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Journal Articles

Design and Fabrication of Leadless Package Structure for Pressure Sensors

Junwang Tian, Zhong Jin, Xin Tang, Wenxian Peng, Junfu Liu, Yunpeng Liu, Taotao Chen, Jinqing Xiao, Junhui Li

J. Electron. Packag. December 2022, 144(4): 041005.

Paper No: EP-21-1036

DOI: https://doi.org/10.1115/1.4052246

Published Online: November 22, 2021

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Topics: Design, Glass, Manufacturing, Pressure, Pressure sensors, Silver, Thermal stresses, Bonding, Stress, Temperature

Journal Articles

Vandal Glass Heat Distribution and the Effect of Glass Gap Adjustments in Outdoor Digital Display Components

Jeho Kim, J. Michael Brown, Yogendra Joshi, Kevin O'Connor, Marcos Diaz, Zhuomin Zhang, Peiyan Yang

J. Electron. Packag. September 2020, 142(3): 031120.

Paper No: EP-19-1127

DOI: https://doi.org/10.1115/1.4046933

Published Online: May 4, 2020

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Topics: Glass, Heat, Manufacturing, Solar energy, Solar radiation, Temperature, Testing, Simulation, Liquid crystals, Computational fluid dynamics

Journal Articles

Evaluation of Bending Strength of Window Glass Substrate With Considerations of Uni- and Bi-Axial Loading and Free Edge Stresses

M. Y. Tsai, H. J. Chen, J. H. Yeh

J. Electron. Packag. December 2019, 141(4): 041007.

Paper No: EP-19-1034

DOI: https://doi.org/10.1115/1.4044961

Published Online: October 18, 2019

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Topics: Bending strength, Boundary-value problems, Displacement, Glass, Stress, Failure mechanisms, Surface roughness

Journal Articles

Reactive Joining of Thermally and Mechanically Sensitive Materials

Bastian Rheingans, Roman Furrer, Jürg Neuenschwander, Irina Spies, Axel Schumacher, Stephan Knappmann, Lars P. H. Jeurgens, Jolanta Janczak-Rusch

J. Electron. Packag. December 2018, 140(4): 041006.

Paper No: EP-18-1016

DOI: https://doi.org/10.1115/1.4040978

Published Online: September 10, 2018

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Topics: Borosilicate glasses, Joining, Solders, Soldering, Tin, Aluminum, Heat, Temperature, Glass, Thermal shock

Journal Articles

Assessment of Elastic–Plastic and Electrical Properties of Printed Silver-Based Interconnects for Flexible Electronics

Hsien-Chie Cheng, Ruei-You Hong, Wen-Hwa Chen

J. Electron. Packag. December 2018, 140(4): 041007.

Paper No: EP-18-1041

DOI: https://doi.org/10.1115/1.4041014

Published Online: September 10, 2018

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Topics: Dimensional analysis, Electrical properties, Finite element analysis, Flexible electronics, Inks, Modeling, Plasticity, Silver, Simulation, Stress

Journal Articles

Ultraminiaturized Three-Dimensional IPAC Packages With 100 μ m Thick Glass Substrates for Radio Frequency Front-End Modules

Zihan Wu, Junki Min, Vanessa Smet, Markondeya Raj Pulugurtha, Venky Sundaram, Rao R. Tummala

J. Electron. Packag. December 2017, 139(4): 041001.

Paper No: EP-16-1151

DOI: https://doi.org/10.1115/1.4037221

Published Online: July 27, 2017

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Topics: Glass, Manufacturing, Filters

Journal Articles

Accurate Predetermination of the Process Parameters for Glass/Glass Laser Bonding Based on the Temperature Distribution Analysis

Yanyi Xiao, Wen Wang, Jianhua Zhang

J. Electron. Packag. June 2016, 138(2): 021006.

Paper No: EP-15-1051

DOI: https://doi.org/10.1115/1.4033106

Published Online: April 15, 2016

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Topics: Bonding, Glass, Lasers, Temperature, Temperature distribution, Fittings, Sealing (Process)

Journal Articles

Theoretical Analysis and Experimental Quantification of the Gas Leakage Due to Electrical Feedthroughs in Anodic Bonding

