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Journal Articles

Analytical Multi-Parametric Design Optimization for the Miniaturization of Flip-Chip Package

Fei Chong Ng, Mohamad Aizat Abas

J. Electron. Packag. December 2022, 144(4): 041009.

Paper No: EP-21-1137

DOI: https://doi.org/10.1115/1.4052920

Published Online: December 1, 2021

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Topics: Design, Flip-chip packages, Flow (Dynamics), Optimization, Fluids, Computer simulation

Journal Articles

A Surface Energy Approach to Developing an Analytical Model for the Underfill Flow Process in Flip-Chip Packaging

Xingjun Yao, Weijie Jiang, Jiahui Yang, Junjie Fang, Wenjun Zhang

J. Electron. Packag. December 2022, 144(4): 041003.

Paper No: EP-20-1094

DOI: https://doi.org/10.1115/1.4052275

Published Online: November 22, 2021

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Topics: Computational fluid dynamics, Flip-chip, Flip-chip packages, Flow (Dynamics), Simulation, Solders, Surface energy, Uncertainty, Shapes, Packaging

Journal Articles

Effect of Warpage of Flip Chip Packages Due to the Underfill Encapsulating Process on Interconnect Reliability

Satoru Katsurayama, Hironori Tohmyoh

J. Electron. Packag. September 2009, 131(3): 031005.

DOI: https://doi.org/10.1115/1.3144153

Published Online: June 23, 2009

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Topics: Flip-chip packages, Hardening (Curing), Manufacturing, Reliability, Temperature, Warping, Flow (Dynamics), Flip-chip devices

Journal Articles

Underfill Filler Settling Effect on the Die Backside Interfacial Stresses of Flip Chip Packages

Cheng-fu Chen, Pramod C. Karulkar

J. Electron. Packag. September 2008, 130(3): 031005.

DOI: https://doi.org/10.1115/1.2957324

Published Online: July 30, 2008

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Topics: Fillers (Materials), Stress, Particulate matter, Flip-chip packages, Flip-chip devices

Journal Articles

A Theoretical Analysis of the Concept of Critical Clearance Toward a Design Methodology for the Flip-Chip Package

J. W. Wan, W. J. Zhang, D. J. Bergstrom

J. Electron. Packag. December 2007, 129(4): 473–478.

DOI: https://doi.org/10.1115/1.2804098

Published Online: March 13, 2007

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Topics: Clearances (Engineering), Flip-chip packages, Solders, Design

Journal Articles

Mechanical Reliability and Bump Degradation of ACF Flip Chip Packages Using BCB (Cyclotene™) Bumping Dielectrics Under Temperature Cycling

Woon-Seong Kwon, Hyoung-Joon Kim, Kyung-Wook Paik, Se-Young Jang, Soon-Min Hong

J. Electron. Packag. June 2004, 126(2): 202–207.

DOI: https://doi.org/10.1115/1.1756143

Published Online: July 8, 2004

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Topics: Adhesion, Aluminum, Cycles, Damage, Delamination, Dielectric materials, Displacement, Flip-chip packages, Fracture (Materials), Fracture (Process)

Journal Articles

Analysis of Interfacial Cracking in Flip Chip Packages With Viscoplastic Solder Deformation

M. J. Heffes, H. F. Nied

J. Electron. Packag. March 2004, 126(1): 135–141.

DOI: https://doi.org/10.1115/1.1649242

Published Online: April 30, 2004

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Topics: Deformation, Flip-chip, Flip-chip devices, Fracture (Materials), Solders, Stress, Fracture (Process), Flip-chip packages

Journal Articles

Quantitative Mechanism of Significant Benefits of Underfill in Flip-Chip Assemblies

Xia Cai, Liu Chen, Qun Zhang, Bulu Xu, Weidong Huang, Xiaoming Xie, Zhaonian Cheng

J. Electron. Packag. March 2003, 125(1): 84–92.

DOI: https://doi.org/10.1115/1.1533802

Published Online: March 14, 2003

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Topics: Finite element analysis, Flip-chip assemblies, Simulation, Solder joints, Solders, Stress, Deformation, Cycles, Flip-chip packages, Thermal expansion

