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Journal Articles

Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics Applications

Khalid Alzoubi, Alexander Hensel, Felix Häußler, Bettina Ottinger, Marcel Sippel, Jörg Franke

J. Electron. Packag. September 2023, 145(3): 031008.

Paper No: EP-22-1082

DOI: https://doi.org/10.1115/1.4056992

Published Online: March 8, 2023

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Topics: Electronics, Experimental design, Intermetallic compounds, Optimization, Pressure, Shear strength, Silver, Sintering, Temperature, Failure

Journal Articles

Fracture Behavior and Reliability of Low-Silver Lead-Free Solder Joints

Ved Prakash Sharma, Naresh Varma Datla

J. Electron. Packag. December 2022, 144(4): 041016.

Paper No: EP-21-1159

DOI: https://doi.org/10.1115/1.4054096

Published Online: March 31, 2022

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Topics: Fracture (Materials), Fracture (Process), Intermetallic compounds, Solder joints, Solders, Tin, Reliability, Fractography, Lead-free solders, Failure

Journal Articles

Optimized Design of Various Ag Decorated Sn-xAg-Cu 0.7 Solder Bump on Cycling Fatigue Reliability for Wafer-Level Chip Scale Packaging

H. T. Lee, C. Y. Ho, C. C. Lee

J. Electron. Packag. December 2022, 144(4): 041001.

Paper No: EP-21-1043

DOI: https://doi.org/10.1115/1.4052075

Published Online: October 6, 2021

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Topics: Fatigue, Solders, Tin, Displacement, Fracture (Materials), Intermetallic compounds, Packaging, Reliability, Temperature

Journal Articles

Investigation of Elevated Temperature Mechanical Properties of Intermetallic Compounds in the Cu–Sn System Using Nanoindentation

Zuozhu Yin, Fenglian Sun, Mengjiao Guo

J. Electron. Packag. June 2020, 142(2): 021004.

Paper No: EP-18-1042

DOI: https://doi.org/10.1115/1.4045980

Published Online: February 4, 2020

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Topics: Elastic moduli, Intermetallic compounds, Temperature, Tin, Nanoindentation

Journal Articles

Interfacial Compounds Characteristic and Its Reliability Effects on SAC305 Microjoints in Flip Chip Assemblies

Ye Tian, Ning Ren, Xiaoxia Jian, Tie Geng, Yiping Wu

J. Electron. Packag. September 2018, 140(3): 031007.

Paper No: EP-18-1009

DOI: https://doi.org/10.1115/1.4040298

Published Online: June 11, 2018

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Topics: Flip-chip assemblies, Reliability, Soldering, Tin, Solders, Finite element analysis, Fracture (Materials), Intermetallic compounds

Journal Articles

Growth Kinetics of Intermetallic Compounds Between Sn and Fe Liquid–Solid Reaction Couples

Shou-Jen Hsu, Chin C. Lee

J. Electron. Packag. December 2016, 138(4): 041006.

Paper No: EP-16-1095

DOI: https://doi.org/10.1115/1.4034842

Published Online: October 10, 2016

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Topics: Annealing, Intermetallic compounds, Solders, Temperature, Tin, Diffusion (Physics), Carbon, Steel

Journal Articles

Effect of Solder Joint Thickness on Intermetallic Compound Growth Rate of Cu/Sn/Cu Solder Joints During Thermal Aging

Yan Zhu, Fenglian Sun

J. Electron. Packag. December 2016, 138(4): 041005.

Paper No: EP-16-1069

DOI: https://doi.org/10.1115/1.4034819

Published Online: October 10, 2016

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Topics: Solder joints, Solders, Tin, Diluents, Intermetallic compounds

Journal Articles

Relationship Between the Intermetallic Compounds Growth and the Microcracking Behavior of Lead-Free Solder Joints

Tong An, Fei Qin

J. Electron. Packag. March 2016, 138(1): 011002.

Paper No: EP-15-1079

DOI: https://doi.org/10.1115/1.4032349

Published Online: March 10, 2016

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Topics: Failure mechanisms, Solder joints, Solders, Surface roughness, Lead-free solders, Intermetallic compounds, Tensile strength, Microcracks, Tin

Journal Articles

Effect of Intermetallic Compounds on the Thermomechanical Fatigue Life of Three-Dimensional Integrated Circuit Package Microsolder Bumps: Finite Element Analysis and Study

