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Journal Articles

Interfacial Fracture Caused by Electromigration at Copper Interconnects

Yuexing Wang, Bofeng Li, Yao Zhifeng, Yao Yao
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2024, 146(1): 011007.
Paper No: EP-23-1034
https://doi.org/10.1115/1.4062828
Published Online: July 14, 2023
View Article titled, Interfacial Fracture Caused by Electromigration at Copper Interconnects
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Topics: Copper, Electrodiffusion, Fracture (Materials), Fracture (Process), Stress, Fracture toughness, Dislocations, Anodes
Journal Articles

Fracture Behavior and Reliability of Low-Silver Lead-Free Solder Joints

Ved Prakash Sharma, Naresh Varma Datla
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041016.
Paper No: EP-21-1159
https://doi.org/10.1115/1.4054096
Published Online: March 31, 2022
View Article titled, Fracture Behavior and Reliability of Low-Silver Lead-Free Solder Joints
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Topics: Fracture (Materials), Fracture (Process), Intermetallic compounds, Solder joints, Solders, Tin, Reliability, Fractography, Lead-free solders, Failure
Journal Articles

Optimized Design of Various Ag Decorated Sn-xAg-Cu 0.7 Solder Bump on Cycling Fatigue Reliability for Wafer-Level Chip Scale Packaging

H. T. Lee, C. Y. Ho, C. C. Lee
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041001.
Paper No: EP-21-1043
https://doi.org/10.1115/1.4052075
Published Online: October 6, 2021
View Article titled, Optimized Design of Various Ag Decorated Sn-xAg-Cu 0.7 Solder Bump on Cycling Fatigue Reliability for Wafer-Level Chip Scale Packaging
Open the PDF for Optimized Design of Various Ag Decorated Sn-xAg-Cu 0.7 Solder Bump on Cycling Fatigue Reliability for Wafer-Level Chip Scale Packaging in another window
Topics: Fatigue, Solders, Tin, Displacement, Fracture (Materials), Intermetallic compounds, Packaging, Reliability, Temperature
Journal Articles

Application of Alumina-Based Ceramic Paste for High-Temperature Electronics Packaging

Ardalan Nasiri, Simon Ang
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2021, 143(2): 020902.
Paper No: EP-20-1060
https://doi.org/10.1115/1.4049292
Published Online: February 22, 2021
View Article titled, Application of Alumina-Based Ceramic Paste for High-Temperature Electronics Packaging
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Topics: Bonding, Ceramics, Electronic packaging, Hardening (Curing), High temperature, Shear strength, Temperature, Fracture (Materials), Fourier transform infrared spectroscopy, Aluminum
Journal Articles

Effect of Cu Foam and Ag-Coated Layer on the Microstructure and Mechanical Behavior of Nano-Ag Sintered Joint

Yang Liu, Zhao Li, Min Zhou, Xianghua Zeng, Fenglian Sun
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2021, 143(3): 031002.
Paper No: EP-20-1047
https://doi.org/10.1115/1.4049128
Published Online: January 19, 2021
View Article titled, Effect of Cu Foam and Ag-Coated Layer on the Microstructure and Mechanical Behavior of Nano-Ag Sintered Joint
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Topics: Bonding, Coating processes, Coatings, Composite materials, Mechanical behavior, Shear (Mechanics), Shear strength, Sintering, Fracture (Materials), Deformation
Journal Articles

A Review on United States Patents to Prevent Mechanical Failures in Foldable Smartphones

Ali Nematollahisarvestani, Yung-Cheng “Y. C.” Lee
Journal: Journal of Electronic Packaging
Article Type: Review Articles
J. Electron. Packag. June 2021, 143(2): 020802.
Paper No: EP-20-1043
https://doi.org/10.1115/1.4048011
Published Online: September 3, 2020
View Article titled, A Review on United States Patents to Prevent Mechanical Failures in Foldable Smartphones
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Topics: Buckling, Deformation, Delamination, Failure, Fracture (Materials), Fracture (Process), Patents, Stress, Coatings
Journal Articles

