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Journal Articles

Experiment and Numerical Analysis of the Residual Stresses in Underfill Resins for Flip Chip Package Applications

Man-Lung Sham, Jang-Kyo Kim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 47–51.
https://doi.org/10.1115/1.1849232
Published Online: March 21, 2005
View Article titled, Experiment and Numerical Analysis of the Residual Stresses in Underfill Resins for Flip Chip Package Applications
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Topics: Residual stresses, Resins, Strips, Numerical analysis, Temperature, Finite element analysis, Stress
Journal Articles

Residual Stresses in Multilayer Ceramic Capacitors: Measurement and Computation

Jaap M. J. den Toonder, Mem. ASME, Christian W. Rademaker, Ching-Li Hu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 506–511.
https://doi.org/10.1115/1.1604151
Published Online: December 15, 2003
View Article titled, Residual Stresses in Multilayer Ceramic Capacitors: Measurement and Computation
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Topics: Capacitors, Ceramics, Computation, Computer simulation, Cooling, Finite element analysis, Residual stresses, Simulation, Sintering, Stress
Journal Articles

Intrinsic Strain Modeling and Residual Stress Analysis for Thin-Film Processing of Layered Structures

Mehrdad N. Ghasemi Nejhad, Mem. ASME, Chiling Pan, Hongwei Feng
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 4–17.
https://doi.org/10.1115/1.1512295
Published Online: March 14, 2003
View Article titled, Intrinsic Strain Modeling and Residual Stress Analysis for Thin-Film Processing of Layered Structures
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Topics: Finite element analysis, Modeling, Residual stresses, Stress, Stress analysis (Engineering), Temperature, Thin films, Microelectromechanical systems
Journal Articles

Experimental Investigation of Residual Stresses in Layered Materials Using Moire´ Interferometry

Keith B. Bowman, David H. Mollenhauer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 340–344.
https://doi.org/10.1115/1.1497627
Published Online: December 12, 2002
View Article titled, Experimental Investigation of Residual Stresses in Layered Materials Using Moire´ Interferometry
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Topics: Interferometry, Polymers, Residual stresses, Stress, Laminates, Temperature, Displacement, Stress concentration
Journal Articles

A Reexamination of Residual Stresses in Thin Films and of the Validity of Stoney’s Estimate

C. Y. Hui, H. D. Conway, Y. Y. Lin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2000, 122(3): 267–273.
https://doi.org/10.1115/1.1287930
Published Online: September 1, 2000
View Article titled, A Reexamination of Residual Stresses in Thin Films and of the Validity of Stoney’s Estimate
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Topics: Stress, Thin films, Fracture (Materials), Composite materials, Residual stresses, Deformation
Journal Articles

A Study of Process-Induced Residual Stress in PBGA Packages

Zhu Wu, Jian Lu, Mem. ASME, Yifan Guo, Mem. ASME
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2000, 122(3): 262–266.
https://doi.org/10.1115/1.1285983
Published Online: December 8, 1999
View Article titled, A Study of Process-Induced Residual Stress in PBGA Packages
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Topics: Calibration, Displacement, Stress, Residual stresses, Interferometry
Journal Articles

Cooling Rate Effect on Post Cure Stresses in Molded Plastic IC Packages

S. Yi, K. Y. Sze
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1998, 120(4): 385–390.
https://doi.org/10.1115/1.2792651
Published Online: December 1, 1998
View Article titled, Cooling Rate Effect on Post Cure Stresses in Molded Plastic IC Packages
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Topics: Cooling, Finite element analysis, Hardening (Curing), Heat conduction, Manufacturing, Materials properties, Molded plastics, Molding, Residual stresses, Stress
Journal Articles

Process Induced Stresses of a Flip-Chip Packaging by Sequential Processing Modeling Technique

