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Journal Articles

Tensile Behaviors of Lead-Containing and Lead-Free Solders at High Strain Rates

Fei Qin, Tong An, Na Chen, Jie Bai
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031001.
https://doi.org/10.1115/1.3144151
Published Online: June 16, 2009
View Article titled, Tensile Behaviors of Lead-Containing and Lead-Free Solders at High Strain Rates
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Topics: Fractography, Lead-free solders, Solders, Tensile strength, Reliability, Electronic products, Solder joints, Stress-strain curves
Journal Articles

Highlights from the European Thermal Project PROFIT

Clemens J. M. Lasance
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technology Review
J. Electron. Packag. December 2004, 126(4): 565–570.
https://doi.org/10.1115/1.1827258
Published Online: January 24, 2005
View Article titled, Highlights from the European Thermal Project PROFIT
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Topics: Modeling, Reliability, Safety, Steady state, Temperature, Computer software, Electronic products, Temperature gradient
Journal Articles

First Call for Papers: International IEEE Conference on the Business of Electronic Product Reliability and Liability

Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Announcements
J. Electron. Packag. December 2002, 124(4): 432.
https://doi.org/10.1115/1.1510861
Published Online: December 12, 2002
View Article titled, First Call for Papers: International IEEE Conference on the Business of Electronic Product Reliability and Liability
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Topics: Electronic products, Liabilities, Reliability, Telecommunications, Testing
Journal Articles

A Nested Finite Element Methodology (NFEM) for Stress Analysis of Electronic Products—Part I: Theory and Formulation

Krishna Darbha, Abhijit Dasgupta, Professor
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. June 2001, 123(2): 141–146.
https://doi.org/10.1115/1.1328744
Published Online: October 10, 2000
View Article titled, A Nested Finite Element Methodology (NFEM) for Stress Analysis of Electronic Products—Part I: Theory and Formulation
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Topics: Displacement, Finite element analysis, Potential energy, Stress, Stress analysis (Engineering), Creep, Thermomechanics, Electronic products
Journal Articles

Development in Optical Methods for Reliability Analysis in Electronic Packaging Applications

Y. Guo, S. Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. June 1998, 120(2): 186–193.
https://doi.org/10.1115/1.2792619
Published Online: June 1, 1998
View Article titled, Development in Optical Methods for Reliability Analysis in Electronic Packaging Applications
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Topics: Electronic packaging, Event history analysis, Stress, Reliability, Failure, Packaging, Cycles, Design, Electronic packages, Electronic products
Journal Articles

Long-Term Non-Operating Reliability of Electronic Products

Judy Pecht, Author, Michael Pecht, Author, Anthony J. Rafanelli, Reviewer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. June 1997, 119(2): 145–146.
https://doi.org/10.1115/1.2792222
Published Online: June 1, 1997
View Article titled, Long-Term Non-Operating Reliability of Electronic Products
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Topics: Electronic products, Reliability
Journal Articles

An Investigation of the Passive Cooling of Table Model Television Receivers

M. S. Yuki, J. R. Parsons, R. J. Krane
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1990, 112(4): 279–287.
https://doi.org/10.1115/1.2904380
Published Online: December 1, 1990
View Article titled, An Investigation of the Passive Cooling of Table Model Television Receivers
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Topics: Cooling, Vents, Natural convection, Design, Engineers, Flow (Dynamics), Computer simulation, Electronic products, Flow visualization, Heat transfer
Journal Articles

Designing Electronic Products to Withstand the Distribution Environment

R. Peache, D. Privitera, J. Gasper, D. Heasty
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1989, 111(4): 294–298.
https://doi.org/10.1115/1.3226550
Published Online: December 1, 1989
View Article titled, Designing Electronic Products to Withstand the Distribution Environment
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Topics: ASTM International, Cycles, Design, Electronic products, Packaging, Product design, Product testing, Shock (Mechanics), Storage