Search Results | J. Electron. Packag. | ASME Digital Collection

1-20 of 51

2 3

Sort by

Sort Order Select

Journal Articles

Effective Constitutive Relations for Sintered Nano Copper Joints

Sanoop Thekkut, Rajesh Sharma Sivasubramony, Arun Raj, Yuki Kawana, Jones Assiedu, Kabir Mirpuri, Ninad Shahane, Patrick Thompson, Peter Borgesen

J. Electron. Packag. June 2023, 145(2): 021010.

Paper No: EP-22-1043

DOI: https://doi.org/10.1115/1.4056113

Published Online: November 11, 2022

View Article

Topics: Constitutive equations, Copper, Creep, Deformation, Diffusion (Physics), Oxidation, Stress, Temperature, Transients (Dynamics), Sintering

Journal Articles

Hybrid Monte Carlo-Diffusion Studies of Modeling Self-Heating in Ballistic-Diffusive Regime for Gallium Nitride HEMTs

Han-Ling Li, Yang Shen, Yu-Chao Hua, S. L. Sobolev, Bing-Yang Cao

J. Electron. Packag. March 2023, 145(1): 011203.

Paper No: EP-22-1007

DOI: https://doi.org/10.1115/1.4054698

Published Online: July 13, 2022

View Article

Topics: Diffusion (Physics), Gallium nitride, Heat, Heating, Modeling, Phonons, Simulation, Temperature, Heat conduction, Junctions

Journal Articles

Damage Analysis in Ag Nanoparticle Interconnect Line Under High-Density Electric Current

Daiki Saito, Kazuhiko Sasagawa, Takeshi Moriwaki, Kazuhiro Fujisaki

J. Electron. Packag. December 2022, 144(4): 041012.

Paper No: EP-21-1136

DOI: https://doi.org/10.1115/1.4053365

Published Online: January 28, 2022

View Article

Topics: Damage, Density, Electric current, Inks, Nanoparticles, Reliability, Lasers, Diffusion (Physics), Atoms, Grain boundaries

Journal Articles

Guidelines for Designing Micropillar Structures for Enhanced Evaporative Heat Transfer

Kidus Guye, De Dong, Yunseo Kim, Hyoungsoon Lee, Baris Dogruoz, Damena Agonafer

J. Electron. Packag. December 2021, 143(4): 041106.

Paper No: EP-21-1120

DOI: https://doi.org/10.1115/1.4052465

Published Online: October 13, 2021

View Article

Topics: Design, Drops, Evaporation, Heat conduction, Heat transfer, Heat transfer coefficients, Optimization, Particle swarm optimization, Shapes, Vapors

Journal Articles

Inelastic Deformation of Copper Nanoparticle Based Joints and Bonds

Sanoop Thekkut, Maan Zaid Kokash, Rajesh Sharma Sivasubramony, Yuki Kawana, Kabir Mirpuri, Ninad Shahane, Patrick Thompson, Christopher M. Greene, Peter Borgesen

J. Electron. Packag. September 2022, 144(3): 031009.

Paper No: EP-21-1076

DOI: https://doi.org/10.1115/1.4051728

Published Online: September 15, 2021

View Article

Topics: Creep, Deformation, Diffusion (Physics), Dislocations, Stress, Temperature, Annealing, Nanoparticles, Particulate matter, Copper

Journal Articles

Fatigue Testing of Copper Nanoparticle-Based Joints and Bonds

Rajesh Sharma Sivasubramony, Maan Zaid Kokash, Sanoop Thekkut, Ninad Shahane, Patrick Thompson, Kabir Mirpuri, Yuki Kawana, Christopher M. Greene, Peter Borgesen

J. Electron. Packag. March 2022, 144(1): 011007.

Paper No: EP-20-1120

DOI: https://doi.org/10.1115/1.4050871

Published Online: August 6, 2021

View Article

Topics: Annealing, Cycles, Damage, Deformation, Dislocations, Fatigue, Fatigue life, Nanoparticles, Particulate matter, Shear strength

Journal Articles

Numerical Investigation of Shape Effect on Microdroplet Evaporation

Li Shan, Shuai Shuai, Binjian Ma, Zichen Du, Baris Dogruoz, Damena Agonafer

J. Electron. Packag. December 2019, 141(4): 041008.

Paper No: EP-19-1038

DOI: https://doi.org/10.1115/1.4044962

Published Online: October 18, 2019

View Article

Topics: Diffusion (Physics), Drops, Evaporation, Vapors, Shapes, Simulation

Journal Articles

Modeling of Moisture Transport Into an Electronic Enclosure Using the Resistor-Capacitor Approach

