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Journal Articles

Special Issue on InterPACK2023

Ronald J. Warzoha, Damena Agonofer, Ashutosh Giri, Jimil Shah
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. December 2024, 146(4): 040301.
Paper No: EP-24-1089
https://doi.org/10.1115/1.4066727
Published Online: October 22, 2024
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Topics: Electronic packaging, Electronics, Packaging, Cutting, Data centers, Energy storage, Engineering teachers, Machine learning, Mechanical engineers, Microelectromechanical systems
Journal Articles

Special Issue on InterPACK 2019 – Part 1

Sreekant Narumanchi, Sukwon Choi, Saket Karajgikar, Haiding Sun, Guangsheng Zhang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. September 2020, 142(3): 030301.
Paper No: EP-20-1092
https://doi.org/10.1115/1.4048039
Published Online: August 14, 2020
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Topics: Cloud computing, Electric vehicles, Electronic packaging, Electronics, Energy conversion, Engineering teachers, Feedback, Internet of things, Manufacturing, Mechanical engineers
Journal Articles

Special Issue on InterPACK 2018

Ercan M. Dede, Lauren Boteler, Changqing Chen, Przemyslaw Jakub Gromala, Benjamin Leever, Wei Li
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. September 2019, 141(3): 030301.
Paper No: EP-19-1036
https://doi.org/10.1115/1.4043484
Published Online: May 8, 2019
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Topics: Electronic packaging, Electronics, Microelectromechanical systems, Design, Internet of things, Condition monitoring, Data centers, Electric vehicles, Energy conversion, Engineering teachers
Journal Articles

State-of-the-Art and Trends in the Thermal Packaging of Electronic Equipment

Avram Bar-Cohen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1992, 114(3): 257–270.
https://doi.org/10.1115/1.2905450
Published Online: September 1, 1992
View Article titled, State-of-the-Art and Trends in the Thermal Packaging of Electronic Equipment
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Topics: Electronic equipment, Packaging, Design methodology, Design, Errors, Mechanical engineers, Scalars
Journal Articles

Packaging Architecture Considerations of High Density Multi-Chip Electronic Packages Via System Optimization

J. P. Krusius
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1990, 112(3): 267–271.
https://doi.org/10.1115/1.2904377
Published Online: September 1, 1990
View Article titled, Packaging Architecture Considerations of High Density Multi-Chip Electronic Packages Via System Optimization
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Topics: Density, Electronic packages, Optimization, Packaging, Complementary metal oxide semiconductors, Cycles, Design, Mechanical engineers, Printed circuit boards, Simulated annealing