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Journal Articles

Electrochemical Linked to Mechanical Simulation for an Assessment of State-Of-Health of Thin-flexible Li-ion Batteries on Dynamic Flexing and Calendar Aging

Accepted Manuscript
Pradeep Lall, Hyesoo Jang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag.
Paper No: EP-24-1003
https://doi.org/10.1115/1.4067266
Published Online: November 27, 2024
View Article titled, Electrochemical Linked to Mechanical Simulation for an Assessment of State-Of-Health of Thin-flexible Li-ion Batteries on Dynamic Flexing and Calendar Aging
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Topics: Engineering simulation, Lithium-ion batteries, Batteries, Simulation, Stress, Durability, Electronics, Operating temperature, Physics, Storage
Journal Articles

Mechanical Properties of Doped Solder SAC-Q for High Strain Rate Testing at Extreme Surrounding Temperatures for 6 Months of Isothermal Aging

Pradeep Lall, Vishal Mehta, Jeff Suhling, Ken Blecker
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2024, 146(3): 031006.
Paper No: EP-22-1025
https://doi.org/10.1115/1.4064521
Published Online: March 11, 2024
View Article titled, Mechanical Properties of Doped Solder SAC-Q for High Strain Rate Testing at Extreme Surrounding Temperatures for 6 Months of Isothermal Aging
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Topics: Elastic moduli, Mechanical properties, Solders, Stress, Stress-strain curves, Temperature, Tensile strength, Testing, Viscoplasticity, Finite element analysis
Journal Articles

Evolution of Anand Parameters for Thermally Aged Sn-Ag-Cu Lead-Free Alloys at Low Operating Temperature

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021116.
Paper No: EP-21-1062
https://doi.org/10.1115/1.4053764
Published Online: March 11, 2022
View Article titled, Evolution of Anand Parameters for Thermally Aged Sn-Ag-Cu Lead-Free Alloys at Low Operating Temperature
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Topics: Solders, Stress-strain curves, Temperature, Alloys, Operating temperature, Tensile strength, Materials properties
Journal Articles

Effect of U-Flex-to-Install and Dynamic U-Flexing on Li-Ion Battery State of Health Degradation Subjected to Varying Fold Orientations, Folding Speeds, Depths of Charge, C-Rates, and Temperatures

Pradeep Lall, Ved Soni, Scott Miller
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021112.
Paper No: EP-21-1058
https://doi.org/10.1115/1.4052750
Published Online: January 4, 2022
View Article titled, Effect of U-Flex-to-Install and Dynamic U-Flexing on Li-Ion Battery State of Health Degradation Subjected to Varying Fold Orientations, Folding Speeds, Depths of Charge, C-Rates, and Temperatures
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Topics: Batteries, Cycles, Lithium-ion batteries, Temperature, Regression models, Operating temperature, Reliability
Journal Articles

High Strain Rate Mechanical Properties of SAC-Q Solder for Extreme Temperatures After Exposure to Isothermal Aging Up to 90 Days

Pradeep Lall, Vishal Mehta, Jeff Suhling, Ken Blecker
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021108.
Paper No: EP-21-1060
https://doi.org/10.1115/1.4052073
Published Online: October 6, 2021
View Article titled, High Strain Rate Mechanical Properties of SAC-Q Solder for Extreme Temperatures After Exposure to Isothermal Aging Up to 90 Days
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Topics: Elastic moduli, Mechanical properties, Solders, Stress, Stress-strain curves, Temperature, Tensile strength, Testing, Operating temperature, High temperature
Journal Articles

Evolution of Anand Parameters With Elevated Temperature Aging for SnAgCu Lead-free Alloys

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2021, 143(2): 021005.
Paper No: EP-20-1080
https://doi.org/10.1115/1.4048181
Published Online: October 8, 2020
View Article titled, Evolution of Anand Parameters With Elevated Temperature Aging for SnAgCu Lead-free Alloys
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Topics: Alloys, Solders, Temperature, Stress, Solder joints, Operating temperature
Journal Articles

Effect of Packaging Architecture on the Optical and Thermal Performances of High-Power Light Emitting Diodes

Thong Kok Law, Fannon Lim, Yun Li, XuePeng Puan, G. K. E. Sng, J. W. Ronnie Teo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031003.
Paper No: EP-16-1108
https://doi.org/10.1115/1.4036066
Published Online: June 14, 2017
View Article titled, Effect of Packaging Architecture on the Optical and Thermal Performances of High-Power Light Emitting Diodes
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Topics: Bonding, Energy dissipation, Heat, Light-emitting diodes, Operating temperature, Packaging, Phosphors, Temperature, Thermal resistance, Light emission
Journal Articles

Optimized Thermoelectric Module-Heat Sink Assemblies for Precision Temperature Control

Rui Zhang, Marc Hodes, David A. Brooks, Vincent P. Manno
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2012, 134(2): 021007.
https://doi.org/10.1115/1.4005905
Published Online: June 11, 2012
View Article titled, Optimized Thermoelectric Module-Heat Sink Assemblies for Precision Temperature Control
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Topics: Algorithms, Circuits, Heat, Temperature, Temperature control, Thermal resistance, Thermoelectric cooling, Energy consumption, Photonics, Heat sinks
Journal Articles

An Investigation of Flat-Plate Oscillating Heat Pipes

Peng Cheng, Scott Thompson, Joe Boswell, H. B. Ma
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041009.
https://doi.org/10.1115/1.4002726
Published Online: November 24, 2010
View Article titled, An Investigation of Flat-Plate Oscillating Heat Pipes
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Topics: Diamonds, Flat plates, Fluids, Heat pipes, Heat transfer, Nanofluids, Temperature, Thermal resistance, Water, Operating temperature
Journal Articles

