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Journal Articles

Thermal Energy Storage Thermal Response Model With Application to Thermal Management of High Power-Density Hand-Held Electronics

R. A. Wirtz, K. Swanson, M. Yaquinto
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2012, 134(1): 011002.
https://doi.org/10.1115/1.4005915
Published Online: March 19, 2012
View Article titled, Thermal Energy Storage Thermal Response Model With Application to Thermal Management of High Power-Density Hand-Held Electronics
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Topics: Electronics, Heat, Phase transitions, Power density, Skin, Temperature, Thermal energy storage, Transients (Dynamics), Thermal management, Cooling
Journal Articles

Microscale and Nanoscale Thermal Characterization Techniques

J. Christofferson, K. Maize, Y. Ezzahri, J. Shabani, X. Wang, A. Shakouri
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Thermal Issues In Emerging Technologies Theory And Applications, Theta
J. Electron. Packag. December 2008, 130(4): 041101.
https://doi.org/10.1115/1.2993145
Published Online: November 13, 2008
View Article titled, Microscale and Nanoscale Thermal Characterization Techniques
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Topics: Imaging, Microscale devices, Nanoscale phenomena, Probes, Resolution (Optics), Temperature, Thermal characterization, Thermoreflectance, Wavelength, Atomic force microscopy
Journal Articles

An Analysis of Shrinkage Porosity in Aluminum Ball Bonding Process

L. J. Huang, K. Ramakrishna, P. S. Ayyaswamy, I. M. Cohen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1989, 111(3): 199–206.
https://doi.org/10.1115/1.3226534
Published Online: September 1, 1989
View Article titled, An Analysis of Shrinkage Porosity in Aluminum Ball Bonding Process
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Topics: Aluminum, Bonding, Porosity, Shrinkage (Materials), Alloys, Metals, Density, Solidification, Accounting, Geometry