Search Results | J. Electron. Packag. | ASME Digital Collection

1-20 of 151

2 3 4 5

Sort by

Sort Order Select

Journal Articles

Fracture Behavior and Reliability of Low-Silver Lead-Free Solder Joints

Ved Prakash Sharma, Naresh Varma Datla

J. Electron. Packag. December 2022, 144(4): 041016.

Paper No: EP-21-1159

DOI: https://doi.org/10.1115/1.4054096

Published Online: March 31, 2022

View Article

Topics: Fracture (Materials), Fracture (Process), Intermetallic compounds, Solder joints, Solders, Tin, Reliability, Fractography, Lead-free solders, Failure

Journal Articles

Optimized Design of Various Ag Decorated Sn-xAg-Cu 0.7 Solder Bump on Cycling Fatigue Reliability for Wafer-Level Chip Scale Packaging

H. T. Lee, C. Y. Ho, C. C. Lee

J. Electron. Packag. December 2022, 144(4): 041001.

Paper No: EP-21-1043

DOI: https://doi.org/10.1115/1.4052075

Published Online: October 6, 2021

View Article

Topics: Fatigue, Solders, Tin, Displacement, Fracture (Materials), Intermetallic compounds, Packaging, Reliability, Temperature

Journal Articles

Application of Alumina-Based Ceramic Paste for High-Temperature Electronics Packaging

Ardalan Nasiri, Simon Ang

J. Electron. Packag. June 2021, 143(2): 020902.

Paper No: EP-20-1060

DOI: https://doi.org/10.1115/1.4049292

Published Online: February 22, 2021

View Article

Topics: Bonding, Ceramics, Electronic packaging, Hardening (Curing), High temperature, Shear strength, Temperature, Fracture (Materials), Fourier transform infrared spectroscopy, Aluminum

Journal Articles

Effect of Cu Foam and Ag-Coated Layer on the Microstructure and Mechanical Behavior of Nano-Ag Sintered Joint

Yang Liu, Zhao Li, Min Zhou, Xianghua Zeng, Fenglian Sun

J. Electron. Packag. September 2021, 143(3): 031002.

Paper No: EP-20-1047

DOI: https://doi.org/10.1115/1.4049128

Published Online: January 19, 2021

View Article

Topics: Bonding, Coating processes, Coatings, Composite materials, Mechanical behavior, Shear (Mechanics), Shear strength, Sintering, Fracture (Materials), Deformation

Journal Articles

A Review on United States Patents to Prevent Mechanical Failures in Foldable Smartphones

Ali Nematollahisarvestani, Yung-Cheng “Y. C.” Lee

J. Electron. Packag. June 2021, 143(2): 020802.

Paper No: EP-20-1043

DOI: https://doi.org/10.1115/1.4048011

Published Online: September 3, 2020

View Article

Topics: Buckling, Deformation, Delamination, Failure, Fracture (Materials), Fracture (Process), Patents, Stress, Coatings

Journal Articles

Review of Methodologies for Structural Integrity Evaluation of Power Modules

Noriyuki Miyazaki, Nobuyuki Shishido, Yutaka Hayama

J. Electron. Packag. June 2021, 143(2): 020801.

Paper No: EP-20-1074

DOI: https://doi.org/10.1115/1.4048038

Published Online: August 27, 2020

View Article

Topics: Cracking (Materials), Creep, Cycles, Density, Failure, Fatigue, Fracture (Materials), Fracture (Process), Temperature, Wire

Journal Articles

Lifetime Model for the Fatigue Fracture in Cu/Al 2 O 3 /Cu Composites: Experimental Validation of a Substantial Lifetime Enhancement by Cu Step Etching

Patrick Gaiser, Markus Klingler, Jürgen Wilde

J. Electron. Packag. June 2020, 142(2): 021011.

Paper No: EP-19-1060

DOI: https://doi.org/10.1115/1.4046619

Published Online: April 6, 2020

View Article

Topics: Fracture (Materials), Simulation, Cycles

Journal Articles

Examination of Consistent Application of Interfacial Fracture Energy Versus Mode-Mixity Curve for Delamination Prediction

David Samet, V. N. N. Trilochan Rambhatla, Suresh K. Sitaraman

J. Electron. Packag. June 2020, 142(2): 021001.

Paper No: EP-19-1032

DOI: https://doi.org/10.1115/1.4045706

Published Online: February 3, 2020

View Article

Topics: Failure, Fracture (Materials), Fracture (Process), Delamination, Cantilevers