Review of Methodologies for Structural Integrity Evaluation of Power Modules

Noriyuki Miyazaki, Nobuyuki Shishido, Yutaka Hayama
Journal: Journal of Electronic Packaging
Article Type: Review Articles
J. Electron. Packag. June 2021, 143(2): 020801.
Paper No: EP-20-1074
https://doi.org/10.1115/1.4048038
Published Online: August 27, 2020
View Article titled, Review of Methodologies for Structural Integrity Evaluation of Power Modules
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Topics: Cracking (Materials), Creep, Cycles, Density, Failure, Fatigue, Fracture (Materials), Fracture (Process), Temperature, Wire
Journal Articles

Lifetime Model for the Fatigue Fracture in Cu/Al 2 O 3 /Cu Composites: Experimental Validation of a Substantial Lifetime Enhancement by Cu Step Etching

Patrick Gaiser, Markus Klingler, Jürgen Wilde
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2020, 142(2): 021011.
Paper No: EP-19-1060
https://doi.org/10.1115/1.4046619
Published Online: April 6, 2020
View Article titled, Lifetime Model for the Fatigue Fracture in Cu/Al 2 O 3 /Cu Composites: Experimental Validation of a Substantial Lifetime Enhancement by Cu Step Etching
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Topics: Fracture (Materials), Simulation, Cycles
Journal Articles

Examination of Consistent Application of Interfacial Fracture Energy Versus Mode-Mixity Curve for Delamination Prediction

David Samet, V. N. N. Trilochan Rambhatla, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2020, 142(2): 021001.
Paper No: EP-19-1032
https://doi.org/10.1115/1.4045706
Published Online: February 3, 2020
View Article titled, Examination of Consistent Application of Interfacial Fracture Energy Versus Mode-Mixity Curve for Delamination Prediction
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Topics: Failure, Fracture (Materials), Fracture (Process), Delamination, Cantilevers
Journal Articles

A State-of-the-Art Review of Fatigue Life Prediction Models for Solder Joint

Sinan Su, Francy John Akkara, Ravinder Thaper, Atif Alkhazali, Mohammad Hamasha, Sa'd Hamasha
Journal: Journal of Electronic Packaging
Article Type: Review Articles
J. Electron. Packag. December 2019, 141(4): 040802.
Paper No: EP-18-1117
https://doi.org/10.1115/1.4043405
Published Online: May 17, 2019
View Article titled, A State-of-the-Art Review of Fatigue Life Prediction Models for Solder Joint
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Topics: Creep, Cycles, Damage, Failure, Fatigue, Fatigue life, Solder joints, Stress, Fracture (Materials), Solders
Journal Articles

Reactive Joining of Thermally and Mechanically Sensitive Materials

Bastian Rheingans, Roman Furrer, Jürg Neuenschwander, Irina Spies, Axel Schumacher, Stephan Knappmann, Lars P. H. Jeurgens, Jolanta Janczak-Rusch
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041006.
Paper No: EP-18-1016
https://doi.org/10.1115/1.4040978
Published Online: September 10, 2018
View Article titled, Reactive Joining of Thermally and Mechanically Sensitive Materials
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Topics: Borosilicate glasses, Joining, Solders, Soldering, Tin, Aluminum, Heat, Temperature, Glass, Thermal shock
Journal Articles

Interfacial Compounds Characteristic and Its Reliability Effects on SAC305 Microjoints in Flip Chip Assemblies

Ye Tian, Ning Ren, Xiaoxia Jian, Tie Geng, Yiping Wu
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031007.
Paper No: EP-18-1009
https://doi.org/10.1115/1.4040298
Published Online: June 11, 2018
View Article titled, Interfacial Compounds Characteristic and Its Reliability Effects on SAC305 Microjoints in Flip Chip Assemblies
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Topics: Flip-chip assemblies, Reliability, Soldering, Tin, Solders, Finite element analysis, Fracture (Materials), Intermetallic compounds
Journal Articles

Determination of Energy Release Rate Through Sequential Crack Extension

Scott McCann, Gregory T. Ostrowicki, Anh Tran, Timothy Huang, Tobias Bernhard, Rao R. Tummala, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2017, 139(4): 041003.
Paper No: EP-17-1033
https://doi.org/10.1115/1.4037334
Published Online: August 25, 2017
View Article titled, Determination of Energy Release Rate Through Sequential Crack Extension
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Topics: Fracture (Materials), Thin films, Copper
Journal Articles

