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Journal Articles

Mixed Convection of Impinging Air Cooling Over Heat Sink in Telecom System Application

Siddharth Bhopte, Musa S. Alshuqairi, Dereje Agonafer, Fellow ASME, Gamal Refai-Ahmed, Fellow ASME

Publisher: ASME

J. Electron. Packag. December 2004, 126(4): 519–523.

https://doi.org/10.1115/1.1827267

Published Online: January 24, 2005

View Article titled, Mixed Convection of Impinging Air Cooling Over Heat Sink in Telecom System Application

Topics: Heat sinks, Mixed convection, Reynolds number, Nozzles, Cooling, Computer simulation, Heat, Flow (Dynamics), Rayleigh number

Journal Articles

Evaluation of Thermal Enhancements to Flip-Chip-Plastic Ball Grid Array Packages

K. Ramakrishna, Fellow ASME,, T.-Y. Tom Lee, Mem. ASME,

Publisher: ASME

J. Electron. Packag. December 2004, 126(4): 449–456.

https://doi.org/10.1115/1.1827260

Published Online: January 24, 2005

View Article titled, Evaluation of Thermal Enhancements to Flip-Chip-Plastic Ball Grid Array Packages

Topics: Flat heat pipes, Forced convection, Mixed convection, Natural convection, Printed circuit boards, Thermal conductivity, Thermal resistance, Heat transfer, Copper, Junctions

Journal Articles

Conjugate Heat Transfer With Buoyancy Effects From Micro-Chip Sized Repeated Heaters

D. Yu, T. A. Ameel, R. O. Warrington, R. F. Barron

Publisher: ASME

J. Electron. Packag. December 1997, 119(4): 275–280.

https://doi.org/10.1115/1.2792249

Published Online: December 1, 1997

View Article titled, Conjugate Heat Transfer With Buoyancy Effects From Micro-Chip Sized Repeated Heaters

Topics: Buoyancy, Heat transfer, Integrated circuits, Mixed convection, Flow (Dynamics), Temperature, Thermal conductivity, Forced convection, Convection, Electronics

Journal Articles

A Detailed Thermal Model of the Infrared Reflow Soldering Process

M. A. Eftychiou, T. L. Bergman, G. Y. Masada

Publisher: ASME

J. Electron. Packag. March 1993, 115(1): 55–62.

https://doi.org/10.1115/1.2909302

Published Online: March 1, 1993

View Article titled, A Detailed Thermal Model of the Infrared Reflow Soldering Process

Topics: Reflow soldering, Heat conduction, Heat transfer, Mixed convection, Convection, Manufacturing, Ovens, Radiation (Physics), Solders, Temperature effects

Journal Articles

Liquid Immersion Cooling of a Longitudinal Array of Discrete Heat Sources in Protruding Substrates: I—Single-Phase Convection

T. J. Heindel, F. P. Incropera, S. Ramadhyani

Publisher: ASME

J. Electron. Packag. March 1992, 114(1): 55–62.

https://doi.org/10.1115/1.2905442

Published Online: March 1, 1992

View Article titled, Liquid Immersion Cooling of a Longitudinal Array of Discrete Heat Sources in Protruding Substrates: I—Single-Phase Convection

Topics: Convection, Cooling, Heat, Flow (Dynamics), Heat transfer, Reynolds number, Buoyancy, Forced convection, Turbulence, Fluids

Journal Articles

Mixed Convective Heat Transfer From a Simulated Microchip to Liquid Flows in a Horizontal Rectangular Channel

Y. Chin, C. F. Ma, X. Q. Gu, L. Xu

Publisher: ASME

J. Electron. Packag. September 1991, 113(3): 309–312.

https://doi.org/10.1115/1.2905411

Published Online: September 1, 1991

View Article titled, Mixed Convective Heat Transfer From a Simulated Microchip to Liquid Flows in a Horizontal Rectangular Channel

Topics: Convection, Flow (Dynamics), Integrated circuits, Heat transfer, Buoyancy, Forced convection, Mixed convection, Rayleigh number, Reynolds number

Journal citation

NARROW

Mixed Convection of Impinging Air Cooling Over Heat Sink in Telecom System Application

Evaluation of Thermal Enhancements to Flip-Chip-Plastic Ball Grid Array Packages

Conjugate Heat Transfer With Buoyancy Effects From Micro-Chip Sized Repeated Heaters

A Detailed Thermal Model of the Infrared Reflow Soldering Process

Liquid Immersion Cooling of a Longitudinal Array of Discrete Heat Sources in Protruding Substrates: I—Single-Phase Convection

Mixed Convective Heat Transfer From a Simulated Microchip to Liquid Flows in a Horizontal Rectangular Channel

ASME Journals

ASME Conference Proceedings

ASME eBooks

Resources

Opportunities

Mixed Convection of Impinging Air Cooling Over Heat Sink in Telecom System Application

Evaluation of Thermal Enhancements to Flip-Chip-Plastic Ball Grid Array Packages

Conjugate Heat Transfer With Buoyancy Effects From Micro-Chip Sized Repeated Heaters

A Detailed Thermal Model of the Infrared Reflow Soldering Process

Liquid Immersion Cooling of a Longitudinal Array of Discrete Heat Sources in Protruding Substrates: I—Single-Phase Convection

Mixed Convective Heat Transfer From a Simulated Microchip to Liquid Flows in a Horizontal Rectangular Channel

ASME Journals

ASME Conference Proceedings

ASME eBooks

Resources

Opportunities

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