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Journal Articles

Heat Conduction in Mobile Electronic Equipment: Study on the Effects of Some Key Parameters on Heat Source Temperature Based on a Three-Layer Model

Wataru Nakayama

Publisher: ASME

J. Electron. Packag. September 2013, 135(3): 034501.

Paper No: EP-11-1100

https://doi.org/10.1115/1.4024367

Published Online: June 4, 2013

View Article titled, Heat Conduction in Mobile Electronic Equipment: Study on the Effects of Some Key Parameters on Heat Source Temperature Based on a Three-Layer Model

Topics: Heat, Heat conduction, Temperature, Thermal conductivity, Electronic equipment

Journal Articles

Chimney Effect on Natural Air Cooling of Electronic Equipment Under Inclination

Yoji Kitamura, Masaru Ishizuka

Publisher: ASME

J. Electron. Packag. December 2004, 126(4): 423–428.

https://doi.org/10.1115/1.1827256

Published Online: January 24, 2005

View Article titled, Chimney Effect on Natural Air Cooling of Electronic Equipment Under Inclination

Topics: Cooling, Electronic equipment, Temperature, Natural convection, Flow (Dynamics), Computer simulation

Journal Articles

Design of Cooling Systems for Electronic Equipment Using Both Experimental and Numerical Inputs

Tunc Icoz, Yogesh Jaluria

Publisher: ASME

J. Electron. Packag. December 2004, 126(4): 465–471.

https://doi.org/10.1115/1.1827262

Published Online: January 24, 2005

View Article titled, Design of Cooling Systems for Electronic Equipment Using Both Experimental and Numerical Inputs

Topics: Computer simulation, Cooling systems, Design, Electronic equipment, Flow (Dynamics), Heat, Temperature, Turbulence, Cooling, Heat transfer

Journal Articles

A New Role of CFD Simulation in Thermal Design of Compact Electronic Equipment: Application of the Build-up Approach to Thermal Analysis of a Benchmark Model

Wataru Nakayama, Ryuichi Matsuki, Yukari Hacho, Kiyoko Yajima

Publisher: ASME

J. Electron. Packag. December 2004, 126(4): 440–448.

https://doi.org/10.1115/1.1827259

Published Online: January 24, 2005

View Article titled, A New Role of CFD Simulation in Thermal Design of Compact Electronic Equipment: Application of the Build-up Approach to Thermal Analysis of a Benchmark Model

Topics: Computational fluid dynamics, Design, Electronic equipment, Simulation, Thermal analysis, Taguchi methods, Temperature, Thermal resistance

Journal Articles

A Vapotron Effect Application for Electronic Equipment Cooling

Giulio Lorenzini, Cesare Biserni

Publisher: ASME

J. Electron. Packag. December 2003, 125(4): 475–479.

https://doi.org/10.1115/1.1615796

Published Online: December 15, 2003

View Article titled, A Vapotron Effect Application for Electronic Equipment Cooling

Topics: Boiling, Cavities, Cooling, Electronic equipment, Fluids, Forced convection, Heat transfer coefficients, Heating, Refrigerants, Temperature

Journal Articles

Thermal Interfacing Techniques for Electronic Equipment—A Perspective

Wataru Nakayama, Arthur E. Bergles

Publisher: ASME

J. Electron. Packag. June 2003, 125(2): 192–199.

https://doi.org/10.1115/1.1568127

Published Online: June 10, 2003

View Article titled, Thermal Interfacing Techniques for Electronic Equipment—A Perspective

Topics: Contact resistance, Cooling, Electrical conductance, Electronic equipment, Flat heat pipes, Flow (Dynamics), Heat, Heat conduction, Heat sinks, Heat transfer

Journal Articles

Impact Resistance of SM Joints Formed With ICA

C. M. Lawrence Wu, Robert K. Y. Li, N. H. Yeung

Publisher: ASME

J. Electron. Packag. March 2003, 125(1): 93–97.

https://doi.org/10.1115/1.1534842

Published Online: March 14, 2003

View Article titled, Impact Resistance of SM Joints Formed With ICA

Topics: Adhesives, Copper, Fracture (Materials), Impact testing, Shear (Mechanics), Shear strength, Solders, Silver, Resistors, Alloys

