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Journal Articles

Passive Cooling of Protruding Electronic Components by Latent Heat of Fusion Storage

Mustapha Faraji, Hamid El Qarnia

Publisher: ASME

J. Electron. Packag. June 2009, 131(2): 021011.

https://doi.org/10.1115/1.3103953

Published Online: April 3, 2009

View Article titled, Passive Cooling of Protruding Electronic Components by Latent Heat of Fusion Storage

Topics: Cooling, Electronic components, Heat, Heat conduction, Heat transfer, Melting, Rayleigh number, Temperature, Phase change materials, Heat sinks

Journal Articles

Mixed Convection of Impinging Air Cooling Over Heat Sink in Telecom System Application

Siddharth Bhopte, Musa S. Alshuqairi, Dereje Agonafer, Fellow ASME, Gamal Refai-Ahmed, Fellow ASME

Publisher: ASME

J. Electron. Packag. December 2004, 126(4): 519–523.

https://doi.org/10.1115/1.1827267

Published Online: January 24, 2005

View Article titled, Mixed Convection of Impinging Air Cooling Over Heat Sink in Telecom System Application

Topics: Heat sinks, Mixed convection, Reynolds number, Nozzles, Cooling, Computer simulation, Heat, Flow (Dynamics), Rayleigh number

Journal Articles

Thermobuoyancy Treatment for Electronic Packaging Using an Improved Advection Scheme

Masoud Darbandi, Assistant Professor,, Gerry E. Schneider, Professor,

Publisher: ASME

J. Electron. Packag. June 2003, 125(2): 244–250.

https://doi.org/10.1115/1.1569508

Published Online: June 10, 2003

View Article titled, Thermobuoyancy Treatment for Electronic Packaging Using an Improved Advection Scheme

Topics: Approximation, Buoyancy, Cavities, Electronic packaging, Flow (Dynamics), Fluid dynamics, Heat transfer, Modeling, Natural convection, Rayleigh number

Journal Articles

Natural Convection in Shallow, Horizontal Air Layers Encountered in Electronic Cooling

Elias Papanicolaou, Sridhar Gopalakrishna

Publisher: ASME

J. Electron. Packag. December 1995, 117(4): 307–316.

https://doi.org/10.1115/1.2792110

Published Online: December 1, 1995

View Article titled, Natural Convection in Shallow, Horizontal Air Layers Encountered in Electronic Cooling

Topics: Computer cooling, Natural convection, Convection, Heat transfer, Cooling, Dimensions, Energy conservation, Heat conduction, Heat flux, Heating

Journal Articles

Effect of Wall Conduction on Natural Convection in an Enclosure With a Centered Heat Source

Yi-Hsiang Huang, Suresh K. Aggarwal

Publisher: ASME

J. Electron. Packag. December 1995, 117(4): 301–306.

https://doi.org/10.1115/1.2792109

Published Online: December 1, 1995

View Article titled, Effect of Wall Conduction on Natural Convection in an Enclosure With a Centered Heat Source

Topics: Heat, Heat conduction, Natural convection, Heat transfer, Thermal conductivity, Wall thickness, Rayleigh number, Algorithms, Boundary-value problems, Cavities

Journal Articles

On the Natural Convection in a Cavity With a Cooled Top Wall and Multiple Protruding Heaters

C. P. Desai, K. Vafai, M. Keyhani

Publisher: ASME

J. Electron. Packag. March 1995, 117(1): 34–45.

https://doi.org/10.1115/1.2792065

Published Online: March 1, 1995

View Article titled, On the Natural Convection in a Cavity With a Cooled Top Wall and Multiple Protruding Heaters

Topics: Cavities, Natural convection, Flow (Dynamics), Rayleigh number, Cooling, Electronic equipment, Heat sinks, Secondary cells, Temperature

Journal Articles

Transient Natural Convection From a Leadless Chip Carrier in a Liquid Filled Enclosure: A Numerical Study

