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Journal Articles

Joint Analysis and Reliability Test of Epoxy-Based Nano Silver Paste Under Different Pressure-Less Sintering Processes

Xinyue Wang, Zejun Zeng, Guoqi Zhang, Jing Zhang, Pan Liu

J. Electron. Packag. December 2022, 144(4): 041013.

Paper No: EP-21-1109

DOI: https://doi.org/10.1115/1.4053432

Published Online: February 1, 2022

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Topics: Epoxy resins, Pressure, Silver, Sintering, Temperature, Reliability, Shear strength, Epoxy adhesives, Shear (Mechanics)

Journal Articles

Effects of High-Temperature Storage on the Glass Transition Temperature of Epoxy Molding Compound

Ruifeng Li, Daoguo Yang, Ping Zhang, Fanfan Niu, Miao Cai, G. Q. Zhang

J. Electron. Packag. March 2021, 143(1): 011009.

Paper No: EP-18-1065

DOI: https://doi.org/10.1115/1.4047475

Published Online: June 26, 2020

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Topics: Epoxy resins, Glass transition, High temperature, Molding, Storage, Temperature, Epoxy adhesives

Journal Articles

Low-Dielectric Constant Nanoporous Epoxy for Electronic Packaging

Jisu Jiang, Landon Keller, Paul A. Kohl

J. Electron. Packag. March 2020, 142(1): 011006.

Paper No: EP-19-1031

DOI: https://doi.org/10.1115/1.4044626

Published Online: September 24, 2019

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Topics: Epoxy adhesives, Epoxy resins, Porosity

Includes: Supplementary data

Journal Articles

Warpage Characterization of Molded Wafer for Fan-Out Wafer-Level Packaging

Hsien-Chie Cheng, Yan-Cheng Liu

J. Electron. Packag. March 2020, 142(1): 011004.

Paper No: EP-19-1023

DOI: https://doi.org/10.1115/1.4044625

Published Online: September 19, 2019

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Topics: Semiconductor wafers, Shrinkage (Materials), Temperature, Warping, Molding, Manufacturing, Epoxy resins, Packaging, Epoxy adhesives

Journal Articles

Nanothermal Interface Materials: Technology Review and Recent Results

Avram Bar-Cohen, Kaiser Matin, Sreekant Narumanchi

J. Electron. Packag. December 2015, 137(4): 040803.

Paper No: EP-15-1063

DOI: https://doi.org/10.1115/1.4031602

Published Online: October 9, 2015

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Topics: Copper, Cycles, Electrical resistivity, Solders, Teams, Temperature, Testing, Thermal resistance, Bonding, Accelerated life testing

Journal Articles

Thermal-Structural Performance of Orthotropic Pin Fin in Electronics Cooling Applications

A. F. M. Arif, Syed M. Zubair, S. Pashah

J. Electron. Packag. December 2012, 134(4): 041005.

DOI: https://doi.org/10.1115/1.4007258

Published Online: October 30, 2012

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Topics: Composite materials, Computer cooling, Flow (Dynamics), Geometry, Heat, Heat sinks, Stress, Temperature, Thermal analysis, Epoxy adhesives

Journal Articles

An Experimental and Computational Study on Moisture Induced Epoxy Swelling in Non-hermetic Optoelectronic Packages

Sushma Madduri, William Infantolino, Bahgat.G Sammakia

J. Electron. Packag. March 2012, 134(1): 011007.

DOI: https://doi.org/10.1115/1.4005911

Published Online: March 19, 2012

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Topics: Epoxy adhesives, Epoxy resins, Temperature, Temperature effects, Stress analysis (Engineering)

Journal Articles

Accelerated Life Testing in Epoxy Packaged High Luminosity Light Emitting Diodes

Eduardo Nogueira, Manuel Vázquez, Carlos Algora

J. Electron. Packag. September 2011, 133(3): 034501.

DOI: https://doi.org/10.1115/1.4004659

Published Online: September 14, 2011

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Topics: Epoxy adhesives, Epoxy resins, Failure, Light-emitting diodes, Temperature, Circuits

Journal Articles

Oxidized Graphite Nanoplatelets as an Improved Filler for Thermally Conducting Epoxy-Matrix Composites

