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Journal Articles

Performance Assessment of Single and Multiple Jet Impingement Configurations in a Refrigeration-Based Compact Heat Sink for Electronics Cooling

Pablo A. de Oliveira, Jader R. Barbosa, Jr.
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031005.
Paper No: EP-17-1008
https://doi.org/10.1115/1.4036817
Published Online: June 28, 2017
View Article titled, Performance Assessment of Single and Multiple Jet Impingement Configurations in a Refrigeration-Based Compact Heat Sink for Electronics Cooling
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Topics: Compressors, Cooling, Heat, Heat sinks, Heat transfer, Refrigeration, Stress, Temperature, Flow (Dynamics), Refrigerants
Journal Articles

Absorption Heat Pump/Refrigeration System Utilizing Ionic Liquid and Hydrofluorocarbon Refrigerants

Sarah Kim, Yoon Jo Kim, Yogendra K. Joshi, Andrei G. Fedorov, Paul A. Kohl
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2012, 134(3): 031009.
https://doi.org/10.1115/1.4007111
Published Online: July 23, 2012
View Article titled, Absorption Heat Pump/Refrigeration System Utilizing Ionic Liquid and Hydrofluorocarbon Refrigerants
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Topics: Absorption, Fluids, Heat pumps, Refrigerants, Refrigeration, Temperature, Pressure, Cooling, Heat
Journal Articles

Optimization of Enclosed Aisle Data Centers Using Bypass Recirculation

Dustin W. Demetriou, H. Ezzat Khalifa
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Photo Gallery
J. Electron. Packag. June 2012, 134(2): 020904.
https://doi.org/10.1115/1.4005907
Published Online: June 11, 2012
View Article titled, Optimization of Enclosed Aisle Data Centers Using Bypass Recirculation
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Topics: Computational fluid dynamics, Cooling, Data centers, Energy consumption, Flow (Dynamics), Optimization, Temperature, Tiles, Refrigeration, Fans
Journal Articles

Effect of Variable Heating Load on the Refrigerant Distribution of a Dual Cold-Plate System

Cheng-Wei Tien, Kun-Huang Yu, Wen-Junn Sheu, Chi-Chuan Wang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. June 2009, 131(2): 024501.
https://doi.org/10.1115/1.3103940
Published Online: March 27, 2009
View Article titled, Effect of Variable Heating Load on the Refrigerant Distribution of a Dual Cold-Plate System
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Topics: Heating, Plates (structures), Refrigerants, Stress, Cooling, Vapors, Superheating, Two-phase flow, Pressure drop, Pressure
Journal Articles

Editorial

Bahgat Sammakia, Mohamed-Nabil Sabry
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Editorial
J. Electron. Packag. December 2008, 130(4): 040201.
https://doi.org/10.1115/1.3039759
Published Online: November 17, 2008
View Article titled, Editorial
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Topics: Biomedical engineering, Computers, Cooling, Data centers, Electronic packaging, Electronic systems, Electronics, Engineering teachers, Experimental methods, Fuel cells
Journal Articles

An Alternative Method for the Cooling of Power Microelectronics Using Classical Refrigeration

Victor Chiriac, Florea Chiriac
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Thermal Issues In Emerging Technologies Theory And Applications, Theta
J. Electron. Packag. December 2008, 130(4): 041103.
https://doi.org/10.1115/1.2993148
Published Online: November 13, 2008
View Article titled, An Alternative Method for the Cooling of Power Microelectronics Using Classical Refrigeration
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Topics: Compressors, Condensers (steam plant), Cooling, Design, Microchannels, Refrigerants, Refrigeration, Vapors, Compression, Microelectronic devices
Journal Articles

Experimental Investigation of Compact Evaporators for Ultralow Temperature Refrigeration of Microprocessors

Robert Wadell, Yogendra K. Joshi, Andrei G. Fedorov
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 291–299.
https://doi.org/10.1115/1.2753919
Published Online: March 28, 2007
View Article titled, Experimental Investigation of Compact Evaporators for Ultralow Temperature Refrigeration of Microprocessors
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Topics: Flow (Dynamics), Heat, Heat flux, Heat transfer, Refrigeration, Temperature, Pressure drop, Refrigerants, Microchannels
Journal Articles

Implementation of Microchannel Evaporator for High-Heat-Flux Refrigeration Cooling Applications

Jaeseon Lee, Issam Mudawar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2006, 128(1): 30–37.
https://doi.org/10.1115/1.2159006
Published Online: June 17, 2005
View Article titled, Implementation of Microchannel Evaporator for High-Heat-Flux Refrigeration Cooling Applications
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Topics: Compressors, Cooling, Heat, Heat sinks, Microchannels, Pressure drop, Refrigeration, Temperature, Compression, Heat transfer coefficients
Journal Articles

Impact of TXV and Compressor in the Stability of a High-End Computer Refrigeration System

Yasin Makwana, Dereje Agonafer, Fellow ASME, Dan Manole
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 554–559.
https://doi.org/10.1115/1.1827272
Published Online: January 24, 2005
View Article titled, Impact of TXV and Compressor in the Stability of a High-End Computer Refrigeration System
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Topics: Compressors, Refrigeration, Temperature, Stress, Computers, Stability, Vapors, Valves