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Journal Articles

Heat Transfer Enhancement Through Array Jet Impingement on Strategically Placed High Porosity High Pore-Density Thin Copper Foams

Varun Prasanna Rajamuthu, Sanskar S. Panse, Srinath Ekkad

J. Electron. Packag. September 2021, 143(3): 031003.

Paper No: EP-20-1090

DOI: https://doi.org/10.1115/1.4049173

Published Online: January 19, 2021

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Topics: Density, Foams (Chemistry), Heat transfer, Porosity, Reynolds number, Metal foams, Copper, Flow (Dynamics), Jets

Journal Articles

Low-Dielectric Constant Nanoporous Epoxy for Electronic Packaging

Jisu Jiang, Landon Keller, Paul A. Kohl

J. Electron. Packag. March 2020, 142(1): 011006.

Paper No: EP-19-1031

DOI: https://doi.org/10.1115/1.4044626

Published Online: September 24, 2019

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Topics: Epoxy adhesives, Epoxy resins, Porosity

Includes: Supplementary data

Journal Articles

Challenges in Three-Dimensional Printing of High-Conductivity Copper

Tahany I. El-Wardany, Ying She, Vijay N. Jagdale, Jacquelynn K. Garofano, Joe J. Liou, Wayde R. Schmidt

J. Electron. Packag. June 2018, 140(2): 020907.

Paper No: EP-17-1104

DOI: https://doi.org/10.1115/1.4039974

Published Online: May 9, 2018

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Topics: Copper, Copper powders, Lasers, Porosity, Electrical conductivity, Additive manufacturing, Density, Modeling, Thermal conductivity

Journal Articles

Three-Dimensional Printed Dielectric Substrates for Radio Frequency Applications

Vana Snigdha Tummala, Ahsan Mian, Nowrin H. Chamok, Dhruva Poduval, Mohammod Ali, Jallisa Clifford, Prasun Majumdar

J. Electron. Packag. June 2017, 139(2): 020904.

Paper No: EP-16-1137

DOI: https://doi.org/10.1115/1.4036384

Published Online: June 12, 2017

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Topics: Additive manufacturing, Density, Dimensions, X-rays, Resonance, Microscopy, Manufacturing, Porosity, Design

Journal Articles

Measurement of Air Flow Rate Through Perforated Floor Tiles in a Raised Floor Data Center

Vaibhav K. Arghode, Taegyu Kang, Yogendra Joshi, Wally Phelps, Murray Michaels

J. Electron. Packag. March 2017, 139(1): 011007.

Paper No: EP-15-1115

DOI: https://doi.org/10.1115/1.4035596

Published Online: January 10, 2017

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Topics: Air flow, Flow (Dynamics), Tiles, Porosity, Data centers

Journal Articles

Experimental Investigation of Air Flow Through a Perforated Tile in a Raised Floor Data Center

Vaibhav K. Arghode, Yogendra Joshi

J. Electron. Packag. March 2015, 137(1): 011011.

Paper No: EP-14-1017

DOI: https://doi.org/10.1115/1.4028835

Published Online: March 1, 2015

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Topics: Air flow, Tiles, Porosity, Data centers

Journal Articles

Effect of Meniscus Recession on the Effective Pore Radius and Capillary Pumping of Copper Metal Foams

Mahmood R. S. Shirazy, Luc G. Fréchette

J. Electron. Packag. December 2014, 136(4): 041003.

Paper No: EP-13-1098

DOI: https://doi.org/10.1115/1.4026353

Published Online: September 19, 2014

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Topics: Containers, Copper, Evaporation, Flux (Metallurgy), Foams (Chemistry), Heat, Heat losses, Porosity, Temperature, Ethanol

Journal Articles

Performance of Axial Fans in Close Proximity to the Electromagnetic Compatibility Screens

R. Antón, A. Bengoechea, A. Rivas, J. C. Ramos, G. S. Larraona

J. Electron. Packag. March 2012, 134(1): 011004.

DOI: https://doi.org/10.1115/1.4005913

Published Online: March 19, 2012

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Topics: Fans, Flow (Dynamics), Porosity, Pressure, Electromagnetic compatibility, Air flow

Journal Articles

Numerical Modeling of Perforated Tile Flow Distribution in a Raised-Floor Data Center

Emad Samadiani, Jeffrey Rambo, Yogendra Joshi

J. Electron. Packag. June 2010, 132(2): 021002.

DOI: https://doi.org/10.1115/1.4001589

Published Online: May 20, 2010

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Topics: Computer simulation, Data centers, Flow (Dynamics), Pipes, Tiles, Air flow, Modeling, Porosity

Journal Articles

Merits of Employing Foam Encapsulated Phase Change Materials for Pulsed Power Electronics Cooling Applications

K. Lafdi, O. Mesalhy, A. Elgafy

J. Electron. Packag. June 2008, 130(2): 021004.

DOI: https://doi.org/10.1115/1.2912185

Published Online: April 25, 2008

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Topics: Cooling, Design, Fins, Heat, Heat sinks, Phase change materials, Porosity, Shapes, Temperature, Thermal conductivity

Journal Articles

Modeling of Resin Flow in Reinforced Dielectric Prepregs

Pavel Simacek, Suresh G. Advani, Kossi Zonvide, Leonard W. Barrett

J. Electron. Packag. June 2008, 130(2): 021001.

DOI: https://doi.org/10.1115/1.2837510

Published Online: April 15, 2008

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Topics: Copper, Flow (Dynamics), Pressure, Resins, Printed circuit boards, Permeability, Viscosity, Porosity