Xiaobo Sun, Aiping Yu, Palanisamy Ramesh, Elena Bekyarova, Mikhail E. Itkis, Robert C. Haddon

J. Electron. Packag. June 2011, 133(2): 020905.

DOI: https://doi.org/10.1115/1.4003988

Published Online: June 7, 2011

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Topics: Carbon nanotubes, Composite materials, Epoxy adhesives, Epoxy resins, Fillers (Materials), Graphite, Oxidation, Particle size, Polymers, Thermal conductivity

Journal Articles

The Effect of Thermal Contact Resistance at Porous-Solid Interfaces in Finned Metal Foam Heat Sinks

Christopher T. DeGroot, Derek Gateman, Anthony G. Straatman

J. Electron. Packag. December 2010, 132(4): 041007.

DOI: https://doi.org/10.1115/1.4002724

Published Online: November 24, 2010

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Topics: Contact resistance, Heat sinks, Heat transfer, Metal foams, Fluids, Fins, Aluminum, Convection, Heat conduction, Epoxy adhesives

Journal Articles

Reliability of High-Power Light Emitting Diode Attached With Different Thermal Interface Materials

Xin Li, Xu Chen, Guo-Quan Lu

J. Electron. Packag. September 2010, 132(3): 031011.

DOI: https://doi.org/10.1115/1.4002299

Published Online: September 30, 2010

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Topics: Bonding, Epoxy adhesives, Epoxy resins, Light-emitting diodes, Packaging, Reliability, Silver, Temperature, Tin, Heat

Journal Articles

Three-Dimensional Modeling of Mold Filling in Microchip Encapsulation Process With a Matrix-Array Arrangement

M. K. Abdullah, M. Z. Abdullah, M. A. Mujeebu, Horizon Gitano, Z. M. Ariff, R. Razali, K. A. Ahmad

J. Electron. Packag. March 2010, 132(1): 014502.

DOI: https://doi.org/10.1115/1.4000719

Published Online: March 4, 2010

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Topics: Cavities, Computer simulation, Epoxy adhesives, Epoxy resins, Finite difference methods, Flow (Dynamics), Integrated circuits, Molding, Pressure, Simulation

Journal Articles

Numerical Simulation of Thermal Conductivity of Particle Filled Epoxy Composites

Jun Zeng, Renli Fu, Simeon Agathopoulos, Shaodong Zhang, Xiufeng Song, Hong He

J. Electron. Packag. December 2009, 131(4): 041006.

DOI: https://doi.org/10.1115/1.4000210

Published Online: October 21, 2009

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Topics: Composite materials, Epoxy resins, Fillers (Materials), Particulate matter, Thermal conductivity, Epoxy adhesives, Finite element analysis

Journal Articles

Chip to System Levels Thermal Needs and Alternative Thermal Technologies for High Brightness LEDS

Mehmet Arik, Anant Setlur, Stanton Weaver, Deborah Haitko, James Petroski

J. Electron. Packag. September 2007, 129(3): 328–338.

DOI: https://doi.org/10.1115/1.2753958

Published Online: April 9, 2007

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Topics: Brightness (Photometry), Design, Heat, Light-emitting diodes, Phosphors, Silicones, Temperature, Thermal management, Temperature distribution, Packaging

Journal Articles

Stochastic Characterization and Models to Predict Performance Uncertainty in Photonic Packages

S. Radhakrishnan, G. Subbarayan, L. Nguyen, W. Mazotti

J. Electron. Packag. September 2007, 129(3): 229–235.

DOI: https://doi.org/10.1115/1.2753885

Published Online: October 22, 2006

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Topics: Epoxy adhesives, Epoxy resins, Uncertainty, Viscoelasticity, Temperature, Modeling, Lasers, Displacement

Journal Articles

PCR Microchip Array Based on Polymer Bonding Technique

Xiaomei Yu, Ting Li, Lin Hao, Dacheng Zhang

J. Electron. Packag. March 2005, 127(1): 38–42.

DOI: https://doi.org/10.1115/1.1849231

Published Online: March 21, 2005

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Topics: Bonding, DNA, Fluorescence, Integrated circuits, Packaging, Photoresists, Polymers, Epoxy adhesives, Epoxy resins, Silicon