Journal Articles

Measurement of Thermal Deformation of Interconnect Layers Using SIEM

Sheng Chang and, Fu-Pen Chiang, Yifan Guo

J. Electron. Packag. September 2002, 124(3): 310–313.

DOI: https://doi.org/10.1115/1.1481367

Published Online: July 26, 2002

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Topics: Deformation, Dielectric materials, Displacement, Electron microscopy, Interferometry, Packaging, Reliability, Resolution (Optics), Thermal deformation, Thermal expansion

Journal Articles

Process Modeling and Thermal/Mechanical Behavior of ACA/ACF Type Flip-Chip Packages

K. N. Chiang, Associate Professor, C. W. Chang, Graduate Student, C. T. Lin, Graduate Student

J. Electron. Packag. December 2001, 123(4): 331–337.

DOI: https://doi.org/10.1115/1.1389847

Published Online: May 10, 2001

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Topics: Adhesives, Finite element analysis, Flip-chip devices, Manufacturing, Modeling, Particulate matter, Pressure, Springs, Mechanical behavior, Flip-chip packages

Journal Articles

Finite Element Analysis of Stress Singularities in Attached Flip Chip Packages

A. Q. Xu, H. F. Nied

J. Electron. Packag. December 2000, 122(4): 301–305.

DOI: https://doi.org/10.1115/1.1289768

Published Online: December 1, 2000

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Topics: Corners (Structural elements), Delamination, Epoxy adhesives, Epoxy resins, Finite element analysis, Fracture (Materials), Silicon, Stress, Stress singularity, Geometry

Journal Articles

Interfacial Delamination Near Solder Bumps and UBM in Flip-Chip Packages

Yu Gu, Toshio Nakamura, Mem. ASME, William T. Chen, Brian Cotterell

J. Electron. Packag. September 2001, 123(3): 295–301.

DOI: https://doi.org/10.1115/1.1348338

Published Online: August 1, 2000

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Topics: Delamination, Fracture (Materials), Solders, Stress, Fracture (Process), Flip-chip packages, Finite element analysis

Journal Articles

Micro-Mechanical Deformation Analysis of Surface Laminar Circuit in Organic Flip-Chip Package: An Experimental Study

B. Han, Mem. ASME, P. Kunthong

J. Electron. Packag. December 2000, 122(4): 294–300.

DOI: https://doi.org/10.1115/1.1290000

Published Online: May 15, 2000

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Topics: Circuits, Deformation, Displacement, Flip-chip devices, Flip-chip packages, Interferometry, Flip-chip assemblies, Metals, Shear deformation, Reliability

Journal Articles

Thermal and Mechanical Loading Effects on the Reliability of Organic Flip Chip Package

Teck Joo Goh

J. Electron. Packag. March 2001, 123(1): 83–87.

DOI: https://doi.org/10.1115/1.1289999

Published Online: April 10, 2000

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Topics: Design, Finite element analysis, Finite element model, Flip-chip, Flip-chip devices, Flip-chip packages, Heat sinks, Reliability, Stress, Silicon

Journal Articles

An Optical Method for Measuring the Two-Dimensional Surface Curvatures of Electronic Packages During Thermal Cycling

Yong Du, Jie-Hua Zhao, Paul Ho

J. Electron. Packag. September 2001, 123(3): 196–199.

DOI: https://doi.org/10.1115/1.1347987

Published Online: March 21, 2000

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Topics: Electronic packages, Finite element analysis, Laser beams, Temperature, Flip-chip packages, Warping, Thermal expansion, Deformation, Lasers, Packaging

Journal Articles

Three-Dimensional Versus Two-Dimensional Finite Element Modeling of Flip-Chip Packages

Q. Yao, J. Qu

J. Electron. Packag. September 1999, 121(3): 196–201.

DOI: https://doi.org/10.1115/1.2792684

Published Online: September 1, 1999

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Topics: Finite element analysis, Flip-chip packages, Modeling, Deflection, Flip-chip assemblies, Printed circuit boards, Stress, Design, Multi-chip modules, Size effect

