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Journal Articles

Experimental Characterization of Two-Phase Cooling of Power Electronics in Thermosiphon and Forced Convection Modes

Fabio Battaglia, Farah Singer, David C. Deisenroth, Michael M. Ohadi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2021, 143(3): 031006.
Paper No: EP-19-1118
https://doi.org/10.1115/1.4049564
Published Online: February 19, 2021
View Article titled, Experimental Characterization of Two-Phase Cooling of Power Electronics in Thermosiphon and Forced Convection Modes
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Topics: Cooling, Flow (Dynamics), Heat, Heat flux, Microchannels, Pumps, Refrigerants, Temperature, Electronics, Flux (Metallurgy)
Journal Articles

Interfacial Behavior of Flux Residues and Its Impact on Copper/Underfill Adhesion in Microelectronic Packaging

John S. Andre, Nathan Ulrich, Karen Ji, Zhan Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2021, 143(1): 011004.
Paper No: EP-19-1095
https://doi.org/10.1115/1.4047338
Published Online: June 4, 2020
View Article titled, Interfacial Behavior of Flux Residues and Its Impact on Copper/Underfill Adhesion in Microelectronic Packaging
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Topics: Adhesion, Copper, Flux (Metallurgy), Shear (Mechanics)
Journal Articles

Evaporative Wicking Phenomena on Nanotextured Surfaces

Duong Vy Le, Quang N. Pham, Jonggyu Lee, Shiwei Zhang, Yoonjin Won
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031013.
Paper No: EP-18-1104
https://doi.org/10.1115/1.4044373
Published Online: September 19, 2019
View Article titled, Evaporative Wicking Phenomena on Nanotextured Surfaces
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Topics: Copper, Evaporation, Flux (Metallurgy), Heat, Heat flux, Permeability
Journal Articles

Heat Transfer Characteristics and Flow Pattern Visualization for Flow Boiling in a Vertical Narrow Microchannel

Kan Zhou, Hua Zhu, Wei Li, Junye Li, Kuang Sheng, Shuai Shao, Haiwang Li, Zhi Tao
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031006.
Paper No: EP-18-1092
https://doi.org/10.1115/1.4043476
Published Online: May 17, 2019
View Article titled, Heat Transfer Characteristics and Flow Pattern Visualization for Flow Boiling in a Vertical Narrow Microchannel
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Topics: Boiling, Flow (Dynamics), Heat transfer, Microchannels, Subcooling, Temperature, Heat flux, Bubbles, Nucleate boiling, Flux (Metallurgy)
Journal Articles

Embedded Two-Phase Cooling of High Flux Electronics Via Press-Fit and Bonded FEEDS Coolers

Raphael K. Mandel, Daniel G. Bae, Michael M. Ohadi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031003.
Paper No: EP-17-1081
https://doi.org/10.1115/1.4039264
Published Online: May 11, 2018
View Article titled, Embedded Two-Phase Cooling of High Flux Electronics Via Press-Fit and Bonded FEEDS Coolers
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Topics: Coolers, Cooling, Electronics, Flow (Dynamics), Fluids, Flux (Metallurgy), Heat, Heat flux, Manifolds, Microchannels
Journal Articles

Hotspot Thermal Management With Flow Boiling of Refrigerant in Ultrasmall Microgaps

Mohamed H. Nasr, Craig E. Green, Peter A. Kottke, Xuchen Zhang, Thomas E. Sarvey, Yogendra K. Joshi, Muhannad S. Bakir, Andrei G. Fedorov
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2017, 139(1): 011006.
Paper No: EP-16-1097
https://doi.org/10.1115/1.4035387
Published Online: January 5, 2017
View Article titled, Hotspot Thermal Management With Flow Boiling of Refrigerant in Ultrasmall Microgaps
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Topics: Boiling, Flow (Dynamics), Flux (Metallurgy), Heat, Thermal resistance, Heat flux, Wall temperature, Coolants, Pressure drop, Thermal management
Journal Articles

Thermal Modeling of Extreme Heat Flux Microchannel Coolers for GaN-on-SiC Semiconductor Devices

