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Journal Articles

Numerical and Parametric Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics

Wei Tong, Alireza Ganjali, Omidreza Ghaffari, Chady al Sayed, Luc Fréchette, Julien Sylvestre
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041011.
Paper No: EP-21-1119
https://doi.org/10.1115/1.4053310
Published Online: January 28, 2022
View Article titled, Numerical and Parametric Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics
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Topics: Boiling, Cooling, Heat, Heat transfer coefficients, Temperature, Critical heat flux, Temperature distribution, Flat heat pipes
Journal Articles

Boiling Enhanced Lidded Server Packages for Two-Phase Immersion Cooling Using Three-Dimensional Metal Printing and Metal Injection Molding Technologies

Jimmy Chuang, Jin Yang, David Shia, Y. L. Li
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041108.
Paper No: EP-21-1037
https://doi.org/10.1115/1.4052711
Published Online: November 2, 2021
View Article titled, Boiling Enhanced Lidded Server Packages for Two-Phase Immersion Cooling Using Three-Dimensional Metal Printing and Metal Injection Molding Technologies
Open the PDF for Boiling Enhanced Lidded Server Packages for Two-Phase Immersion Cooling Using Three-Dimensional Metal Printing and Metal Injection Molding Technologies in another window
Topics: Boiling, Cooling, Electronic packages, Injection molding, Metals, Printing, Additive manufacturing, Flat heat pipes, Manufacturing
Journal Articles

Experimental Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics

Omidreza Ghaffari, Wei Tong, Yaser Nabavi Larimi, Chady al Sayed, Alireza Ganjali, Jean-François Morissette, Francis Grenier, Simon Jasmin, Luc Fréchette, Julien Sylvestre
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041103.
Paper No: EP-21-1083
https://doi.org/10.1115/1.4051943
Published Online: August 27, 2021
View Article titled, Experimental Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics
Open the PDF for Experimental Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics in another window
Topics: Boiling, Cooling, Dielectric liquids, Heat, Temperature, Copper, Flat heat pipes, Pool boiling, Critical heat flux, Subcooling
Journal Articles

Additive Manufactured Impinging Coolant, Low Electromagnetic Interference, and Nonmetallic Heat Spreader: Design and Optimization

Reece Whitt, Skyler Hudson, David Huitink, Zhao Yuan, Asif Emon, Fang Luo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041004.
Paper No: EP-20-1034
https://doi.org/10.1115/1.4048493
Published Online: October 12, 2020
View Article titled, Additive Manufactured Impinging Coolant, Low Electromagnetic Interference, and Nonmetallic Heat Spreader: Design and Optimization
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Topics: Additive manufacturing, Coolants, Cooling, Design, Electromagnetic interference, Flat heat pipes, Flow (Dynamics), Fluids, Heat, Heat transfer
Journal Articles

Development and Application of a Thin Flat Heat Pipe Design Optimization Tool for Small Satellite Systems

Steven A. Isaacs, Caelan Lapointe, Peter E. Hamlington
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2021, 143(1): 011010.
Paper No: EP-19-1130
https://doi.org/10.1115/1.4047576
Published Online: July 10, 2020
View Article titled, Development and Application of a Thin Flat Heat Pipe Design Optimization Tool for Small Satellite Systems
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Topics: Design, Heat pipes, Optimization, Vapors, Flat heat pipes, Temperature, Condensers (steam plant), Computational fluid dynamics, Heat, Satellites
Journal Articles

Thermal Performance of a Light Emitting Diode Light Engine for a Multipurpose Automotive Exterior Lighting System With Competing Board Technologies

Umut Zeynep Uras, Mehmet Arık, Enes Tamdoğan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2017, 139(2): 020907.
Paper No: EP-16-1139
https://doi.org/10.1115/1.4036403
Published Online: June 12, 2017
View Article titled, Thermal Performance of a Light Emitting Diode Light Engine for a Multipurpose Automotive Exterior Lighting System With Competing Board Technologies
Open the PDF for Thermal Performance of a Light Emitting Diode Light Engine for a Multipurpose Automotive Exterior Lighting System With Competing Board Technologies in another window
Topics: Engines, Light-emitting diodes, Temperature, Lumber, Flat heat pipes, Electronics, Thermal conductivity, Temperature distribution, Vapors
Journal Articles