Journal Articles

Reliability of Underfill-Encapsulated Flip-Chips With Heat Spreaders

H. Doi, K. Kawano, A. Yasukawa, T. Sato

J. Electron. Packag. December 1998, 120(4): 322–327.

DOI: https://doi.org/10.1115/1.2792641

Published Online: December 1, 1998

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Topics: Flat heat pipes, Flip-chip devices, Reliability, Solder joints, Delamination, Failure mechanisms, Fatigue life, Flip-chip packages, Mechanical properties, Shapes

Journal Articles

Potential Failure Sites in a Flip-Chip Package With and Without Underfill

E. Madenci, S. Shkarayev, R. Mahajan

J. Electron. Packag. December 1998, 120(4): 336–341.

DOI: https://doi.org/10.1115/1.2792643

Published Online: December 1, 1998

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Topics: Failure, Flip-chip packages, Stress, Density, Finite element analysis

Journal Articles

Process Induced Stresses of a Flip-Chip Packaging by Sequential Processing Modeling Technique

J. Wang, Z. Qian, S. Liu

J. Electron. Packag. September 1998, 120(3): 309–313.

DOI: https://doi.org/10.1115/1.2792638

Published Online: September 1, 1998

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Topics: Flip-chip, Modeling, Packaging, Stress, Manufacturing, Deflection, Finite element analysis, Warping, Alloys, Bonding

Journal Articles

Creep Behavior of a Flip-Chip Package by Both FEM Modeling and Real Time Moire´ Interferometry

J. Wang, Z. Qian, D. Zou, S. Liu

J. Electron. Packag. June 1998, 120(2): 179–185.

DOI: https://doi.org/10.1115/1.2792617

Published Online: June 1, 1998

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Topics: Creep, Finite element methods, Flip-chip packages, Interferometry, Modeling, Deformation, Displacement, Solders, Stress, Finite element analysis

Journal citation

NARROW

Analytical Multi-Parametric Design Optimization for the Miniaturization of Flip-Chip Package

A Surface Energy Approach to Developing an Analytical Model for the Underfill Flow Process in Flip-Chip Packaging

Effect of Warpage of Flip Chip Packages Due to the Underfill Encapsulating Process on Interconnect Reliability

Underfill Filler Settling Effect on the Die Backside Interfacial Stresses of Flip Chip Packages

A Theoretical Analysis of the Concept of Critical Clearance Toward a Design Methodology for the Flip-Chip Package

Mechanical Reliability and Bump Degradation of ACF Flip Chip Packages Using BCB (Cyclotene™) Bumping Dielectrics Under Temperature Cycling

Analysis of Interfacial Cracking in Flip Chip Packages With Viscoplastic Solder Deformation

Quantitative Mechanism of Significant Benefits of Underfill in Flip-Chip Assemblies

Measurement of Thermal Deformation of Interconnect Layers Using SIEM

Process Modeling and Thermal/Mechanical Behavior of ACA/ACF Type Flip-Chip Packages

Finite Element Analysis of Stress Singularities in Attached Flip Chip Packages

Interfacial Delamination Near Solder Bumps and UBM in Flip-Chip Packages

Micro-Mechanical Deformation Analysis of Surface Laminar Circuit in Organic Flip-Chip Package: An Experimental Study

Thermal and Mechanical Loading Effects on the Reliability of Organic Flip Chip Package

An Optical Method for Measuring the Two-Dimensional Surface Curvatures of Electronic Packages During Thermal Cycling

Three-Dimensional Versus Two-Dimensional Finite Element Modeling of Flip-Chip Packages

Reliability of Underfill-Encapsulated Flip-Chips With Heat Spreaders

Potential Failure Sites in a Flip-Chip Package With and Without Underfill

Process Induced Stresses of a Flip-Chip Packaging by Sequential Processing Modeling Technique

Creep Behavior of a Flip-Chip Package by Both FEM Modeling and Real Time Moire´ Interferometry

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