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Journal Articles

Development of a Thermal Metrology Standard for Evaluation of Cold Plate Thermal Resistance as a Performance Metric

Victor A. Martinez, Carol Caceres, Alfonso Ortega
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041118.
Paper No: EP-24-1040
https://doi.org/10.1115/1.4066101
Published Online: August 24, 2024
View Article titled, Development of a Thermal Metrology Standard for Evaluation of Cold Plate Thermal Resistance as a Performance Metric
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Topics: Temperature, Thermal resistance, Thermocouples, Coolants, Errors, Flow (Dynamics), Heat exchangers, Uncertainty
Journal Articles

Incorporating Tensile Stress Into Electromigration Life Prediction for Cu/SAC305/Cu Solder Joints

Whit Vinson, David Huitink
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2025, 147(1): 011007.
Paper No: EP-24-1056
https://doi.org/10.1115/1.4066014
Published Online: August 9, 2024
View Article titled, Incorporating Tensile Stress Into Electromigration Life Prediction for Cu/SAC305/Cu Solder Joints
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Topics: Current density, Electrodiffusion, Failure, Solder joints, Solders, Stress, Temperature, Tension, Testing, Electrons
Journal Articles

Forward Kinematics Analysis of High-Precision Optoelectronic Packaging Platform

Ziyang Wang, Haibo Zhou, Linjiao Xiao, Lian Duan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2024, 146(3): 031005.
Paper No: EP-23-1069
https://doi.org/10.1115/1.4064704
Published Online: February 28, 2024
View Article titled, Forward Kinematics Analysis of High-Precision Optoelectronic Packaging Platform
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Topics: Errors, Kinematics, Packaging, Particle swarm optimization, Artificial neural networks, Design, Particulate matter, Trajectories (Physics), Simulation, Displacement
Journal Articles

Interface Reliability Modeling of Coaxial Through Silicon Via Based on WOA-BP Neural Network

Liwen Zhang, Chen Yang, He Yang, Jinchan Wang, Jincan Zhang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2024, 146(3): 031003.
Paper No: EP-23-1065
https://doi.org/10.1115/1.4064522
Published Online: February 7, 2024
View Article titled, Interface Reliability Modeling of Coaxial Through Silicon Via Based on WOA-BP Neural Network
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Topics: Algorithms, Artificial neural networks, Errors, Fracture (Materials), Neural network models, Optimization algorithms, Reliability, Silicon, Finite element methods, Modeling
Journal Articles

The Discussion About the Identification of the Anand Model Parameters and Two Alternative Identification Methods

Yuqian Xu, Qiwen Zeng, Yuexing Wang, Mingyong Wu, Xiangyu Chen, Gang Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011205.
Paper No: EP-22-1001
https://doi.org/10.1115/1.4054821
Published Online: August 3, 2022
View Article titled, The Discussion About the Identification of the Anand Model Parameters and Two Alternative Identification Methods
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Topics: Algebra, Deformation, Differential equations, Genetic algorithms, Stress, Errors, Solders
Journal Articles

Electrothermal Analysis of System in Package for Aerospace Application

Hao-hang Su, Shuai Fu, Su-yuan Li, Jiang Bian
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011202.
Paper No: EP-22-1014
https://doi.org/10.1115/1.4054462
Published Online: July 7, 2022
View Article titled, Electrothermal Analysis of System in Package for Aerospace Application
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Topics: Aerospace industry, Design, Heat, Joules, Reliability, Simulation, System-in-package, Temperature, Vacuum, Errors
Journal Articles

Sensitivity Coefficient-Based Inverse Heat Conduction Method for Identifying Hot Spots in Electronics Packages: A Comparison of Grid-Refinement Methods

Patrick Krane, David Gonzalez Cuadrado, Francisco Lozano, Guillermo Paniagua, Amy Marconnet
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2022, 144(1): 011008.
Paper No: EP-20-1121
https://doi.org/10.1115/1.4050200
Published Online: August 6, 2021
View Article titled, Sensitivity Coefficient-Based Inverse Heat Conduction Method for Identifying Hot Spots in Electronics Packages: A Comparison of Grid-Refinement Methods
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Topics: Electronic packages, Heat, Temperature, Errors, Heat conduction
Journal Articles

Experimental and Computational Investigations of the Thermal Environment in a Small Operational Data Center for Potential Energy Efficiency Improvements

Ismail Turkmen, Cem Ahmet Mercan, Hamza Salih Erden
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031116.
Paper No: EP-20-1018
https://doi.org/10.1115/1.4047845
Published Online: August 5, 2020
View Article titled, Experimental and Computational Investigations of the Thermal Environment in a Small Operational Data Center for Potential Energy Efficiency Improvements
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Topics: Air flow, Computational fluid dynamics, Cooling, Data centers, Flow (Dynamics), Temperature, Tiles, Potential energy, Stress, Leakage
Journal Articles

Error Reduction in Infrared Thermography by Multiframe Super-Resolution

Aditya Chandramohan, Sara K. Lyons, Justin A. Weibel, Suresh V. Garimella
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041008.
Paper No: EP-18-1028
https://doi.org/10.1115/1.4041360
Published Online: October 1, 2018
View Article titled, Error Reduction in Infrared Thermography by Multiframe Super-Resolution
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Topics: Emissivity, Errors, Resolution (Optics), Temperature, Thermography, Uncertainty
Journal Articles