Hyoungsoon Lee, Damena D. Agonafer, Yoonjin Won, Farzad Houshmand, Catherine Gorle, Mehdi Asheghi, Kenneth E. Goodson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 010907.
Paper No: EP-15-1104
https://doi.org/10.1115/1.4032655
Published Online: March 10, 2016
View Article titled, Thermal Modeling of Extreme Heat Flux Microchannel Coolers for GaN-on-SiC Semiconductor Devices
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Topics: Boiling, Computational fluid dynamics, Flow (Dynamics), Flux (Metallurgy), Gallium nitride, Heat conduction, Heat transfer coefficients, Microchannels, Microcoolers, Simulation
Journal Articles

A Review of Two-Phase Forced Cooling in Three-Dimensional Stacked Electronics: Technology Integration

Craig Green, Peter Kottke, Xuefei Han, Casey Woodrum, Thomas Sarvey, Pouya Asrar, Xuchen Zhang, Yogendra Joshi, Andrei Fedorov, Suresh Sitaraman, Muhannad Bakir
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. December 2015, 137(4): 040802.
Paper No: EP-15-1068
https://doi.org/10.1115/1.4031481
Published Online: September 25, 2015
View Article titled, A Review of Two-Phase Forced Cooling in Three-Dimensional Stacked Electronics: Technology Integration
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Topics: Coolants, Cooling, Design, Flow (Dynamics), Fluids, Heat sinks, Heat, Flux (Metallurgy), Temperature, Pressure
Journal Articles

Effect of Meniscus Recession on the Effective Pore Radius and Capillary Pumping of Copper Metal Foams

Mahmood R. S. Shirazy, Luc G. Fréchette
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2014, 136(4): 041003.
Paper No: EP-13-1098
https://doi.org/10.1115/1.4026353
Published Online: September 19, 2014
View Article titled, Effect of Meniscus Recession on the Effective Pore Radius and Capillary Pumping of Copper Metal Foams
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Topics: Containers, Copper, Evaporation, Flux (Metallurgy), Foams (Chemistry), Heat, Heat losses, Porosity, Temperature, Ethanol
Journal Articles

Boiling Heat Transfer and Flow Regimes in Microchannels—A Comprehensive Understanding

Tannaz Harirchian, Suresh V. Garimella
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2011, 133(1): 011001.
https://doi.org/10.1115/1.4002721
Published Online: March 2, 2011
View Article titled, Boiling Heat Transfer and Flow Regimes in Microchannels—A Comprehensive Understanding
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Topics: Boiling, Flow (Dynamics), Heat transfer, Heat transfer coefficients, Microchannels, Vapors, Pressure drop, Heat flux, Heat, Flux (Metallurgy)
Journal Articles

Fluid-to-Fluid Spot-to-Spreader (F2/S2) Hybrid Heat Sink for Integrated Chip-Level and Hot Spot-Level Thermal Management

Craig Green, Andrei G. Fedorov, Yogendra K. Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Design Innovations
J. Electron. Packag. June 2009, 131(2): 025002.
https://doi.org/10.1115/1.3104029
Published Online: April 3, 2009
View Article titled, Fluid-to-Fluid Spot-to-Spreader (F2/S2) Hybrid Heat Sink for Integrated Chip-Level and Hot Spot-Level Thermal Management
Open the PDF for Fluid-to-Fluid Spot-to-Spreader (F2/S2) Hybrid Heat Sink for Integrated Chip-Level and Hot Spot-Level Thermal Management in another window
Topics: Coolants, Cooling, Design, Fluids, Heat, Heat sinks, Flow (Dynamics), Heat flux, Stress, Flux (Metallurgy)
Journal Articles

Effects of Dissolved Air on Subcooled Flow Boiling of a Dielectric Coolant in a Microchannel Heat Sink

Tailian Chen, Suresh V. Garimella
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 398–404.
https://doi.org/10.1115/1.2351905
Published Online: February 1, 2006
View Article titled, Effects of Dissolved Air on Subcooled Flow Boiling of a Dielectric Coolant in a Microchannel Heat Sink
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Topics: Boiling, Bubbles, Flow (Dynamics), Heat sinks, Heat transfer, Microchannels, Pressure drop, Temperature, Wall temperature, Flow instability
Journal Articles

Determination of Temperatures and Heat Fluxes on Surfaces and Interfaces of Multidomain Three-Dimensional Electronic Components

