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Journal Articles

A Comparative Numerical Analysis of Cold Plates for Thermal Management of Chips With Hotspots

Mahdi Farahikia, Ping-Chuan Wang, Louis Reyes, Matthew Krumholtz
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2024, 146(3): 034501.
Paper No: EP-23-1066
https://doi.org/10.1115/1.4064523
Published Online: February 7, 2024
View Article titled, A Comparative Numerical Analysis of Cold Plates for Thermal Management of Chips With Hotspots
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Topics: Coolants, Fins, Numerical analysis, Plates (structures), Pumps, Temperature, Temperature distribution, Thermal management, Thermal resistance, Flow (Dynamics)
Journal Articles

Recent Developments in Air Pumps for Thermal Management of Electronics

Tsrong-Yi Wen, Jia-Cheng Ye
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. September 2022, 144(3): 030802.
Paper No: EP-20-1109
https://doi.org/10.1115/1.4051970
Published Online: October 1, 2021
View Article titled, Recent Developments in Air Pumps for Thermal Management of Electronics
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Topics: Pumps, Flow (Dynamics), Diaphragms (Mechanical devices), Diaphragms (Structural), Fans, Electronics, Cooling
Journal Articles

Experimental Characterization of Two-Phase Cooling of Power Electronics in Thermosiphon and Forced Convection Modes

Fabio Battaglia, Farah Singer, David C. Deisenroth, Michael M. Ohadi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2021, 143(3): 031006.
Paper No: EP-19-1118
https://doi.org/10.1115/1.4049564
Published Online: February 19, 2021
View Article titled, Experimental Characterization of Two-Phase Cooling of Power Electronics in Thermosiphon and Forced Convection Modes
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Topics: Cooling, Flow (Dynamics), Heat, Heat flux, Microchannels, Pumps, Refrigerants, Temperature, Electronics, Flux (Metallurgy)
Journal Articles

Design and Optimization of Control Strategy to Reduce Pumping Power in Dynamic Liquid Cooling

Rajesh Kasukurthy, Amruthavalli Rachakonda, Dereje Agonafer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2021, 143(3): 031001.
Paper No: EP-20-1016
https://doi.org/10.1115/1.4049018
Published Online: January 19, 2021
View Article titled, Design and Optimization of Control Strategy to Reduce Pumping Power in Dynamic Liquid Cooling
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Topics: Computational fluid dynamics, Coolants, Cooling, Flow (Dynamics), Flow control, Matlab, Optimization, Plates (structures), Temperature, Testing
Journal Articles

Minimizing the Effects of On-Chip Hotspots Using Multi-Objective Optimization of Flow Distribution in Water-Cooled Parallel Microchannel Heatsinks

Yaser Hadad, Vahideh Radmard, Srikanth Rangarajan, Mahdi Farahikia, Gamal Refai-Ahmed, Paul R. Chiarot, Bahgat Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2021, 143(2): 021007.
Paper No: EP-19-1111
https://doi.org/10.1115/1.4048590
Published Online: October 30, 2020
View Article titled, Minimizing the Effects of On-Chip Hotspots Using Multi-Objective Optimization of Flow Distribution in Water-Cooled Parallel Microchannel Heatsinks
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Topics: Design, Electrical resistivity, Flow (Dynamics), Pumps, Temperature, Optimization, Microchannels, Coolants, Pareto optimization, Heat flux
Journal Articles

Study of a Lab-Scale Organic Rankine Cycle for the Ultra-Low-Temperature Waste Heat Recovery Associated With Data Centers

Sebastian Araya, Aaron P. Wemhoff, Gerard F. Jones, Amy S. Fleischer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2021, 143(2): 021001.
Paper No: EP-19-1102
https://doi.org/10.1115/1.4047843
Published Online: August 7, 2020
View Article titled, Study of a Lab-Scale Organic Rankine Cycle for the Ultra-Low-Temperature Waste Heat Recovery Associated With Data Centers
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Topics: Heat, Heat recovery, Organic Rankine cycle, Temperature, Data centers, Pumps
Journal Articles

Experimental Study of Flexible Electrohydrodynamic Conduction Pumping for Electronics Cooling

Nathaniel J. O'Connor, Alexander J. Castaneda, Pavolas N. Christidis, Nicolas Vayas Tobar, Michal Talmor, Jamal Yagoobi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041105.
Paper No: EP-20-1021
https://doi.org/10.1115/1.4047459
Published Online: June 23, 2020
View Article titled, Experimental Study of Flexible Electrohydrodynamic Conduction Pumping for Electronics Cooling
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Topics: Computer cooling, Electrohydrodynamics, Flow (Dynamics), Fluids, Heat conduction, Pumps, Electrodes, Design, Electric fields
Journal Articles

Thermomechanical Degradation of Thermal Interface Materials: Accelerated Test Development and Reliability Analysis

Hayden Carlton, Dustin Pense, David Huitink
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031112.
Paper No: EP-19-1122
https://doi.org/10.1115/1.4047099
Published Online: May 21, 2020
View Article titled, Thermomechanical Degradation of Thermal Interface Materials: Accelerated Test Development and Reliability Analysis
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Topics: Temperature, Testing, Thermal resistance, Thermomechanics, Failure, Pumps, Steady state
Journal Articles