A Method for Thermal Performance Characterization of Ultrathin Vapor Chambers Cooled by Natural Convection

Gaurav Patankar, Simone Mancin, Justin A. Weibel, Suresh V. Garimella, Mark A. MacDonald
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 010903.
Paper No: EP-15-1083
https://doi.org/10.1115/1.4032345
Published Online: March 10, 2016
View Article titled, A Method for Thermal Performance Characterization of Ultrathin Vapor Chambers Cooled by Natural Convection
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Topics: Calibration, Condensers (steam plant), Copper, Flat heat pipes, Heat, Heat losses, Natural convection, Temperature, Thermal resistance, Vapors
Journal Articles

Two-Phase Thermal Ground Planes: Technology Development and Parametric Results

Avram Bar-Cohen, Kaiser Matin, Nicholas Jankowski, Darin Sharar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. March 2015, 137(1): 010801.
Paper No: EP-14-1069
https://doi.org/10.1115/1.4028890
Published Online: November 14, 2014
View Article titled, Two-Phase Thermal Ground Planes: Technology Development and Parametric Results
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Topics: Cooling, Copper, Flat heat pipes, Fluids, Heat, Heat pipes, Silicon, Stress, Teams, Thermal conductivity
Journal Articles

A New Analytical Approach for Dynamic Modeling of Passive Multicomponent Cooling Systems

A. Gholami, M. Ahmadi, M. Bahrami
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2014, 136(3): 031010.
Paper No: EP-14-1011
https://doi.org/10.1115/1.4027509
Published Online: May 12, 2014
View Article titled, A New Analytical Approach for Dynamic Modeling of Passive Multicomponent Cooling Systems
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Topics: Cooling systems, Flat heat pipes, Heat, Heat pipes, Heat sinks, Network models, Temperature, Thermal resistance, Dynamic testing (Materials), Transients (Dynamics)
Journal Articles

3D Compact Model of Packaged Thermoelectric Coolers

Owen Sullivan, Borislav Alexandrov, Saibal Mukhopadhyay, Satish Kumar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2013, 135(3): 031006.
Paper No: EP-13-1006
https://doi.org/10.1115/1.4024653
Published Online: June 24, 2013
View Article titled, 3D Compact Model of Packaged Thermoelectric Coolers
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Topics: Thermoelectric coolers, Cooling, Electronic packages, Steady state, Flat heat pipes
Journal Articles

Heat Transfer of an IGBT Module Integrated With a Vapor Chamber

Xiaoling Yu, Lianghua Zhang, Enming Zhou, Quanke Feng
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2011, 133(1): 011008.
https://doi.org/10.1115/1.4003214
Published Online: March 10, 2011
View Article titled, Heat Transfer of an IGBT Module Integrated With a Vapor Chamber
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Topics: Circuits, Copper, Heat, Heat transfer, Junctions, Stress, Temperature, Thermal conductivity, Thermal resistance, Transients (Dynamics)
Journal Articles

Investigations of the Thermal Spreading Effects of Rectangular Conduction Plates and Vapor Chamber

Yen-Shu Chen, Kuo-Hsiang Chien, Chi-Chuan Wang, Tzu-Chen Hung, Yuh-Ming Ferng, Bau-Shei Pei
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 348–355.
https://doi.org/10.1115/1.2753970
Published Online: December 19, 2006
View Article titled, Investigations of the Thermal Spreading Effects of Rectangular Conduction Plates and Vapor Chamber
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Topics: Heat, Heat conduction, Plates (structures), Temperature, Temperature distribution, Thermal resistance, Vapors, Heat transfer, Flat heat pipes, Computer simulation
Journal Articles

Numerical Investigation of Thermal Dissipation on Quad Flat Package With Unattached Heat Spreader

