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Journal Articles

Blister Testing for Adhesion Strength Measurement of Polymer Films Subjected to Environmental Conditions

Kenny Mahan, David Rosen, Bongtae Han
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2016, 138(4): 041003.
Paper No: EP-16-1046
https://doi.org/10.1115/1.4034454
Published Online: September 2, 2016
View Article titled, Blister Testing for Adhesion Strength Measurement of Polymer Films Subjected to Environmental Conditions
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Topics: Adhesion, Deflection, Pressure, Testing, Polymer films, Copper, Delamination
Journal Articles

Finite Thickness Influence on Spherical and Conical Indentation on Viscoelastic Thin Polymer Film

V. Gonda, J. den Toonder, J. Beijer, G. Q. Zhang, L. J. Ernst
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 33–37.
https://doi.org/10.1115/1.1846065
Published Online: March 21, 2005
View Article titled, Finite Thickness Influence on Spherical and Conical Indentation on Viscoelastic Thin Polymer Film
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Topics: Polymer films, Thin films, Testing, Creep, Nanoindentation, Stress, Temperature, Viscoelasticity
Journal Articles

State-of-the-Art of Thermo-Mechanical Characterization of Thin Polymer Films

K. M. B. Jansen, V. Gonda, L. J. Ernst, H. J. L. Bressers, G. Q. Zhang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technology Review
J. Electron. Packag. December 2005, 127(4): 530–536.
https://doi.org/10.1115/1.2070092
Published Online: December 22, 2004
View Article titled, State-of-the-Art of Thermo-Mechanical Characterization of Thin Polymer Films
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Topics: Deflection, Electromagnetic scattering, Film thickness, Nanoindentation, Polymer films, Polymers, Radiation scattering, Scattering (Physics), Stress, Thermomechanics
Journal Articles

Chemical-Mechanical Planarization of Low- k Polymers for Advanced IC Structures

Christopher L. Borst, Dipto G. Thakurta, William N. Gill, Ronald J. Gutmann
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 362–366.
https://doi.org/10.1115/1.1510138
Published Online: December 12, 2002
View Article titled, Chemical-Mechanical Planarization of Low- k Polymers for Advanced IC Structures
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Topics: Copper, Polymers, Semiconductor wafers, Slurries, Polishing, Atomic force microscopy, Polymer films, Phthalate plasticizers
Journal Articles

Damage Accumulation During Stress Relaxation of Polymer Films in Bending

D. Ingman, Y. Michlin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. September 2002, 124(3): 260–265.
https://doi.org/10.1115/1.1463731
Published Online: July 26, 2002
View Article titled, Damage Accumulation During Stress Relaxation of Polymer Films in Bending
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Topics: Damage, Relaxation (Physics), Stress, Strips, Deformation, Polymer films
Journal Articles

Constitutive Modeling of Polymer Films From Viscoelasticity to Viscoplasticity

Z. Qian, M. Lu, S. Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. June 1998, 120(2): 145–149.
https://doi.org/10.1115/1.2792605
Published Online: June 1, 1998
View Article titled, Constitutive Modeling of Polymer Films From Viscoelasticity to Viscoplasticity
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Topics: Modeling, Polymer films, Viscoelasticity, Viscoplasticity, Deformation, Stress, Chain, Constitutive equations, Drag (Fluid dynamics), Temperature effects
Journal Articles

Finite Element Viscoelastic Analysis of Temperature and Moisture Effects in Electronic Packaging

Arvind Krishna, B. D. Harper, J. K. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1995, 117(3): 192–200.
https://doi.org/10.1115/1.2792091
Published Online: September 1, 1995
View Article titled, Finite Element Viscoelastic Analysis of Temperature and Moisture Effects in Electronic Packaging
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Topics: Electronic packaging, Finite element analysis, Temperature, Stress, Creep, Cycles, Diffusion (Physics), Elastic analysis, Failure mechanisms, Finite element methods
Journal Articles

Influence of Polymer Viscoelasticity on a Bending Bilayer

B. D. Harper
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1994, 116(3): 191–197.
https://doi.org/10.1115/1.2905685
Published Online: September 1, 1994
View Article titled, Influence of Polymer Viscoelasticity on a Bending Bilayer
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Topics: Polymers, Viscoelasticity, Polymer films, Thermal stresses, Epoxy adhesives, Epoxy resins, Microelectronic packaging, Molding, Temperature, Viscoelastic materials