Modeling the Effects of Mixed Flowing Gas (MFG) Corrosion and Stress Relaxation on Contact Interface Resistance

Shrikar Bhagath, Michael G. Pecht
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1993, 115(4): 404–409.
https://doi.org/10.1115/1.2909349
Published Online: December 1, 1993
View Article titled, Modeling the Effects of Mixed Flowing Gas (MFG) Corrosion and Stress Relaxation on Contact Interface Resistance
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Topics: Corrosion, Modeling, Relaxation (Physics), Stress, Base metals, Contact resistance, Gold plating, Operating temperature, Reliability, Temperature
Journal Articles

Optimization of Extruded Type External Heat Sink for Multichip Module

A. Mertol
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 1993, 115(4): 440–444.
https://doi.org/10.1115/1.2909354
Published Online: December 1, 1993
View Article titled, Optimization of Extruded Type External Heat Sink for Multichip Module
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Topics: Heat sinks, Multi-chip modules, Optimization, Junctions, Dimensions, Temperature, Air flow, Design, Finite element analysis, Finite element model
Journal Articles

Solder Joint Creep and Stress Relaxation Dependence on Construction and Environmental-Stress Parameters

R. G. Ross, Jr., L. C. Wen, G. R. Mon
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1993, 115(2): 165–172.
https://doi.org/10.1115/1.2909313
Published Online: June 1, 1993
View Article titled, Solder Joint Creep and Stress Relaxation Dependence on Construction and Environmental-Stress Parameters
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Topics: Construction, Creep, Relaxation (Physics), Solder joints, Stress, Solders, Stiffness, Complex systems, Cycles, Damage
Journal Articles

PCB Trace Thermal Analysis and Effective Conductivity

T. F. Lemczyk, B. L. Mack, J. R. Culham, M. M. Yovanovich
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1992, 114(4): 413–419.
https://doi.org/10.1115/1.2905474
Published Online: December 1, 1992
View Article titled, PCB Trace Thermal Analysis and Effective Conductivity
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Topics: Thermal analysis, Thermal conductivity, Heat, Printed circuit boards, Electric current, Glass reinforced plastics, Heat conduction, Microelectronic devices, Operating temperature, Steady state
Journal Articles

A Physics of Failure Approach to Component Placement

M. D. Osterman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1992, 114(3): 305–309.
https://doi.org/10.1115/1.2905455
Published Online: September 1, 1992
View Article titled, A Physics of Failure Approach to Component Placement
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Topics: Failure, Physics, Temperature, Hazards, Printed circuit boards, Reliability, Cooling, Cycles, Forced convection, Manufacturing
Journal Articles

The Adiabatic Heat Transfer Coefficient and the Superposition Kernel Function: Part 2—Modeling Flatpack Data as a Function of Channel Turbulence

A. M. Anderson, R. J. Moffat
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1992, 114(1): 22–28.
https://doi.org/10.1115/1.2905437
Published Online: March 1, 1992
View Article titled, The Adiabatic Heat Transfer Coefficient and the Superposition Kernel Function: Part 2—Modeling Flatpack Data as a Function of Channel Turbulence
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Topics: Heat transfer coefficients, Modeling, Turbulence, Heat transfer, Pressure drop, Electronics, Fluctuations (Physics), Forced convection, Heat, Operating temperature
Journal Articles

The Adiabatic Heat Transfer Coefficient and the Superposition Kernel Function: Part 1—Data for Arrays of Flatpacks for Different Flow Conditions

Ann M. Anderson, Robert J. Moffat
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1992, 114(1): 14–21.
https://doi.org/10.1115/1.2905435
Published Online: March 1, 1992
View Article titled, The Adiabatic Heat Transfer Coefficient and the Superposition Kernel Function: Part 1—Data for Arrays of Flatpacks for Different Flow Conditions
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Topics: Flow (Dynamics), Heat transfer coefficients, Heat transfer, Pressure drop, Electronics, Fluctuations (Physics), Forced convection, Heat, Operating temperature, Turbulence
Journal Articles

Piezoresistive Stress Sensors for Structural Analysis of Electronic Packages

D. A. Bittle, J. C. Suhling, R. E. Beaty, R. C. Jaeger, R. W. Johnson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1991, 113(3): 203–215.
https://doi.org/10.1115/1.2905397
Published Online: September 1, 1991
View Article titled, Piezoresistive Stress Sensors for Structural Analysis of Electronic Packages
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Topics: Electronic packages, Sensors, Stress, Structural analysis, Semiconductor wafers, Crystals, Design, Diamonds, Heat conduction, Integrated circuits
Journal Articles

Transient Thermal Stress Analysis of a Plated Through Hole Subjected to Wave Soldering

D. Barker, M. Pecht, A. Dasgupta, S. Naqvi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1991, 113(2): 149–155.
https://doi.org/10.1115/1.2905380
Published Online: June 1, 1991
View Article titled, Transient Thermal Stress Analysis of a Plated Through Hole Subjected to Wave Soldering
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Topics: Thermal stresses, Transients (Dynamics), Wave soldering, Stress, Temperature, Anisotropy, Damage, Fatigue life, Fracture (Materials), Heat transfer
Journal Articles

Thermal Stress CAD Analysis of a Multi-Layer Composite of an Operating Transistor Package

Agha J. Ghorieshi, Umid R. Nejib
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 1990, 112(1): 77–80.
https://doi.org/10.1115/1.2904345
Published Online: March 1, 1990
View Article titled, Thermal Stress CAD Analysis of a Multi-Layer Composite of an Operating Transistor Package
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Topics: Composite materials, Computer-aided design, Thermal stresses, Transistors, Shear stress, Cooling systems, Corners (Structural elements), Cycles, Design, Electronic packages