Soud Farhan Choudhury, Leila Ladani

J. Electron. Packag. December 2015, 137(4): 041003.

Paper No: EP-14-1099

DOI: https://doi.org/10.1115/1.4031523

Published Online: September 25, 2015

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Topics: Cycles, Fatigue life, Finite element analysis, Solders, Stress, Thermomechanics, Geometry, Reliability, Integrated circuits, Intermetallic compounds

Journal Articles

Analysis of Thermal Stress and Its Influence on Carrier Mobility in Three-Dimensional Microelectronic Chip Stack

R. W. Johnson, Y.-L. Shen

J. Electron. Packag. June 2015, 137(2): 021011.

Paper No: EP-14-1045

DOI: https://doi.org/10.1115/1.4029345

Published Online: June 1, 2015

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Topics: Electron mobility, Solders, Stress, Thermal stresses, Intermetallic compounds, Deformation

Journal Articles

Structural Size Effect on Mechanical Behavior of Intermetallic Material in Solder Joints: Experimental Investigation

Leila Ladani, Ousama Abdelhadi

J. Electron. Packag. March 2015, 137(1): 014501.

Paper No: EP-13-1116

DOI: https://doi.org/10.1115/1.4027992

Published Online: October 6, 2014

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Topics: Intermetallic compounds, Mechanical properties, Nanoindentation, Solder joints, Tin, Mechanical behavior, Size effect, Elastic moduli, Yield strength, Stress

Journal Articles

Effect of Joint Size on Microstructure and Growth Kinetics of Intermetallic Compounds in Solid-Liquid Interdiffusion Sn3.5Ag/Cu-Substrate Solder Joints

Ousama M. Abdelhadi, Leila Ladani

J. Electron. Packag. June 2013, 135(2): 021004.

Paper No: EP-12-1069

DOI: https://doi.org/10.1115/1.4023846

Published Online: March 28, 2013

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Topics: Solder joints, Soldering, Solders, Temperature, Tin, Intermetallic compounds

Journal Articles

Effect of Design Parameters on Drop Test Performance of Wafer Level Chip Scale Packages

P. Tumne, V. Venkatadri, S. Kudtarkar, M. Delaus, D. Santos, R. Havens, K. Srihari

J. Electron. Packag. June 2012, 134(2): 020905.

DOI: https://doi.org/10.1115/1.4005906

Published Online: June 11, 2012

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Topics: Alloys, Design, Failure, Failure mechanisms, Intermetallic compounds, Reliability, Semiconductor wafers, Solders, Separation (Technology), Shock (Mechanics)

Journal Articles

Failure Analysis of Halogen-Free Printed Circuit Board Assembly Under Board-Level Drop Test

Hung-Jen Chang, Chau-Jie Zhan, Tao-Chih Chang, Jung-Hua Chou

J. Electron. Packag. March 2012, 134(1): 011011.

DOI: https://doi.org/10.1115/1.4005956

Published Online: March 19, 2012

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Topics: Failure, Failure analysis, Fracture (Materials), Intermetallic compounds, Lead-free solders, Printed circuit board assemblies, Solder joints, Solders, Stress, Tin

Journal Articles

Cracking of the Intermetallic Compound Layer in Solder Joints Under Drop Impact Loading

Tong An, Fei Qin

J. Electron. Packag. September 2011, 133(3): 031004.

DOI: https://doi.org/10.1115/1.4004870

Published Online: September 14, 2011

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Topics: Fracture (Materials), Fracture (Process), Solder joints, Solders, Tin, Intermetallic compounds, Failure mechanisms, Damage

Journal Articles

Influence of Intermetallic Characteristics on the Solder Joint Strength of Halogen-Free Printed Circuit Board Assembly

Hung-Jen Chang, Jung-Hua Chou, Tao-Chih Chang, Chau-Jie Zhan, Min-Hsiung Hon, Chi-Shiung Hsi

J. Electron. Packag. June 2011, 133(2): 021004.

DOI: https://doi.org/10.1115/1.4003989

Published Online: June 23, 2011

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Topics: Alloys, Ball-Grid-Array packaging, Intermetallic compounds, Lead-free solders, Solder joints, Solders, Tin, Fracture (Materials), Finishes, Printed circuit board assemblies

Journal Articles

The Effect of Intermetallic Growth on Bump Pull Test Responses of SAC105 Solder Bumps

Jose Omar S. Amistoso, Alberto V. Amorsolo, Jr.