Journal Articles

Various Adhesives for Flip Chips

Z. W. Zhong

J. Electron. Packag. March 2005, 127(1): 29–32.

DOI: https://doi.org/10.1115/1.1846064

Published Online: March 21, 2005

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Topics: Adhesives, Bonding, Flip-chip, Flip-chip devices, Reliability, Temperature, Epoxy adhesives, Epoxy resins, Manufacturing, Packaging

Journal Articles

A New Wafer Level Packaging Approach: Encapsulation, Metallization and Laser Structuring for Advanced System in Package Manufacturing

K.-F. Becker, T. Braun, A. Neumann, A. Ostmann, E. Coko, M. Koch, V. Bader, R. Aschenbrenner, H. Reichl

J. Electron. Packag. March 2005, 127(1): 1–6.

DOI: https://doi.org/10.1115/1.1846058

Published Online: March 21, 2005

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Topics: Lasers, Manufacturing, Packaging, Reliability, Semiconductor wafers, System-in-package, Flip-chip devices, Epoxy adhesives, Epoxy resins

Journal Articles

Optical Fiber Shifts and Shear Stains in V-Groove Arrays for Optical MEMS Packaging

Z. W. Zhong, S. C. Lim, A. Asundi

J. Electron. Packag. March 2005, 127(1): 25–28.

DOI: https://doi.org/10.1115/1.1846063

Published Online: March 21, 2005

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Topics: Epoxy adhesives, Fibers, Finite element analysis, Optical fiber, Shear (Mechanics), Silicon, Temperature, MEMS packaging, Epoxy resins

Journal Articles

Thermal Performance Optimization of Radio Frequency Packages for Wireless Communication

Victor Adrian Chiriac, Tien-Yu Tom Lee, Vern Hause

J. Electron. Packag. December 2004, 126(4): 429–434.

DOI: https://doi.org/10.1115/1.1827257

Published Online: January 24, 2005

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Topics: Heat, Junctions, Optimization, Solders, Temperature, Thermal conductivity, Thermal resistance, Epoxy adhesives, Epoxy resins, Numerical analysis

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Journal citation

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Supplemental Material

Joint Analysis and Reliability Test of Epoxy-Based Nano Silver Paste Under Different Pressure-Less Sintering Processes

Effects of High-Temperature Storage on the Glass Transition Temperature of Epoxy Molding Compound

Low-Dielectric Constant Nanoporous Epoxy for Electronic Packaging

Warpage Characterization of Molded Wafer for Fan-Out Wafer-Level Packaging

Nanothermal Interface Materials: Technology Review and Recent Results

Thermal-Structural Performance of Orthotropic Pin Fin in Electronics Cooling Applications

An Experimental and Computational Study on Moisture Induced Epoxy Swelling in Non-hermetic Optoelectronic Packages

Accelerated Life Testing in Epoxy Packaged High Luminosity Light Emitting Diodes

Oxidized Graphite Nanoplatelets as an Improved Filler for Thermally Conducting Epoxy-Matrix Composites

The Effect of Thermal Contact Resistance at Porous-Solid Interfaces in Finned Metal Foam Heat Sinks

Reliability of High-Power Light Emitting Diode Attached With Different Thermal Interface Materials

Three-Dimensional Modeling of Mold Filling in Microchip Encapsulation Process With a Matrix-Array Arrangement

Numerical Simulation of Thermal Conductivity of Particle Filled Epoxy Composites

Chip to System Levels Thermal Needs and Alternative Thermal Technologies for High Brightness LEDS

Stochastic Characterization and Models to Predict Performance Uncertainty in Photonic Packages

PCR Microchip Array Based on Polymer Bonding Technique

Various Adhesives for Flip Chips

A New Wafer Level Packaging Approach: Encapsulation, Metallization and Laser Structuring for Advanced System in Package Manufacturing

Optical Fiber Shifts and Shear Stains in V-Groove Arrays for Optical MEMS Packaging

Thermal Performance Optimization of Radio Frequency Packages for Wireless Communication

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