Journal Articles

A State-of-the-Art Review of Fatigue Life Prediction Models for Solder Joint

Sinan Su, Francy John Akkara, Ravinder Thaper, Atif Alkhazali, Mohammad Hamasha, Sa'd Hamasha

J. Electron. Packag. December 2019, 141(4): 040802.

Paper No: EP-18-1117

DOI: https://doi.org/10.1115/1.4043405

Published Online: May 17, 2019

View Article

Topics: Creep, Cycles, Damage, Failure, Fatigue, Fatigue life, Solder joints, Stress, Fracture (Materials), Solders

Journal Articles

Reactive Joining of Thermally and Mechanically Sensitive Materials

Bastian Rheingans, Roman Furrer, Jürg Neuenschwander, Irina Spies, Axel Schumacher, Stephan Knappmann, Lars P. H. Jeurgens, Jolanta Janczak-Rusch

J. Electron. Packag. December 2018, 140(4): 041006.

Paper No: EP-18-1016

DOI: https://doi.org/10.1115/1.4040978

Published Online: September 10, 2018

View Article

Topics: Borosilicate glasses, Joining, Solders, Soldering, Tin, Aluminum, Heat, Temperature, Glass, Thermal shock

Journal Articles

Interfacial Compounds Characteristic and Its Reliability Effects on SAC305 Microjoints in Flip Chip Assemblies

Ye Tian, Ning Ren, Xiaoxia Jian, Tie Geng, Yiping Wu

J. Electron. Packag. September 2018, 140(3): 031007.

Paper No: EP-18-1009

DOI: https://doi.org/10.1115/1.4040298

Published Online: June 11, 2018

View Article

Topics: Flip-chip assemblies, Reliability, Soldering, Tin, Solders, Finite element analysis, Fracture (Materials), Intermetallic compounds

Journal Articles

Determination of Energy Release Rate Through Sequential Crack Extension

Scott McCann, Gregory T. Ostrowicki, Anh Tran, Timothy Huang, Tobias Bernhard, Rao R. Tummala, Suresh K. Sitaraman

J. Electron. Packag. December 2017, 139(4): 041003.

Paper No: EP-17-1033

DOI: https://doi.org/10.1115/1.4037334

Published Online: August 25, 2017

View Article

Topics: Fracture (Materials), Thin films, Copper

Journal Articles

Characterization of Bulk and Thin Film Fracture in Electronic Packaging

Vijay Subramanian, Kyle Yazzie, Tsgereda Alazar, Bharat Penmecha, Pilin Liu, Yiqun Bai, Pramod Malatkar

J. Electron. Packag. June 2017, 139(2): 020912.

Paper No: EP-17-1010

DOI: https://doi.org/10.1115/1.4036661

Published Online: June 12, 2017

View Article

Topics: Failure, Fracture (Materials), Fracture toughness, Solder masks, Stress, Thin films, Membranes, Fracture (Process), Electronic packaging, Testing

Journal Articles

Temperature-Dependent Dwell-Fatigue Behavior of Nanosilver Sintered Lap Shear Joint

Yansong Tan, Xin Li, Yunhui Mei, Gang Chen, Xu Chen

J. Electron. Packag. June 2016, 138(2): 021001.

Paper No: EP-15-1109

DOI: https://doi.org/10.1115/1.4032880

Published Online: March 23, 2016

View Article

Topics: Fatigue, Fracture (Materials), Shear (Mechanics), Shear stress, Temperature, Creep, Fracture (Process), Fatigue life, Cycles

Journal Articles

Reliability Assessment of Wafer Level Packages With Novel FeNi Under Bump Metallization

Jia Xi, Xinduo Zhai, Jun Wang, Donglun Yang, Mao Ru, Fei Xiao, Li Zhang, Chi Ming Lai

J. Electron. Packag. September 2015, 137(3): 031016.

Paper No: EP-15-1016

DOI: https://doi.org/10.1115/1.4030974

Published Online: July 21, 2015

View Article

Topics: Ferronickel, Finite element analysis, Reliability, Semiconductor wafers, Solders, Temperature, Fracture (Materials), Failure mechanisms, Alloys, Stress