Tong Hong Wang, Yi-Shao Lai
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2007, 129(3): 366–370.
https://doi.org/10.1115/1.2753988
Published Online: September 12, 2006
View Article titled, Numerical Investigation of Thermal Dissipation on Quad Flat Package With Unattached Heat Spreader
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Topics: Convection, Density, Energy dissipation, Flat heat pipes, Heat transfer, Temperature
Journal Articles

Micron and Submicron-Scale Characterization of Interfaces in Thermal Interface Material Systems

Arun Gowda, David Esler, Sandeep Tonapi, Annita Zhong, K. Srihari, Florian Schattenmann
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2006, 128(2): 130–136.
https://doi.org/10.1115/1.2188952
Published Online: February 14, 2006
View Article titled, Micron and Submicron-Scale Characterization of Interfaces in Thermal Interface Material Systems
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Topics: Acoustics, Adhesives, Aluminum, Computerized tomography, Contact resistance, Fillers (Materials), Magnification, Microscopy, Scanning electron microscopy, Silicon
Journal Articles

Thermal Behavior of Nominally Flat Silicon-Based Heat Spreaders

Ta-Wei Lin, Ming-Chang Wu, Cheng-Hsien Peng, Po-Li Chen, Ying-Huei Hung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 370–379.
https://doi.org/10.1115/1.2351902
Published Online: December 24, 2005
View Article titled, Thermal Behavior of Nominally Flat Silicon-Based Heat Spreaders
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Topics: Flat heat pipes, Silicon, Surface roughness, Thermal resistance, Natural convection, Heat transfer, Heat
Journal Articles

Models of Steady Heat Conduction in Multiple Cylindrical Domains

Anand Desai, James Geer, Bahgat Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2006, 128(1): 10–17.
https://doi.org/10.1115/1.2159003
Published Online: May 18, 2005
View Article titled, Models of Steady Heat Conduction in Multiple Cylindrical Domains
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Topics: Boundary-value problems, Geometry, Heat, Heat conduction, Heat flux, Heat sinks, Integrated circuits, Temperature, Thermal conductivity, Thermal management
Journal Articles

Evaluation of Thermal Enhancements to Flip-Chip-Plastic Ball Grid Array Packages

K. Ramakrishna, Fellow ASME,, T.-Y. Tom Lee, Mem. ASME,
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 449–456.
https://doi.org/10.1115/1.1827260
Published Online: January 24, 2005
View Article titled, Evaluation of Thermal Enhancements to Flip-Chip-Plastic Ball Grid Array Packages
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Topics: Flat heat pipes, Forced convection, Mixed convection, Natural convection, Printed circuit boards, Thermal conductivity, Thermal resistance, Heat transfer, Copper, Junctions
Journal Articles

Thermal Model of a Thinned-Die Cooling System

N. Boiadjieva, P. Koev
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 435–439.
https://doi.org/10.1115/1.1826079
Published Online: January 24, 2005
View Article titled, Thermal Model of a Thinned-Die Cooling System
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Topics: Air flow, Cooling systems, Flat heat pipes, Flow (Dynamics), Heat exchangers, Temperature, Cooling, Heat, Silicon
Journal Articles

On the Thermal Performance Characteristics of Three-Dimensional Multichip Modules

Wen-Hwa Chen, ASME Fellow, Professor, Hsien-Chie Cheng, ASME Member, Associate Professor, Chih-Han Lin, Graduate Student
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 374–383.
https://doi.org/10.1115/1.1773198
Published Online: October 6, 2004
View Article titled, On the Thermal Performance Characteristics of Three-Dimensional Multichip Modules
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Topics: Design, Finite element analysis, Finite element model, Heat, Heat conduction, Junctions, Manufacturing, Modeling, Multi-chip modules, Natural convection
Journal Articles

Thermal Interfacing Techniques for Electronic Equipment—A Perspective

Wataru Nakayama, Arthur E. Bergles
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2003, 125(2): 192–199.
https://doi.org/10.1115/1.1568127
Published Online: June 10, 2003
View Article titled, Thermal Interfacing Techniques for Electronic Equipment—A Perspective
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Topics: Contact resistance, Cooling, Electrical conductance, Electronic equipment, Flat heat pipes, Flow (Dynamics), Heat, Heat conduction, Heat sinks, Heat transfer