Design and Control of the IBM Power 775 Supercomputer Water Conditioning Unit

Michael J. Ellsworth, Jr., Randy J. Zoodsma, Frank Cascio, Eileen Behrendt
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2014, 136(4): 041009.
Paper No: EP-13-1124
https://doi.org/10.1115/1.4028119
Published Online: September 19, 2014
View Article titled, Design and Control of the IBM Power 775 Supercomputer Water Conditioning Unit
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Topics: Design, Flow (Dynamics), Pumps, Reservoirs, Sensors, Temperature, Water, Valves, Algorithms, Electronics
Journal Articles

A Stepped-Bar Apparatus for Thermal Resistance Measurements

Dakotah R. Thompson, Sameer R. Rao, Baratunde A. Cola
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2013, 135(4): 041002.
Paper No: EP-13-1019
https://doi.org/10.1115/1.4025116
Published Online: August 13, 2013
View Article titled, A Stepped-Bar Apparatus for Thermal Resistance Measurements
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Topics: Heat, Measurement uncertainty, Temperature, Thermal resistance, Thermocouples, Uncertainty, Thermal conductivity, Errors, Design, ASTM International
Journal Articles

Impact of Self-Assembly Process Errors on Thermoelectric Performance

Nathan B. Crane, Patrick McKnight
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2012, 134(3): 031001.
https://doi.org/10.1115/1.4006709
Published Online: July 18, 2012
View Article titled, Impact of Self-Assembly Process Errors on Thermoelectric Performance
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Topics: Errors, Manufacturing, Self-assembly, Thermal conductivity, Probability, Redundancy (Engineering), Simulation, Temperature, Junctions, Heat
Journal Articles

Modeling Simplification for Thermal Mechanical Analysis of High Density Chip-to-Substrate Connections

Ping Nicole An, Paul A. Kohl
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041004.
https://doi.org/10.1115/1.4005289
Published Online: December 9, 2011
View Article titled, Modeling Simplification for Thermal Mechanical Analysis of High Density Chip-to-Substrate Connections
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Topics: Boundary-value problems, Columns (Structural), Copper, Deformation, Density, Displacement, Errors, Finite element analysis, Finite element model, Modeling
Journal Articles

Simplified Thermal Model of a Stacked Ball Grid Array Package

Luigi P. M. Colombo, Alexey Petrushin, Davide Paleari
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021006.
https://doi.org/10.1115/1.4003991
Published Online: June 23, 2011
View Article titled, Simplified Thermal Model of a Stacked Ball Grid Array Package
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Topics: Ball-Grid-Array packages, Solders, Temperature, Thermal resistance, Ball-Grid-Array packaging, Heat, Errors, Boundary-value problems, Junctions
Journal Articles

Development of Delphi-Type Compact Thermal Models for Opto-Electronic Packages

Arun Prakash Raghupathy, John Janssen, Attila Aranyosi, Urmila Ghia, Karman Ghia, William Maltz
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2011, 133(1): 011003.
https://doi.org/10.1115/1.4003217
Published Online: March 3, 2011
View Article titled, Development of Delphi-Type Compact Thermal Models for Opto-Electronic Packages
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Topics: Boundary-value problems, Errors, Flow (Dynamics), Heat, Junctions, Natural convection, Temperature, Computational fluid dynamics, Optimization, Forced convection
Journal Articles

An Inverse Problem in Estimating the Volumetric Heat Generation for a Three-Dimensional Encapsulated Chip

Cheng-Hung Huang, Wei-Lun Chang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2010, 132(1): 011004.
https://doi.org/10.1115/1.4000720
Published Online: March 4, 2010
View Article titled, An Inverse Problem in Estimating the Volumetric Heat Generation for a Three-Dimensional Encapsulated Chip
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Topics: Heat, Inverse problems, Temperature, Heat conduction, Errors
Journal Articles

Reliability Modeling of Lead-Free Solder Joints in Wafer-Level Chip Scale Packages

Jie-Hua Zhao, Vikas Gupta, Alok Lohia, Darvin Edwards
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2010, 132(1): 011005.
https://doi.org/10.1115/1.4000754
Published Online: March 4, 2010
View Article titled, Reliability Modeling of Lead-Free Solder Joints in Wafer-Level Chip Scale Packages
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Topics: Constitutive equations, Creep, Density, Fatigue, Finite element methods, Hardening, Lead-free solders, Modeling, Reliability, Semiconductor wafers
Journal Articles

Design of a Static TIM Tester

V. Székely, E. Kollár, G. Somlay, P. G. Szabó, M. Rencz
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2010, 132(1): 011001.
https://doi.org/10.1115/1.4000715
Published Online: February 25, 2010
View Article titled, Design of a Static TIM Tester
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Topics: Design, Errors, Flow (Dynamics), Heat, Heat flux, Sensors, Temperature, Thermal resistance
Journal Articles

Flexible Profile Compact Thermal Models for Practical Geometries

Mohamed-Nabil Sabry
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 256–259.
https://doi.org/10.1115/1.2753908
Published Online: April 16, 2007
View Article titled, Flexible Profile Compact Thermal Models for Practical Geometries
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Topics: Boundary-value problems, Errors, Heat, Heat flux, Heating, Temperature, Temperature gradient, Integrated circuit packaging, Multi-chip modules, Reliability
Journal Articles

Smeared-Property Models for Shock-Impact Reliability of Area-Array Packages

Pradeep Lall, Dhananjay Panchagade, Yueli Liu, Wayne Johnson, Jeff Suhling
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 373–381.
https://doi.org/10.1115/1.2804085
Published Online: March 25, 2007
View Article titled, Smeared-Property Models for Shock-Impact Reliability of Area-Array Packages
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Topics: Ball-Grid-Array packaging, Displacement, Errors, Finite element model, Reliability, Shells, Shock (Mechanics), Transients (Dynamics), Dynamics (Mechanics), Modeling