Journal Articles

Damage Evolution in Lead Free Solder Joints in Isothermal Fatigue

Awni Qasaimeh, Sa’d Hamasha, Younis Jaradat, Peter Borgesen

J. Electron. Packag. June 2015, 137(2): 021012.

Paper No: EP-14-1077

DOI: https://doi.org/10.1115/1.4029441

Published Online: June 1, 2015

View Article

Topics: Cycles, Damage, Displacement, Fatigue, Fracture (Materials), Lead-free solders, Solders, Stiffness, Stress, Temperature

Journal Articles

UCPD Model for Pb-Free Solder

Michael K. Neilsen, Paul T. Vianco

J. Electron. Packag. December 2014, 136(4): 041006.

Paper No: EP-13-1101

DOI: https://doi.org/10.1115/1.4026851

Published Online: September 19, 2014

View Article

Topics: Cycles, Damage, Fracture (Materials), Lead-free solders, Solder joints, Solders, Failure, Fatigue, Simulation

Journal Articles

The Strength of High-Temperature Ag–In Joints Produced Between Copper by Fluxless Low-Temperature Processes

Yuan-Yun Wu, Chin C. Lee

J. Electron. Packag. March 2014, 136(1): 011006.

Paper No: EP-13-1063

DOI: https://doi.org/10.1115/1.4026171

Published Online: January 8, 2014

View Article

Topics: Alloys, Bonding, Copper, Design, High temperature, Low temperature, Shear (Mechanics), Silver, Solid solutions, Temperature

Journal Articles

Reliability Assessment of Preloaded Solder Joint Under Thermal Cycling

Da Yu, Hohyung Lee, Seungbae Park

J. Electron. Packag. December 2012, 134(4): 041008.

DOI: https://doi.org/10.1115/1.4007674

Published Online: November 16, 2012

View Article

Topics: Cycles, Failure, Fracture (Materials), Reliability, Solder joints, Failure mechanisms, Stress, Failure analysis

Journal Articles

Monitoring Fatigue Cracking in Interconnects in a Ball Grid Array by Measuring Electrical Resistance

B. Fiedler, M. Fine, K. Kao, L. Keer

J. Electron. Packag. September 2012, 134(3): 031006.

DOI: https://doi.org/10.1115/1.4006708

Published Online: July 18, 2012

View Article

Topics: Ball-Grid-Array packaging, Electrical resistance, Fracture (Materials), Shear (Mechanics), Stress, Cycles, Fatigue cracks, Failure, Fatigue, Shear stress

2 3 4 5

Journal citation

NARROW

Fracture Behavior and Reliability of Low-Silver Lead-Free Solder Joints

Optimized Design of Various Ag Decorated Sn-xAg-Cu 0.7 Solder Bump on Cycling Fatigue Reliability for Wafer-Level Chip Scale Packaging

Application of Alumina-Based Ceramic Paste for High-Temperature Electronics Packaging

Effect of Cu Foam and Ag-Coated Layer on the Microstructure and Mechanical Behavior of Nano-Ag Sintered Joint

A Review on United States Patents to Prevent Mechanical Failures in Foldable Smartphones

Review of Methodologies for Structural Integrity Evaluation of Power Modules

Lifetime Model for the Fatigue Fracture in Cu/Al 2 O 3 /Cu Composites: Experimental Validation of a Substantial Lifetime Enhancement by Cu Step Etching

Examination of Consistent Application of Interfacial Fracture Energy Versus Mode-Mixity Curve for Delamination Prediction

A State-of-the-Art Review of Fatigue Life Prediction Models for Solder Joint

Reactive Joining of Thermally and Mechanically Sensitive Materials

Interfacial Compounds Characteristic and Its Reliability Effects on SAC305 Microjoints in Flip Chip Assemblies

Determination of Energy Release Rate Through Sequential Crack Extension

Characterization of Bulk and Thin Film Fracture in Electronic Packaging

Temperature-Dependent Dwell-Fatigue Behavior of Nanosilver Sintered Lap Shear Joint

Reliability Assessment of Wafer Level Packages With Novel FeNi Under Bump Metallization

Damage Evolution in Lead Free Solder Joints in Isothermal Fatigue

UCPD Model for Pb-Free Solder

The Strength of High-Temperature Ag–In Joints Produced Between Copper by Fluxless Low-Temperature Processes

Reliability Assessment of Preloaded Solder Joint Under Thermal Cycling

Monitoring Fatigue Cracking in Interconnects in a Ball Grid Array by Measuring Electrical Resistance

Journals

Conference Proceedings

eBooks

Resources

Opportunities

Journals

Conference Proceedings

eBooks

Resources

Opportunities

This Feature Is Available To Subscribers Only