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Journal Articles

Transient Liquid Phase Bond Acceleration Using Copper Nanowires

Accepted Manuscript
John Harris, David Huitink
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag.
Paper No: EP-24-1038
https://doi.org/10.1115/1.4066042
Published Online: July 20, 2024
View Article titled, Transient Liquid Phase Bond Acceleration Using Copper Nanowires
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Topics: Copper, Nanowires, Transients (Dynamics), Bonding, Solders, Intermetallic compounds, Temperature, Acoustic microscopy, Electroforming, Electronics
Journal Articles

Rapid Anneal-Free Welding of Cu Nanowires Network by Ultraviolet Light Irradiation for Transparent Electrodes in Optoelectronic Applications

Jun Wang, Yang Zhao, Han Chen, Yan Tang, Guozhen Liu, Renli Liang, Jiangnan Dai, Changqing Chen, Junyong Kang, Duanjun Cai
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031102.
Paper No: EP-19-1120
https://doi.org/10.1115/1.4046764
Published Online: April 17, 2020
View Article titled, Rapid Anneal-Free Welding of Cu Nanowires Network by Ultraviolet Light Irradiation for Transparent Electrodes in Optoelectronic Applications
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Topics: Electrodes, Irradiation (Radiation exposure), Nanowires, Transparency, Ultraviolet radiation, Light-emitting diodes, Welding
Journal Articles

Special Section on InterPACK 2013

Satish Chaparala, Ashish Gupta, Nils Hoivik, Y. C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Editorial
J. Electron. Packag. December 2014, 136(4): 040201.
Paper No: EP-14-1070
https://doi.org/10.1115/1.4028390
Published Online: September 19, 2014
View Article titled, Special Section on InterPACK 2013
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Topics: Copper, Design, Electronic packaging, Engineering mechanics, Manufacturing, Packaging, Reliability, Sensors, Silicon, Thermal management
Journal Articles

Fabrication of Anodic Aluminum Oxide Template and Copper Nanowire Surface Fastener

Hiromasa Teshima, Kohei Kojima, Yang Ju
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2014, 136(4): 044501.
Paper No: EP-13-1132
https://doi.org/10.1115/1.4028316
Published Online: September 19, 2014
View Article titled, Fabrication of Anodic Aluminum Oxide Template and Copper Nanowire Surface Fastener
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Topics: Aluminum, Bonding, Manufacturing, Nanowires, Fasteners, Electrical resistance
Journal Articles

Microscale and Nanoscale Thermal Characterization Techniques

J. Christofferson, K. Maize, Y. Ezzahri, J. Shabani, X. Wang, A. Shakouri
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Thermal Issues In Emerging Technologies Theory And Applications, Theta
J. Electron. Packag. December 2008, 130(4): 041101.
https://doi.org/10.1115/1.2993145
Published Online: November 13, 2008
View Article titled, Microscale and Nanoscale Thermal Characterization Techniques
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Topics: Imaging, Microscale devices, Nanoscale phenomena, Probes, Resolution (Optics), Temperature, Thermal characterization, Thermoreflectance, Wavelength, Atomic force microscopy
Journal Articles

Thermal Phenomena in Nanoscale Transistors

Eric Pop, Kenneth E. Goodson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2006, 128(2): 102–108.
https://doi.org/10.1115/1.2188950
Published Online: December 14, 2006
View Article titled, Thermal Phenomena in Nanoscale Transistors
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Topics: Phonons, Silicon, Transistors, Heat, Nanoscale phenomena, Electrons, Nanowires