ball Grid Array Assembly Using Strain-Controlled and Stress-Controlled Approaches

Investigation of Electromechanical Reliability and Radio Frequency Performance of a Highly Stretchable Liquid Metal Conductor for Wearable Electronics

A Time Frequency Domain Based Approach for Ball Grid Array Solder Joint Fatigue Analysis Using Global Local Modeling Technique

Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics Applications

High Gain and Wideband Antenna-in-Package Solution Using Fan-Out Technology

Model Establishment of Chip Air Cooling Process and Its Proportional Integral Differential Tuning

Numerical Study of Two-Stage Temperature Control Strategy for High-Temperature Stability of Satellite-Borne Fiber Optic Gyroscope

Technical Briefs

Artificial Intelligence for Power Electronics in Electric Vehicles: Challenges and Opportunities

A Comparison of Biaxial Bending Strength of Thin Silicon Dies in the Ball-on-Ring and PoEF Tests

Email alerts

RSS Feeds

ASME Journals

ASME Conference Proceedings

ASME eBooks

Resources

Opportunities

Issues

Research Papers

Technical Briefs

Email alerts

RSS Feeds

ASME Journals

ASME Conference Proceedings

ASME eBooks

Resources

Opportunities

This Feature Is Available To Subscribers Only