Journal Articles

Impact Resistance of SM Joints Formed With ICA

C. M. Lawrence Wu, Robert K. Y. Li, N. H. Yeung

Publisher: ASME

J. Electron. Packag. December 2002, 124(4): 374–378.

https://doi.org/10.1115/1.1502666

Published Online: December 12, 2002

View Article titled, Impact Resistance of SM Joints Formed With ICA

Topics: Adhesives, Copper, Fracture (Materials), Impact testing, Reliability, Shear (Mechanics), Shear strength, Solders, Silver, Resistors

Journal Articles

Natural Convection Cooling of Multiple Heat Sources in Parallel Open-Top Cavities Filled With a Fluorinert Liquid

M. Behnia, A. A. Dehghan, H. Mishima, W. Nakayama

Publisher: ASME

J. Electron. Packag. March 1998, 120(1): 73–81.

https://doi.org/10.1115/1.2792289

Published Online: March 1, 1998

View Article titled, Natural Convection Cooling of Multiple Heat Sources in Parallel Open-Top Cavities Filled With a Fluorinert Liquid

Topics: Cavities, Cooling, Heat, Natural convection, Heat transfer, Ceramics, Flow (Dynamics), Electrical wires, Electronic equipment, Heat conduction

Journal Articles

Numerical Prediction of Flow and Heat Transfer in an Impingement Heat Sink

S. Sathe, K. M. Kelkar, K. C. Karki, C. Tai, C. Lamb, S. V. Patankar

Publisher: ASME

J. Electron. Packag. March 1997, 119(1): 58–63.

https://doi.org/10.1115/1.2792201

Published Online: March 1, 1997

View Article titled, Numerical Prediction of Flow and Heat Transfer in an Impingement Heat Sink

Topics: Flow (Dynamics), Heat sinks, Heat transfer, Ceramics, Fins, Nozzles, Cooling, Heat, Temperature, Air flow

Journal Articles

Review of Heat Transfer Technologies in Electronic Equipment

L. T. Yeh

Publisher: ASME

J. Electron. Packag. December 1995, 117(4): 333–339.

https://doi.org/10.1115/1.2792113

Published Online: December 1, 1995

View Article titled, Review of Heat Transfer Technologies in Electronic Equipment

Topics: Electronic equipment, Heat transfer, Air Force, Design, Electronic systems, Electronics, Energy dissipation, Failure, Heat, Reliability

Journal Articles

Laminar Heat Transfer Between a Series of Parallel Plates With Surface-Mounted Discrete Heat Sources

S. H. Kim, N. K. Anand

Publisher: ASME

J. Electron. Packag. March 1995, 117(1): 52–62.

https://doi.org/10.1115/1.2792067

Published Online: March 1, 1995

View Article titled, Laminar Heat Transfer Between a Series of Parallel Plates With Surface-Mounted Discrete Heat Sources

Topics: Heat, Heat transfer, Plates (structures), Thermal resistance, Friction, Air flow, Cooling, Electrical conductivity, Electronic equipment, Flow (Dynamics)

Journal Articles

On the Natural Convection in a Cavity With a Cooled Top Wall and Multiple Protruding Heaters

C. P. Desai, K. Vafai, M. Keyhani

Publisher: ASME

J. Electron. Packag. March 1995, 117(1): 34–45.

https://doi.org/10.1115/1.2792065

Published Online: March 1, 1995

View Article titled, On the Natural Convection in a Cavity With a Cooled Top Wall and Multiple Protruding Heaters

Topics: Cavities, Natural convection, Flow (Dynamics), Rayleigh number, Cooling, Electronic equipment, Heat sinks, Secondary cells, Temperature

Journal Articles

Heat Conduction in Concentric Cylinders: An Application to Electronic Packages

Sanjeev Sathe

Publisher: ASME

J. Electron. Packag. September 1994, 116(3): 230–233.

https://doi.org/10.1115/1.2905690

Published Online: September 1, 1994

View Article titled, Heat Conduction in Concentric Cylinders: An Application to Electronic Packages

Topics: Cylinders, Electronic packages, Heat conduction, Heat, Thermal conductivity, Aluminum, Copper, Dielectric materials, Dimensions, Electronic equipment

Journal Articles

Analysis and Simulation of Thermal Transients and Resultant Stresses and Strains in TAB Packaging

