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Journal Articles

Thermal Analysis and Optimization of Light-Emitting Diodes Filament Lamp

Jie Liu, Jinglong Zou, Sheng Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2021, 143(1): 011003.
Paper No: EP-19-1078
https://doi.org/10.1115/1.4046762
Published Online: June 4, 2020
View Article titled, Thermal Analysis and Optimization of Light-Emitting Diodes Filament Lamp
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Topics: Energy dissipation, Heat, Light-emitting diodes, Optimization, Phosphors, Temperature, Junctions, Natural convection, Thermal analysis, Fins
Journal Articles

High-Particle-Density YAG:Ce Phosphor Coating for High Power Laser Lighting

Yi Yang, Tao Long, Songlin Zhuang, Lai Wang, Yi Luo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031101.
Paper No: EP-19-1109
https://doi.org/10.1115/1.4046763
Published Online: April 17, 2020
View Article titled, High-Particle-Density YAG:Ce Phosphor Coating for High Power Laser Lighting
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Topics: Coating processes, Coatings, Composite materials, Crystals, Density, Particulate matter, Phosphors, Power density, Lasers, Aluminum
Journal Articles

Packaging for Laser-Based White Lighting: Status and Perspectives

Yupu Ma, Xiaobing Luo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. March 2020, 142(1): 010801.
Paper No: EP-18-1105
https://doi.org/10.1115/1.4044359
Published Online: September 19, 2019
View Article titled, Packaging for Laser-Based White Lighting: Status and Perspectives
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Topics: Lasers, Packaging, Phosphors, Quenching (Metalworking), Temperature, Laser beams, Brightness (Photometry)
Journal Articles

Reduced Working Temperature of Quantum Dots-Light-Emitting Diodes Optimized by Quantum Dots at Silica-on-Chip Structure

Bin Xie, Haochen Liu, Xiao Wei Sun, Xingjian Yu, Ruikang Wu, Kai Wang, Xiaobing Luo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031001.
Paper No: EP-18-1080
https://doi.org/10.1115/1.4042981
Published Online: April 10, 2019
View Article titled, Reduced Working Temperature of Quantum Dots-Light-Emitting Diodes Optimized by Quantum Dots at Silica-on-Chip Structure
Open the PDF for Reduced Working Temperature of Quantum Dots-Light-Emitting Diodes Optimized by Quantum Dots at Silica-on-Chip Structure in another window
Topics: Heat, Light-emitting diodes, Nanoparticles, Phosphors, Quantum dots, Silicones, Temperature, Shells, Simulation
Journal Articles

Cylindrical Tuber Encapsulant Layer Realization by Patterned Surface for Chip-on-Board Light-Emitting Diodes Packaging

Xingjian Yu, Run Hu, Ruikang Wu, Bin Xie, Xiaoyu Zhang, Xiaobing Luo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031005.
Paper No: EP-18-1076
https://doi.org/10.1115/1.4042982
Published Online: April 10, 2019
View Article titled, Cylindrical Tuber Encapsulant Layer Realization by Patterned Surface for Chip-on-Board Light-Emitting Diodes Packaging
Open the PDF for Cylindrical Tuber Encapsulant Layer Realization by Patterned Surface for Chip-on-Board Light-Emitting Diodes Packaging in another window
Topics: Light-emitting diodes, Particulate matter, Phosphors, Silicones, Packaging, Wetting, Surface energy
Journal Articles

Effect of Packaging Architecture on the Optical and Thermal Performances of High-Power Light Emitting Diodes

Thong Kok Law, Fannon Lim, Yun Li, XuePeng Puan, G. K. E. Sng, J. W. Ronnie Teo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031003.
Paper No: EP-16-1108
https://doi.org/10.1115/1.4036066
Published Online: June 14, 2017
View Article titled, Effect of Packaging Architecture on the Optical and Thermal Performances of High-Power Light Emitting Diodes
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Topics: Bonding, Energy dissipation, Heat, Light-emitting diodes, Operating temperature, Packaging, Phosphors, Temperature, Thermal resistance, Light emission
Journal Articles

Numerical and Experimental Study on the Transferred Volume in Phosphor Dip-Transfer Coating Process of Light-Emitting Diodes Packaging

Bofeng Shang, Xingjian Yu, Huai Zheng, Bin Xie, Qi Chen, Xiaobing Luo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2016, 138(2): 021003.
Paper No: EP-15-1057
https://doi.org/10.1115/1.4033165
Published Online: April 19, 2016
View Article titled, Numerical and Experimental Study on the Transferred Volume in Phosphor Dip-Transfer Coating Process of Light-Emitting Diodes Packaging
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Topics: Coating processes, Computer simulation, Light-emitting diodes, Phosphors, Coatings, Packaging, Fluids
Journal Articles

Packaging of Phosphor Based High Power White LEDs: Effects of Phosphor Concentration and Packaging Configuration

Yuan-Chang Lin, Jiun Pyng You, Nguyen T. Tran, Yongzhi He, Frank G. Shi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2011, 133(1): 011009.
https://doi.org/10.1115/1.4003216
Published Online: March 10, 2011
View Article titled, Packaging of Phosphor Based High Power White LEDs: Effects of Phosphor Concentration and Packaging Configuration
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Topics: Light-emitting diodes, Phosphors, Packaging
Journal Articles

Phosphor Concentration Effects on Optothermal Characteristics of Phosphor Converted White Light-Emitting Diodes

Jiun Pyng You, Yeong-Her Lin, Nguyen T. Tran, Frank G. Shi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2010, 132(3): 031010.
https://doi.org/10.1115/1.4002298
Published Online: September 30, 2010
View Article titled, Phosphor Concentration Effects on Optothermal Characteristics of Phosphor Converted White Light-Emitting Diodes
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Topics: Junctions, Light-emitting diodes, Phosphors, Temperature
Journal Articles

Chip to System Levels Thermal Needs and Alternative Thermal Technologies for High Brightness LEDS

Mehmet Arik, Anant Setlur, Stanton Weaver, Deborah Haitko, James Petroski
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 328–338.
https://doi.org/10.1115/1.2753958
Published Online: April 9, 2007
View Article titled, Chip to System Levels Thermal Needs and Alternative Thermal Technologies for High Brightness LEDS
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Topics: Brightness (Photometry), Design, Heat, Light-emitting diodes, Phosphors, Silicones, Temperature, Thermal management, Temperature distribution, Packaging