Ž. Staliulionis, H. Conseil-Gudla, S. Mohanty, M. Jabbari, R. Ambat, J. H. Hattel

J. Electron. Packag. September 2018, 140(3): 031001.

Paper No: EP-17-1046

DOI: https://doi.org/10.1115/1.4039790

Published Online: May 10, 2018

View Article

Topics: Capacitors, Circuits, Diffusion (Physics), Modeling, Resistors, Temperature, Wall thickness

Journal Articles

Display Light Guide Swelling Due to Moisture Absorption

A. K. Cousins, G. H. Thiel, E. Wolak, G. Limaye, S. Tiku

J. Electron. Packag. December 2017, 139(4): 041006.

Paper No: EP-17-1070

DOI: https://doi.org/10.1115/1.4037971

Published Online: October 5, 2017

View Article

Topics: Absorption, Diffusion (Physics), Water, Water absorption, Polymers

Journal Articles

Effect of the Crystallinity on the Electromigration Resistance of Electroplated Copper Thin-Film Interconnections

Takeru Kato, Ken Suzuki, Hideo Miura

J. Electron. Packag. June 2017, 139(2): 020911.

Paper No: EP-16-1144

DOI: https://doi.org/10.1115/1.4036442

Published Online: June 12, 2017

View Article

Topics: Atoms, Copper, Current density, Diffusion (Physics), Electrodiffusion, Grain boundaries, Reliability, Temperature, Thin films, Heating

Journal Articles

Moisture Ingress, Behavior, and Prediction Inside Semiconductor Packaging: A Review

Bongtae Han, Dae-Suk Kim

J. Electron. Packag. March 2017, 139(1): 010802.

Paper No: EP-16-1107

DOI: https://doi.org/10.1115/1.4035598

Published Online: January 16, 2017

View Article

Topics: Diffusion (Physics), Polymers, Temperature, Cavities, Semiconductors (Materials), Packaging, Water, Vapor pressure

Journal Articles

A Finite Difference Lattice Boltzmann Method to Simulate Multidimensional Subcontinuum Heat Conduction

Cheng Chen, James Geer, Bahgat Sammakia

J. Electron. Packag. December 2016, 138(4): 041008.

Paper No: EP-16-1053

DOI: https://doi.org/10.1115/1.4034856

Published Online: October 20, 2016

View Article

Topics: Diffusion (Physics), Heat conduction, Lattice Boltzmann methods, Phonons, Silicon, Temperature, Thermal conductivity, Density, Heat, Equilibrium (Physics)

Journal Articles

Growth Kinetics of Intermetallic Compounds Between Sn and Fe Liquid–Solid Reaction Couples

Shou-Jen Hsu, Chin C. Lee

J. Electron. Packag. December 2016, 138(4): 041006.

Paper No: EP-16-1095

DOI: https://doi.org/10.1115/1.4034842

Published Online: October 10, 2016

View Article

Topics: Annealing, Intermetallic compounds, Solders, Temperature, Tin, Diffusion (Physics), Carbon, Steel

Journal Articles

A Note on the Normalized Approach to Simulating Moisture Diffusion in a Multimaterial System Under Transient Thermal Conditions Using ansys 14 and 14.5

Dapeng Liu, Seungbae Park

J. Electron. Packag. September 2014, 136(3): 034501.

Paper No: EP-13-1094

DOI: https://doi.org/10.1115/1.4026661

Published Online: May 5, 2014

View Article

Topics: Diffusion (Physics), Simulation, Temperature, Transients (Dynamics), Materials properties

Journal Articles

Analytical Solutions and a Numerical Approach for Diffusion-Induced Stresses in Intermetallic Compound Layers of Solder Joints

Tong An, Fei Qin, Guofeng Xia

J. Electron. Packag. March 2014, 136(1): 011001.

Paper No: EP-13-1028

DOI: https://doi.org/10.1115/1.4025863

Published Online: November 22, 2013

View Article

Topics: Diffusion (Physics), Stress, Tin, Atoms, Solders, Solder joints

Journal Articles

Hygromechanical Analysis of Liquid Crystal Display Panels

Toru Ikeda, Tomonori Mizutani, Kiyoshi Miyake, Noriyuki Miyazaki

J. Electron. Packag. December 2013, 135(4): 041005.

Paper No: EP-10-1084

DOI: https://doi.org/10.1115/1.4025527

Published Online: November 5, 2013

View Article

Topics: Diffusion (Physics), Liquid crystals, Polarizers (Light), Temperature, Thermomechanics, Warping, Gas laws (Thermodynamics), Materials properties