Measurement of the Thermal Performance of a Custom-Build Single-Phase Immersion Cooled Server at Various High and Low Temperatures for Prolonged Time

Pratik V. Bansode, Jimil M. Shah, Gautam Gupta, Dereje Agonafer, Harsh Patel, David Roe, Rick Tufty
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2020, 142(1): 011010.
Paper No: EP-18-1094
https://doi.org/10.1115/1.4045156
Published Online: November 8, 2019
View Article titled, Measurement of the Thermal Performance of a Custom-Build Single-Phase Immersion Cooled Server at Various High and Low Temperatures for Prolonged Time
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Topics: Fluids, Pumps, Temperature, Thermocouples, Low temperature, Energy consumption
Journal Articles

Design and Control of the IBM Power 775 Supercomputer Water Conditioning Unit

Michael J. Ellsworth, Jr., Randy J. Zoodsma, Frank Cascio, Eileen Behrendt
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2014, 136(4): 041009.
Paper No: EP-13-1124
https://doi.org/10.1115/1.4028119
Published Online: September 19, 2014
View Article titled, Design and Control of the IBM Power 775 Supercomputer Water Conditioning Unit
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Topics: Design, Flow (Dynamics), Pumps, Reservoirs, Sensors, Temperature, Water, Valves, Algorithms, Electronics
Journal Articles

Flow and Heat Transfer Analysis of an Electro-Osmotic Flow Micropump for Chip Cooling

K. Pramod, A. K. Sen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2014, 136(3): 031012.
Paper No: EP-13-1137
https://doi.org/10.1115/1.4027657
Published Online: June 5, 2014
View Article titled, Flow and Heat Transfer Analysis of an Electro-Osmotic Flow Micropump for Chip Cooling
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Topics: Electroosmosis, Flow (Dynamics), Micropumps, Pressure, Temperature, Cascades (Fluid dynamics), Design, Cooling, Heat transfer, Pumps
Journal Articles

Design of Practical Liquid Metal Cooling Device for Heat Dissipation of High Performance CPUs

Yueguang Deng, Jing Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2010, 132(3): 031009.
https://doi.org/10.1115/1.4002012
Published Online: September 9, 2010
View Article titled, Design of Practical Liquid Metal Cooling Device for Heat Dissipation of High Performance CPUs
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Topics: Cooling, Design, Energy dissipation, Heat, Liquid metals, Pumps, Thermal resistance, Water, Flow (Dynamics), Engineering prototypes
Journal Articles

Microscale and Nanoscale Thermal Characterization Techniques

J. Christofferson, K. Maize, Y. Ezzahri, J. Shabani, X. Wang, A. Shakouri
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Thermal Issues In Emerging Technologies Theory And Applications, Theta
J. Electron. Packag. December 2008, 130(4): 041101.
https://doi.org/10.1115/1.2993145
Published Online: November 13, 2008
View Article titled, Microscale and Nanoscale Thermal Characterization Techniques
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Topics: Imaging, Microscale devices, Nanoscale phenomena, Probes, Resolution (Optics), Temperature, Thermal characterization, Thermoreflectance, Wavelength, Atomic force microscopy
Journal Articles

Experimental and Numerical Thermal Transient Behavior of Chips in a Liquid Channel During Loss of Pumping Power

C. P. Tso, K. W. Tou, H. Bhowmik
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 546–553.
https://doi.org/10.1115/1.1827270
Published Online: January 24, 2005
View Article titled, Experimental and Numerical Thermal Transient Behavior of Chips in a Liquid Channel During Loss of Pumping Power
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Topics: Natural convection, Steady state, Transients (Dynamics), Heat, Temperature, Flow (Dynamics), Coolants, Water, Heat transfer, Pumps
Journal Articles

Thermal Performance of Next Generation of Modulated Pump Lasers in Telco Equipment

Gamal Refai-Ahmed, Fellow ASME, Stephanie Trottier
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 535–540.
https://doi.org/10.1115/1.1773199
Published Online: January 24, 2005
View Article titled, Thermal Performance of Next Generation of Modulated Pump Lasers in Telco Equipment
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Topics: Cycles, Lasers, Pumps, Temperature, Thermal resistance
Journal Articles

An Experimental Study of Transient Heat Transfer From Discrete Heat Sources in Water Cooled Vertical Rectangular Channel

H. Bhowmik, K. W. Tou
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 193–199.
https://doi.org/10.1115/1.1997155
Published Online: July 13, 2004
View Article titled, An Experimental Study of Transient Heat Transfer From Discrete Heat Sources in Water Cooled Vertical Rectangular Channel
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Topics: Flow (Dynamics), Forced convection, Heat, Heat transfer, Laminar flow, Pumps, Temperature, Transient heat transfer, Transients (Dynamics), Water
Journal Articles

Photothermal Reliability Testing of a Multilayer Coating—Substrate Assembly: A Theoretical Approach

T. Elperin, G. Rudin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1998, 120(1): 82–88.
https://doi.org/10.1115/1.2792290
Published Online: March 1, 1998
View Article titled, Photothermal Reliability Testing of a Multilayer Coating—Substrate Assembly: A Theoretical Approach
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Topics: Accelerated life testing, Coating processes, Coatings, Manufacturing, Deflection, Pumps, Laser beams, Probes, Temperature, Thermal stresses