D. Wroblewski, Y. Joshi

Publisher: ASME

J. Electron. Packag. September 1992, 114(3): 271–279.

https://doi.org/10.1115/1.2905451

Published Online: September 1, 1992

View Article titled, Transient Natural Convection From a Leadless Chip Carrier in a Liquid Filled Enclosure: A Numerical Study

Topics: Natural convection, Transients (Dynamics), Fluids, Temperature, Heat conduction, Heat, Coolants, Flow (Dynamics), Plumes (Fluid dynamics), Steady state

Journal Articles

Influence of Discrete Heat Source Location on Natural Convection Heat Transfer in a Vertical Square Enclosure

G. Refai Ahmed, M. M. Yovanovich

Publisher: ASME

J. Electron. Packag. September 1991, 113(3): 268–274.

https://doi.org/10.1115/1.2905406

Published Online: September 1, 1991

View Article titled, Influence of Discrete Heat Source Location on Natural Convection Heat Transfer in a Vertical Square Enclosure

Topics: Heat, Heat transfer, Natural convection, Heat conduction, Rayleigh number, Thermal conductivity

Journal Articles

Mixed Convective Heat Transfer From a Simulated Microchip to Liquid Flows in a Horizontal Rectangular Channel

Y. Chin, C. F. Ma, X. Q. Gu, L. Xu

Publisher: ASME

J. Electron. Packag. September 1991, 113(3): 309–312.

https://doi.org/10.1115/1.2905411

Published Online: September 1, 1991

View Article titled, Mixed Convective Heat Transfer From a Simulated Microchip to Liquid Flows in a Horizontal Rectangular Channel

Topics: Convection, Flow (Dynamics), Integrated circuits, Heat transfer, Buoyancy, Forced convection, Mixed convection, Rayleigh number, Reynolds number

Journal Articles

Natural Convection Cooling of a Horizontally Oriented Component Board Mounted in a Low-Aspect-Ratio Enclosure

R. J. Krane, T. J. Phillips

Publisher: ASME

J. Electron. Packag. September 1991, 113(3): 301–308.

https://doi.org/10.1115/1.2905410

Published Online: September 1, 1991

View Article titled, Natural Convection Cooling of a Horizontally Oriented Component Board Mounted in a Low-Aspect-Ratio Enclosure

Topics: Cooling, Natural convection, Electronic components, Geometry, Heat flux, Heat transfer, Rayleigh number, Temperature

Journal Articles

Free Convection in a Discretely Heated Vertical Enclosure: Effects of Prandtl Number and Cavity Size

V. Prasad, M. Keyhani, R. Shen

Publisher: ASME

J. Electron. Packag. March 1990, 112(1): 63–74.

https://doi.org/10.1115/1.2904343

Published Online: March 1, 1990

View Article titled, Free Convection in a Discretely Heated Vertical Enclosure: Effects of Prandtl Number and Cavity Size

Topics: Cavities, Natural convection, Prandtl number, Flow (Dynamics), Temperature, Flow visualization, Dielectric liquids, Heat, Heat transfer coefficients, Rayleigh number

Journal citation

NARROW

Passive Cooling of Protruding Electronic Components by Latent Heat of Fusion Storage

Mixed Convection of Impinging Air Cooling Over Heat Sink in Telecom System Application

Thermobuoyancy Treatment for Electronic Packaging Using an Improved Advection Scheme

Natural Convection in Shallow, Horizontal Air Layers Encountered in Electronic Cooling

Effect of Wall Conduction on Natural Convection in an Enclosure With a Centered Heat Source

On the Natural Convection in a Cavity With a Cooled Top Wall and Multiple Protruding Heaters

Transient Natural Convection From a Leadless Chip Carrier in a Liquid Filled Enclosure: A Numerical Study

Influence of Discrete Heat Source Location on Natural Convection Heat Transfer in a Vertical Square Enclosure

Mixed Convective Heat Transfer From a Simulated Microchip to Liquid Flows in a Horizontal Rectangular Channel

Natural Convection Cooling of a Horizontally Oriented Component Board Mounted in a Low-Aspect-Ratio Enclosure

Free Convection in a Discretely Heated Vertical Enclosure: Effects of Prandtl Number and Cavity Size

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