J. Electron. Packag. December 2009, 131(4): 041004.

DOI: https://doi.org/10.1115/1.4000206

Published Online: October 21, 2009

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Topics: Intermetallic compounds, Solders, Temperature, Tin, Semiconductor wafers, Failure mechanisms

Journal Articles

Reliability of BGA and CSP on Metal-Backed Printed Circuit Boards in Harsh Environments

Pradeep Lall, Nokibul Islam, John Evans, Jeff Suhling

J. Electron. Packag. December 2007, 129(4): 382–390.

DOI: https://doi.org/10.1115/1.2804086

Published Online: March 7, 2007

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Topics: Ball-Grid-Array packaging, Crack propagation, Cycles, Fracture (Materials), Lumber, Metals, Reliability, Resistors, Solder joints, Printed circuit boards

Journal Articles

Analysis of the Micro-Mechanical Properties in Aged Lead-Free, Fine Pitch Flip Chip Joints

Changqing Liu, Paul Conway, Dezhi Li, Michael Hendriksen

J. Electron. Packag. September 2004, 126(3): 359–366.

DOI: https://doi.org/10.1115/1.1773391

Published Online: October 6, 2004

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Topics: Flip-chip, Nanoindentation, Shear (Mechanics), Solders, Tin, Flip-chip devices, Intermetallic compounds, Testing, Reliability, Shear strength

Journal Articles

Mechanical and Electrical Properties of Au-Al and Cu-Al Intermetallics Layer at Wire Bonding Interface

Tan Chee Wei, Abdul Razak Daud

J. Electron. Packag. December 2003, 125(4): 617–620.

DOI: https://doi.org/10.1115/1.1604809

Published Online: December 15, 2003

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Topics: Intermetallic compounds, Bonding, Copper, Shear (Mechanics), Electrical properties, Electrical resistance, Wire bonding, Wire

Journal citation

NARROW

Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics Applications

Fracture Behavior and Reliability of Low-Silver Lead-Free Solder Joints

Optimized Design of Various Ag Decorated Sn-xAg-Cu 0.7 Solder Bump on Cycling Fatigue Reliability for Wafer-Level Chip Scale Packaging

Investigation of Elevated Temperature Mechanical Properties of Intermetallic Compounds in the Cu–Sn System Using Nanoindentation

Interfacial Compounds Characteristic and Its Reliability Effects on SAC305 Microjoints in Flip Chip Assemblies

Growth Kinetics of Intermetallic Compounds Between Sn and Fe Liquid–Solid Reaction Couples

Effect of Solder Joint Thickness on Intermetallic Compound Growth Rate of Cu/Sn/Cu Solder Joints During Thermal Aging

Relationship Between the Intermetallic Compounds Growth and the Microcracking Behavior of Lead-Free Solder Joints

Effect of Intermetallic Compounds on the Thermomechanical Fatigue Life of Three-Dimensional Integrated Circuit Package Microsolder Bumps: Finite Element Analysis and Study

Analysis of Thermal Stress and Its Influence on Carrier Mobility in Three-Dimensional Microelectronic Chip Stack

Structural Size Effect on Mechanical Behavior of Intermetallic Material in Solder Joints: Experimental Investigation

Effect of Joint Size on Microstructure and Growth Kinetics of Intermetallic Compounds in Solid-Liquid Interdiffusion Sn3.5Ag/Cu-Substrate Solder Joints

Effect of Design Parameters on Drop Test Performance of Wafer Level Chip Scale Packages

Failure Analysis of Halogen-Free Printed Circuit Board Assembly Under Board-Level Drop Test

Cracking of the Intermetallic Compound Layer in Solder Joints Under Drop Impact Loading

Influence of Intermetallic Characteristics on the Solder Joint Strength of Halogen-Free Printed Circuit Board Assembly

The Effect of Intermetallic Growth on Bump Pull Test Responses of SAC105 Solder Bumps

Reliability of BGA and CSP on Metal-Backed Printed Circuit Boards in Harsh Environments

Analysis of the Micro-Mechanical Properties in Aged Lead-Free, Fine Pitch Flip Chip Joints

Mechanical and Electrical Properties of Au-Al and Cu-Al Intermetallics Layer at Wire Bonding Interface

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