Brian H. Dennis, Zhen-xue Han, George S. Dulikravich
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 457–464.
https://doi.org/10.1115/1.1827261
Published Online: January 24, 2005
View Article titled, Determination of Temperatures and Heat Fluxes on Surfaces and Interfaces of Multidomain Three-Dimensional Electronic Components
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Topics: Ball-Grid-Array packaging, Boundary-value problems, Errors, Flux (Metallurgy), Heat, Heat conduction, Temperature, Temperature distribution, Finite element analysis, Finite element methods
Journal Articles

Thermobuoyancy Treatment for Electronic Packaging Using an Improved Advection Scheme

Masoud Darbandi, Assistant Professor,, Gerry E. Schneider, Professor,
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2003, 125(2): 244–250.
https://doi.org/10.1115/1.1569508
Published Online: June 10, 2003
View Article titled, Thermobuoyancy Treatment for Electronic Packaging Using an Improved Advection Scheme
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Topics: Approximation, Buoyancy, Cavities, Electronic packaging, Flow (Dynamics), Fluid dynamics, Heat transfer, Modeling, Natural convection, Rayleigh number
Journal Articles

Integrated Thermal Analysis of Natural Convection Air Cooled Electronic Enclosure

L. Tang, Y. K. Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1999, 121(2): 108–115.
https://doi.org/10.1115/1.2792664
Published Online: June 1, 1999
View Article titled, Integrated Thermal Analysis of Natural Convection Air Cooled Electronic Enclosure
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Topics: Natural convection, Thermal analysis, Boundary-value problems, Computational fluid dynamics, Temperature, Ceramics, Electronic components, Electronic systems, Flux (Metallurgy), Heat
Journal Articles

Steady-State Investigation of Vapor Deposited Micro Heat Pipe Arrays

A. K. Mallik, G. P. Peterson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1995, 117(1): 75–81.
https://doi.org/10.1115/1.2792070
Published Online: March 1, 1995
View Article titled, Steady-State Investigation of Vapor Deposited Micro Heat Pipe Arrays
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Topics: Heat pipes, Steady state, Vapors, Semiconductor wafers, Temperature, Temperature distribution, Temperature gradient, Thermal conductivity, Computer simulation, Flux (Metallurgy)
Journal Articles

Two-Phase Electronic Cooling Using Mini-Channel and Micro-Channel Heat Sinks: Part 2—Flow Rate and Pressure Drop Constraints

M. B. Bowers, I. Mudawar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1994, 116(4): 298–305.
https://doi.org/10.1115/1.2905701
Published Online: December 1, 1994
View Article titled, Two-Phase Electronic Cooling Using Mini-Channel and Micro-Channel Heat Sinks: Part 2—Flow Rate and Pressure Drop Constraints
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Topics: Computer cooling, Flow (Dynamics), Heat sinks, Microchannels, Pressure drop, Geometry, Compressibility, Energy dissipation, Heat, Boiling
Journal Articles

Heat Transfer in Wire Bonding Process

M. A. Jog, I. M. Cohen, P. S. Ayyaswamy
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1994, 116(1): 44–48.
https://doi.org/10.1115/1.2905492
Published Online: March 1, 1994
View Article titled, Heat Transfer in Wire Bonding Process
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Topics: Heat transfer, Wire bonding, Electrodes, Wire, Electric discharge, Electric fields, Electric potential, Engineering simulation, Flux (Metallurgy), Heat
Journal Articles

An Integral Heat Sink for Cooling Microelectronic Components

S. H. Bhavnani, C.-P. Tsai, R. C. Jaeger, D. L. Eison
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1993, 115(3): 284–291.
https://doi.org/10.1115/1.2909330
Published Online: September 1, 1993
View Article titled, An Integral Heat Sink for Cooling Microelectronic Components
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Topics: Cooling, Heat sinks, Boiling, Heat, Silicon, Cavities, Atmospheric pressure, Etching, Flux (Metallurgy), Heat transfer
Journal Articles

Optimization of Enhanced Surfaces for High Flux Chip Cooling by Pool Boiling

I. Mudawar, T. M. Anderson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1993, 115(1): 89–100.
https://doi.org/10.1115/1.2909306
Published Online: March 1, 1993
View Article titled, Optimization of Enhanced Surfaces for High Flux Chip Cooling by Pool Boiling
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Topics: Cooling, Optimization, Pool boiling, Boiling, Boundary-value problems, Flux (Metallurgy), Heat, Metal surfaces, Nucleate boiling, Subcooling