Journal Articles

Enhanced Diffusion of Silver Atoms on the Surface of Nanoparticles at Low Temperatures

Jung-Il Hong, Yong Ding, Kyoung-Sik Moon, C. P. Wong

J. Electron. Packag. March 2013, 135(1): 011002.

Paper No: EP-11-1101

DOI: https://doi.org/10.1115/1.4023910

Published Online: March 26, 2013

View Article

Topics: Atoms, Diffusion (Physics), Low temperature, Nanoparticles, Silver, Temperature

Journal Articles

Numerical Simulations of Electromigration and Stressmigration Driven Void Evolution in Solder Interconnects

Subramanya Sadasiva, Ganesh Subbarayan, Lei Jiang, Daniel Pantuso

J. Electron. Packag. June 2012, 134(2): 020907.

DOI: https://doi.org/10.1115/1.4006707

Published Online: June 11, 2012

View Article

Topics: Diffusion (Physics), Electrodiffusion, Solder joints, Solders, Stress, Flip-chip, Finite element analysis, Grain boundary diffusion, Electric potential, Surface energy

Journal Articles

Evaluation of the Dominant Factor for Electromigration in Sputtered High Purity Al Films

X. Zhao, M. Saka, M. Yamashita, F. Togoh

J. Electron. Packag. June 2010, 132(2): 021003.

DOI: https://doi.org/10.1115/1.4001687

Published Online: June 11, 2010

View Article

Topics: Current density, Diffusion (Physics), Electrodiffusion, Grain boundary diffusion, Grain size, Temperature, Sputtering (Irradiation), Circuits, Damage, Strips

Journal Articles

Direct Concentration Approach of Moisture Diffusion and Whole-Field Vapor Pressure Modeling for Reflow Process—Part I: Theory and Numerical Implementation

B. Xie, X. J. Fan, X. Q. Shi, H. Ding

J. Electron. Packag. September 2009, 131(3): 031010.

DOI: https://doi.org/10.1115/1.3144147

Published Online: July 31, 2009

View Article

Topics: Diffusion (Physics), Modeling, Temperature, Vapor pressure, Electronic packages

2 3

Journal citation

NARROW

Effective Constitutive Relations for Sintered Nano Copper Joints

Hybrid Monte Carlo-Diffusion Studies of Modeling Self-Heating in Ballistic-Diffusive Regime for Gallium Nitride HEMTs

Damage Analysis in Ag Nanoparticle Interconnect Line Under High-Density Electric Current

Guidelines for Designing Micropillar Structures for Enhanced Evaporative Heat Transfer

Inelastic Deformation of Copper Nanoparticle Based Joints and Bonds

Fatigue Testing of Copper Nanoparticle-Based Joints and Bonds

Numerical Investigation of Shape Effect on Microdroplet Evaporation

Modeling of Moisture Transport Into an Electronic Enclosure Using the Resistor-Capacitor Approach

Display Light Guide Swelling Due to Moisture Absorption

Effect of the Crystallinity on the Electromigration Resistance of Electroplated Copper Thin-Film Interconnections

Moisture Ingress, Behavior, and Prediction Inside Semiconductor Packaging: A Review

A Finite Difference Lattice Boltzmann Method to Simulate Multidimensional Subcontinuum Heat Conduction

Growth Kinetics of Intermetallic Compounds Between Sn and Fe Liquid–Solid Reaction Couples

A Note on the Normalized Approach to Simulating Moisture Diffusion in a Multimaterial System Under Transient Thermal Conditions Using ansys 14 and 14.5

Analytical Solutions and a Numerical Approach for Diffusion-Induced Stresses in Intermetallic Compound Layers of Solder Joints

Hygromechanical Analysis of Liquid Crystal Display Panels

Enhanced Diffusion of Silver Atoms on the Surface of Nanoparticles at Low Temperatures

Numerical Simulations of Electromigration and Stressmigration Driven Void Evolution in Solder Interconnects

Evaluation of the Dominant Factor for Electromigration in Sputtered High Purity Al Films

Direct Concentration Approach of Moisture Diffusion and Whole-Field Vapor Pressure Modeling for Reflow Process—Part I: Theory and Numerical Implementation

Journals

Conference Proceedings

eBooks

Resources

Opportunities

Journals

Conference Proceedings

eBooks

Resources

Opportunities

This Feature Is Available To Subscribers Only