Qimin Liu, Lidong Du, Zhan Zhao, Cheng Liu, Zhen Fang

J. Electron. Packag. September 2014, 136(3): 031015.

Paper No: EP-13-1050

DOI: https://doi.org/10.1115/1.4028013

Published Online: July 24, 2014

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Topics: Bonding, Design, Glass, Leakage, Microchannels, Silicon, Cavities, Theoretical analysis, Pressure sensors, Temperature

Journal Articles

Effects of the Thermocompression Bonding on the Microstructure and Contact Resistance for the Ultrafine Pitch Chip-on-Glass Packaging With Nonconductive Film

Jianhua Zhang, Jinsong Zhang, Lianqiao Yang

J. Electron. Packag. December 2010, 132(4): 044501.

DOI: https://doi.org/10.1115/1.4002898

Published Online: December 3, 2010

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Topics: Bonding, Contact resistance, Packaging, Tin, Temperature, Pressure, Glass, High temperature, Melting point

Journal Articles

Three-Dimensional Measurements of Photo-curing Process With Photo-curable Resin for UV-Nanoimprint by Micro-digital-Holographic-PTV

Shin-ichi Satake, Gaku Sorimachi, Takahiro Kanai, Jun Taniguchi, Noriyuki Unno

J. Electron. Packag. September 2010, 132(3): 031003.

DOI: https://doi.org/10.1115/1.4001854

Published Online: September 9, 2010

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Topics: Hardening (Curing), Particulate matter, Resins, Ultraviolet radiation, Glass, Holography, Temperature, Displacement, Microchannels

Journal Articles

Fabrication of Miniature CMOS Image Sensor Using Novel Glass Cover Chip Packaging Technique

Chuen-Ching Wang, Yao-Ting Ye, Jing-Fung Lin

J. Electron. Packag. December 2009, 131(4): 041009.

DOI: https://doi.org/10.1115/1.4000363

Published Online: November 12, 2009

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Topics: Adhesives, Complementary metal oxide semiconductors, Energy dissipation, Glass, Packaging, Sensors, Taguchi methods, Temperature, Bonding, Heat

Journal Articles

Simulation study on the influences of the bonding parameters on the warpage of chip-on-glass module with nonconductive film

Jianhua Zhang, Fang Yuan, Jinsong Zhang

J. Electron. Packag. December 2009, 131(4): 041008.

DOI: https://doi.org/10.1115/1.4000361

Published Online: October 29, 2009

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Topics: Bonding, Warping, Glass, Temperature

Journal Articles

Thermal Stresses Due to Laser Welding in Bridge-Wire Initiators

Michael R. Maughan, Robert R. Stephens, Donald M. Blackketter, Karl K. Rink

J. Electron. Packag. March 2009, 131(1): 011009.

DOI: https://doi.org/10.1115/1.3068318

Published Online: February 13, 2009

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Topics: Finite element analysis, Glass, Press fits, Shear stress, Stress, Thermal stresses, Welding, Wire, Bridges (Structures), Laser welding

Journal Articles

Thermal Induced Stresses in Bridge-Wire Initiator Glass-to-Metal Seals

Luke M. Thompson, Michael R. Maughan, Karl K. Rink, Donald M. Blackketter, Robert R. Stephens

J. Electron. Packag. September 2007, 129(3): 300–306.

DOI: https://doi.org/10.1115/1.2753920

Published Online: November 29, 2006

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Topics: Finite element analysis, Glass, Stress, Wire, Manufacturing, Bridges (Structures), Cooling, Temperature

Journal Articles

PCR Microchip Array Based on Polymer Bonding Technique

Xiaomei Yu, Ting Li, Lin Hao, Dacheng Zhang

J. Electron. Packag. March 2005, 127(1): 38–42.

DOI: https://doi.org/10.1115/1.1849231

Published Online: March 21, 2005

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Topics: Bonding, DNA, Fluorescence, Integrated circuits, Packaging, Photoresists, Polymers, Epoxy adhesives, Epoxy resins, Silicon

Journal Articles

Effects of Wafer Cleaning and Annealing on Glass/Silicon Wafer Direct Bonding

Hong-Seok Min, Young-Chang Joo, Oh-Sung Song

J. Electron. Packag. March 2004, 126(1): 120–123.

DOI: https://doi.org/10.1115/1.1649238

Published Online: April 30, 2004

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Topics: Annealing, Bonding, Glass, Semiconductor wafers, Temperature, Surface roughness, Scanning probe microscopy