Characterization of Bulk and Thin Film Fracture in Electronic Packaging

Vijay Subramanian, Kyle Yazzie, Tsgereda Alazar, Bharat Penmecha, Pilin Liu, Yiqun Bai, Pramod Malatkar
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2017, 139(2): 020912.
Paper No: EP-17-1010
https://doi.org/10.1115/1.4036661
Published Online: June 12, 2017
View Article titled, Characterization of Bulk and Thin Film Fracture in Electronic Packaging
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Topics: Failure, Fracture (Materials), Fracture toughness, Solder masks, Stress, Thin films, Membranes, Fracture (Process), Electronic packaging, Testing
Journal Articles

Temperature-Dependent Dwell-Fatigue Behavior of Nanosilver Sintered Lap Shear Joint

Yansong Tan, Xin Li, Yunhui Mei, Gang Chen, Xu Chen
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2016, 138(2): 021001.
Paper No: EP-15-1109
https://doi.org/10.1115/1.4032880
Published Online: March 23, 2016
View Article titled, Temperature-Dependent Dwell-Fatigue Behavior of Nanosilver Sintered Lap Shear Joint
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Topics: Fatigue, Fracture (Materials), Shear (Mechanics), Shear stress, Temperature, Creep, Fracture (Process), Fatigue life, Cycles
Journal Articles

Reliability Assessment of Wafer Level Packages With Novel FeNi Under Bump Metallization

Jia Xi, Xinduo Zhai, Jun Wang, Donglun Yang, Mao Ru, Fei Xiao, Li Zhang, Chi Ming Lai
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2015, 137(3): 031016.
Paper No: EP-15-1016
https://doi.org/10.1115/1.4030974
Published Online: July 21, 2015
View Article titled, Reliability Assessment of Wafer Level Packages With Novel FeNi Under Bump Metallization
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Topics: Ferronickel, Finite element analysis, Reliability, Semiconductor wafers, Solders, Temperature, Fracture (Materials), Failure mechanisms, Alloys, Stress
Journal Articles

Damage Evolution in Lead Free Solder Joints in Isothermal Fatigue

Awni Qasaimeh, Sa’d Hamasha, Younis Jaradat, Peter Borgesen
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2015, 137(2): 021012.
Paper No: EP-14-1077
https://doi.org/10.1115/1.4029441
Published Online: June 1, 2015
View Article titled, Damage Evolution in Lead Free Solder Joints in Isothermal Fatigue
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Topics: Cycles, Damage, Displacement, Fatigue, Fracture (Materials), Lead-free solders, Solders, Stiffness, Stress, Temperature
Journal Articles

UCPD Model for Pb-Free Solder

Michael K. Neilsen, Paul T. Vianco
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2014, 136(4): 041006.
Paper No: EP-13-1101
https://doi.org/10.1115/1.4026851
Published Online: September 19, 2014
View Article titled, UCPD Model for Pb-Free Solder
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Topics: Cycles, Damage, Fracture (Materials), Lead-free solders, Solder joints, Solders, Failure, Fatigue, Simulation
Journal Articles

The Strength of High-Temperature Ag–In Joints Produced Between Copper by Fluxless Low-Temperature Processes

Yuan-Yun Wu, Chin C. Lee
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2014, 136(1): 011006.
Paper No: EP-13-1063
https://doi.org/10.1115/1.4026171
Published Online: January 8, 2014
View Article titled, The Strength of High-Temperature Ag–In Joints Produced Between Copper by Fluxless Low-Temperature Processes
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Topics: Alloys, Bonding, Copper, Design, High temperature, Low temperature, Shear (Mechanics), Silver, Solid solutions, Temperature
Journal Articles

Reliability Assessment of Preloaded Solder Joint Under Thermal Cycling

Da Yu, Hohyung Lee, Seungbae Park
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2012, 134(4): 041008.
https://doi.org/10.1115/1.4007674
Published Online: November 16, 2012
View Article titled, Reliability Assessment of Preloaded Solder Joint Under Thermal Cycling
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Topics: Cycles, Failure, Fracture (Materials), Reliability, Solder joints, Failure mechanisms, Stress, Failure analysis