M. A. Jog, I. M. Cohen, P. S. Ayyaswamy

Publisher: ASME

J. Electron. Packag. March 1993, 115(1): 34–38.

https://doi.org/10.1115/1.2909299

Published Online: March 1, 1993

View Article titled, Analysis and Simulation of Thermal Transients and Resultant Stresses and Strains in TAB Packaging

Topics: Packaging, Simulation, Stress, Transients (Dynamics), Temperature, Thermal stresses, Composite materials, Delamination, Electronic equipment, Elongation

Journal Articles

State-of-the-Art and Trends in the Thermal Packaging of Electronic Equipment

Avram Bar-Cohen

Publisher: ASME

J. Electron. Packag. September 1992, 114(3): 257–270.

https://doi.org/10.1115/1.2905450

Published Online: September 1, 1992

View Article titled, State-of-the-Art and Trends in the Thermal Packaging of Electronic Equipment

Topics: Electronic equipment, Packaging, Design methodology, Design, Errors, Mechanical engineers, Scalars

Journal Articles

Statistical Energy Analysis for Electronic Equipment

L. Lu

Publisher: ASME

J. Electron. Packag. September 1991, 113(3): 322–325.

https://doi.org/10.1115/1.2905413

Published Online: September 1, 1991

View Article titled, Statistical Energy Analysis for Electronic Equipment

Topics: Electronic equipment, Seas, Vibration, Finite element model, Instrumentation, Vibration analysis

Journal Articles

Mechanical Engineering Issues and Electronic Equipment Reliability: Incurred Costs Without Compensating Benefits

C. T. Leonard

Publisher: ASME

J. Electron. Packag. March 1991, 113(1): 1–7.

https://doi.org/10.1115/1.2905360

Published Online: March 1, 1991

View Article titled, Mechanical Engineering Issues and Electronic Equipment Reliability: Incurred Costs Without Compensating Benefits

Topics: Electronic equipment, Mechanical engineering, Reliability, Temperature, Failure, Electronic components, Electronics, Manufacturing

Journal Articles

Component Placement for Reliability on Conductively Cooled Printed Wiring Boards

M. D. Osterman, M. Pecht

Publisher: ASME

J. Electron. Packag. June 1989, 111(2): 149–156.

https://doi.org/10.1115/1.3226521

Published Online: June 1, 1989

View Article titled, Component Placement for Reliability on Conductively Cooled Printed Wiring Boards

Topics: Printed circuit boards, Reliability, Electronic equipment, Failure, Packaging

Journal citation

NARROW

Heat Conduction in Mobile Electronic Equipment: Study on the Effects of Some Key Parameters on Heat Source Temperature Based on a Three-Layer Model

Chimney Effect on Natural Air Cooling of Electronic Equipment Under Inclination

Design of Cooling Systems for Electronic Equipment Using Both Experimental and Numerical Inputs

A New Role of CFD Simulation in Thermal Design of Compact Electronic Equipment: Application of the Build-up Approach to Thermal Analysis of a Benchmark Model

A Vapotron Effect Application for Electronic Equipment Cooling

Thermal Interfacing Techniques for Electronic Equipment—A Perspective

Impact Resistance of SM Joints Formed With ICA

Impact Resistance of SM Joints Formed With ICA

Natural Convection Cooling of Multiple Heat Sources in Parallel Open-Top Cavities Filled With a Fluorinert Liquid

Numerical Prediction of Flow and Heat Transfer in an Impingement Heat Sink

Review of Heat Transfer Technologies in Electronic Equipment

Laminar Heat Transfer Between a Series of Parallel Plates With Surface-Mounted Discrete Heat Sources

On the Natural Convection in a Cavity With a Cooled Top Wall and Multiple Protruding Heaters

Heat Conduction in Concentric Cylinders: An Application to Electronic Packages

Analysis and Simulation of Thermal Transients and Resultant Stresses and Strains in TAB Packaging

State-of-the-Art and Trends in the Thermal Packaging of Electronic Equipment

Statistical Energy Analysis for Electronic Equipment

Mechanical Engineering Issues and Electronic Equipment Reliability: Incurred Costs Without Compensating Benefits

Component Placement for Reliability on Conductively Cooled Printed Wiring Boards

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