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Journal Articles

Bio-Based Epoxy Resins Derived From Eugenol With Low Dielectric Constant

Yuan Liu, Jinyue Dai, Xiaoqing Liu, Jun Luo, Shusen You, Jin Zhu, Songqi Ma, Zhen Jia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031006.
Paper No: EP-17-1016
https://doi.org/10.1115/1.4036818
Published Online: June 30, 2017
View Article titled, Bio-Based Epoxy Resins Derived From Eugenol With Low Dielectric Constant
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Topics: Epoxy resins, Nuclear magnetic resonance
Journal Articles

Size-Compatible, Polymer-Based Air-Gap Formation Processes, and Polymer Residue Analysis for Wafer-Level MEMS Packaging Applications

Erdal Uzunlar, Paul A. Kohl
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2015, 137(4): 041001.
Paper No: EP-14-1114
https://doi.org/10.1115/1.4030952
Published Online: July 23, 2015
View Article titled, Size-Compatible, Polymer-Based Air-Gap Formation Processes, and Polymer Residue Analysis for Wafer-Level MEMS Packaging Applications
Open the PDF for Size-Compatible, Polymer-Based Air-Gap Formation Processes, and Polymer Residue Analysis for Wafer-Level MEMS Packaging Applications in another window
Topics: MEMS packaging, Microelectromechanical systems, Polymers, Temperature, Semiconductor wafers, Reactive-ion etching, Nuclear magnetic resonance, Hardening (Curing)