Journal Articles

Humidity-Induced Voltage Shift on MEMS Pressure Sensors

J. Albert Chiou, Mem. ASME, Steven Chen, Jinbao Jiao

J. Electron. Packag. December 2003, 125(4): 470–474.

DOI: https://doi.org/10.1115/1.1615249

Published Online: December 15, 2003

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Topics: Bonding, Diaphragms (Mechanical devices), Diaphragms (Structural), Finite element analysis, Microelectromechanical systems, Pressure, Pressure sensors, Silicon, Stress, Surface tension

Journal Articles

Thermal Stress and Deflection Analysis of a Glass Window (Circular Plate) Elastically Restrained Along its Edge in a Photonic Device

John H. Lau, Fellow ASME, Steve Erasmus, Yida Zou

J. Electron. Packag. December 2003, 125(4): 602–608.

DOI: https://doi.org/10.1115/1.1604807

Published Online: December 15, 2003

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Topics: Deflection, Glass, Stress, Boundary-value problems, Pressure, Temperature, Double refraction, Thermal stresses

Journal Articles

Controlling Subcritical Crack Growth at Epoxy/Glass Interfaces

John E. Ritter, G. S. Jacome, J. R. Pelch, T. P. Russell, T. J. Lardner

J. Electron. Packag. December 2002, 124(4): 328–333.

DOI: https://doi.org/10.1115/1.1503064

Published Online: December 12, 2002

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Topics: Epoxy adhesives, Epoxy resins, Fatigue, Fracture (Materials), Glass, Stress corrosion cracking, Water, Fatigue cracks, Durability

Journal Articles

Erratum: “Development of Glass-Free Metal Electrically Conductive Thick Films” [ASME J. Electron. Packag., 123 , No. 1, pp. 64–69]

Zongrong Liu and, D. D. L. Chung

J. Electron. Packag. June 2001, 123(2): 159.

DOI: https://doi.org/10.1115/1.1371772

Published Online: June 1, 2001

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Topics: Electrons, Glass, Metals, Thick films, Adhesion, Electrical resistance, Packaging, Titanium alloys

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Journal citation

NARROW

Design and Fabrication of Leadless Package Structure for Pressure Sensors

Vandal Glass Heat Distribution and the Effect of Glass Gap Adjustments in Outdoor Digital Display Components

Evaluation of Bending Strength of Window Glass Substrate With Considerations of Uni- and Bi-Axial Loading and Free Edge Stresses

Reactive Joining of Thermally and Mechanically Sensitive Materials

Assessment of Elastic–Plastic and Electrical Properties of Printed Silver-Based Interconnects for Flexible Electronics

Ultraminiaturized Three-Dimensional IPAC Packages With 100 μ m Thick Glass Substrates for Radio Frequency Front-End Modules

Accurate Predetermination of the Process Parameters for Glass/Glass Laser Bonding Based on the Temperature Distribution Analysis

Theoretical Analysis and Experimental Quantification of the Gas Leakage Due to Electrical Feedthroughs in Anodic Bonding

Effects of the Thermocompression Bonding on the Microstructure and Contact Resistance for the Ultrafine Pitch Chip-on-Glass Packaging With Nonconductive Film

Three-Dimensional Measurements of Photo-curing Process With Photo-curable Resin for UV-Nanoimprint by Micro-digital-Holographic-PTV

Fabrication of Miniature CMOS Image Sensor Using Novel Glass Cover Chip Packaging Technique

Simulation study on the influences of the bonding parameters on the warpage of chip-on-glass module with nonconductive film

Thermal Stresses Due to Laser Welding in Bridge-Wire Initiators

Thermal Induced Stresses in Bridge-Wire Initiator Glass-to-Metal Seals

PCR Microchip Array Based on Polymer Bonding Technique

Effects of Wafer Cleaning and Annealing on Glass/Silicon Wafer Direct Bonding

Humidity-Induced Voltage Shift on MEMS Pressure Sensors

Thermal Stress and Deflection Analysis of a Glass Window (Circular Plate) Elastically Restrained Along its Edge in a Photonic Device

Controlling Subcritical Crack Growth at Epoxy/Glass Interfaces

Erratum: “Development of Glass-Free Metal Electrically Conductive Thick Films” [ASME J. Electron. Packag., 123 , No. 1, pp. 64–69]

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