Journal Articles

Interstitial Heat Transfer Coefficient and Dispersion Conductivity in Compressed Metal Foam Heat Sinks

Sheng-Chung Tzeng, Tzer-Ming Jeng

J. Electron. Packag. June 2007, 129(2): 113–119.

DOI: https://doi.org/10.1115/1.2721081

Published Online: August 11, 2006

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Topics: Heat transfer coefficients, Metal foams, Porosity, Thermal conductivity, Aluminum, Electrical conductivity, Heat sinks, Heat transfer, Flow (Dynamics), Foams (Chemistry)

Journal Articles

In-Plane Effective Thermal Conductivity of Symmetric, Diamond-Weave Screen Laminates

Jun Xu, Richard A. Wirtz

J. Electron. Packag. September 2005, 127(3): 353–356.

DOI: https://doi.org/10.1115/1.1997162

Published Online: October 31, 2004

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Topics: Diamonds, Laminates, Thermal conductivity, Porosity

Journal Articles

A Novel Semi-empirical Model for Evaluating Thermal Performance of Porous Metallic Foam Heat Sinks

Tzer-Ming Jeng, Li-Kang Liu, Ying-Huei Hung

J. Electron. Packag. September 2005, 127(3): 223–234.

DOI: https://doi.org/10.1115/1.1997159

Published Online: May 8, 2004

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Topics: Aluminum, Fluids, Heat sinks, Heat transfer, Liquid crystals, Metal foams, Porosity, Reynolds number, Steady state, Temperature

Journal Articles

Why Gold Flash Can Be Detrimental to Long-Term Reliability

Jingsong Xie, Ming Sun, Michael Pecht, David F. Barbe

J. Electron. Packag. March 2004, 126(1): 37–40.

DOI: https://doi.org/10.1115/1.1646425

Published Online: April 30, 2004

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Topics: Corrosion, Reliability, Porosity, Diffusion (Physics), Corrosion resistance

Journal Articles

Experiments on Chimney-Enhanced Free Convection From Pin-Fin Heat Sinks

W. W. Thrasher, T. S. Fisher, K. E. Torrance

J. Electron. Packag. December 2000, 122(4): 350–355.

DOI: https://doi.org/10.1115/1.1289633

Published Online: February 10, 2000

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Topics: Heat sinks, Heat transfer, Porosity, Natural convection, Temperature

Journal Articles

Forced Convection Heat Transfer Augmentation in a Channel With A Localized Heat Source Using Fibrous Materials

D. Angirasa, G. P. Peterson

J. Electron. Packag. March 1999, 121(1): 1–7.

DOI: https://doi.org/10.1115/1.2792656

Published Online: March 1, 1999

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Topics: Forced convection, Heat, Reynolds number, Computer simulation, Convection, Electronic components, Flow (Dynamics), Fluid dynamics, Heat transfer, Porosity

Journal Articles

Application of Phase Change Materials to Thermal Control of Electronic Modules: A Computational Study

D. Pal, Y. K. Joshi

J. Electron. Packag. March 1997, 119(1): 40–50.

DOI: https://doi.org/10.1115/1.2792199

Published Online: March 1, 1997

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Topics: Phase change materials, Laminates, Transients (Dynamics), Computation, Computer simulation, Cooling, Cooling systems, Density, Dimensions, Enthalpy

Journal Articles

An Analysis of Shrinkage Porosity in Aluminum Ball Bonding Process

L. J. Huang, K. Ramakrishna, P. S. Ayyaswamy, I. M. Cohen

J. Electron. Packag. September 1989, 111(3): 199–206.

DOI: https://doi.org/10.1115/1.3226534

Published Online: September 1, 1989

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Topics: Aluminum, Bonding, Porosity, Shrinkage (Materials), Alloys, Metals, Density, Solidification, Accounting, Geometry

Journal citation

NARROW

Supplemental Material

Heat Transfer Enhancement Through Array Jet Impingement on Strategically Placed High Porosity High Pore-Density Thin Copper Foams

Low-Dielectric Constant Nanoporous Epoxy for Electronic Packaging

Challenges in Three-Dimensional Printing of High-Conductivity Copper

Three-Dimensional Printed Dielectric Substrates for Radio Frequency Applications

Measurement of Air Flow Rate Through Perforated Floor Tiles in a Raised Floor Data Center

Experimental Investigation of Air Flow Through a Perforated Tile in a Raised Floor Data Center

Effect of Meniscus Recession on the Effective Pore Radius and Capillary Pumping of Copper Metal Foams

Performance of Axial Fans in Close Proximity to the Electromagnetic Compatibility Screens

Numerical Modeling of Perforated Tile Flow Distribution in a Raised-Floor Data Center

Merits of Employing Foam Encapsulated Phase Change Materials for Pulsed Power Electronics Cooling Applications

Modeling of Resin Flow in Reinforced Dielectric Prepregs

Interstitial Heat Transfer Coefficient and Dispersion Conductivity in Compressed Metal Foam Heat Sinks

In-Plane Effective Thermal Conductivity of Symmetric, Diamond-Weave Screen Laminates

A Novel Semi-empirical Model for Evaluating Thermal Performance of Porous Metallic Foam Heat Sinks

Why Gold Flash Can Be Detrimental to Long-Term Reliability

Experiments on Chimney-Enhanced Free Convection From Pin-Fin Heat Sinks

Forced Convection Heat Transfer Augmentation in a Channel With A Localized Heat Source Using Fibrous Materials

Application of Phase Change Materials to Thermal Control of Electronic Modules: A Computational Study

An Analysis of Shrinkage Porosity in Aluminum Ball Bonding Process

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