J. Wang, Z. Qian, S. Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1998, 120(3): 309–313.
https://doi.org/10.1115/1.2792638
Published Online: September 1, 1998
View Article titled, Process Induced Stresses of a Flip-Chip Packaging by Sequential Processing Modeling Technique
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Topics: Flip-chip, Modeling, Packaging, Stress, Manufacturing, Deflection, Finite element analysis, Warping, Alloys, Bonding
Journal Articles

In Situ Evaluation of Residual Stresses in an Organic Die-Attach Adhesive

A. S. Voloshin, P.-H. Tsao, R. A. Pearson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 1998, 120(3): 314–318.
https://doi.org/10.1115/1.2792639
Published Online: September 1, 1998
View Article titled, In Situ Evaluation of Residual Stresses in an Organic Die-Attach Adhesive
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Topics: Adhesives, Residual stresses, Epoxy adhesives, Epoxy resins, Stress, Hardening (Curing), Absorption, Cooling, Interferometry, Relaxation (Physics)
Journal Articles

Measurement of Wafer Surface Using Shadow Moire´ Technique With Talbot Effect

S. Wei, S. Wu, I. Kao, F. P. Chiang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. June 1998, 120(2): 166–170.
https://doi.org/10.1115/1.2792612
Published Online: June 1, 1998
View Article titled, Measurement of Wafer Surface Using Shadow Moire´ Technique With Talbot Effect
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Topics: Semiconductor wafers, Shades and shadows, Diffraction gratings, Diffraction patterns, Inspection, Resolution (Optics), Warping, Lasers, Light sources, Probes
Journal Articles

A Rubbery Cure Shrinkage Model for Analyzing Encapsulated Assemblies

R. S. Chambers, R. R. Lagasse, T. R. Guess, D. J. Plazek, C. Bero
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 1995, 117(3): 249–254.
https://doi.org/10.1115/1.2792101
Published Online: September 1, 1995
View Article titled, A Rubbery Cure Shrinkage Model for Analyzing Encapsulated Assemblies
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Topics: Shrinkage (Materials), Hardening (Curing), Epoxy resins, Finite element analysis, Stress, Temperature, Constitutive equations, Cooling, Damage, Delamination
Journal Articles

Residual Stresses for In-Situ Deposition of Thin-Film High-Temperature Superconductors

P. E. Phelan, M. N. Ghasemi Nejhad
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1994, 116(4): 249–257.
https://doi.org/10.1115/1.2905695
Published Online: December 1, 1994
View Article titled, Residual Stresses for In-Situ Deposition of Thin-Film High-Temperature Superconductors
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Topics: High temperature superconductors, Residual stresses, Thin films, Oxygen, Stress, Dimensions, Shrinkage (Materials), Stoichiometry, Temperature, Thermal expansion
Journal Articles

Low Temperature Transient Liquid Phase (LTTLP) Bonding for Au/Cu and Cu/Cu Interconnections

M. M. Hou, Thomas W. Eagar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1992, 114(4): 443–447.
https://doi.org/10.1115/1.2905478
Published Online: December 1, 1992
View Article titled, Low Temperature Transient Liquid Phase (LTTLP) Bonding for Au/Cu and Cu/Cu Interconnections
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Topics: Bonding, Low temperature, Transients (Dynamics), Temperature, Tin, Copper, Fatigue, Solders, Aluminum, Diffusion bonding (Metals)
Journal Articles

Solder Creep-Fatigue Analysis by an Energy-Partitioning Approach

A. Dasgupta, C. Oyan, D. Barker, M. Pecht
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1992, 114(2): 152–160.
https://doi.org/10.1115/1.2906412
Published Online: June 1, 1992
View Article titled, Solder Creep-Fatigue Analysis by an Energy-Partitioning Approach
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Topics: Creep, Fatigue, Solders, Temperature, Cycles, Damage, Finite element methods, Solder joints, Stress, Constitutive equations
Journal Articles

Thermal Stresses in Layered Electrical Assemblies Bonded With Solder

H. S. Morgan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1991, 113(4): 350–354.
https://doi.org/10.1115/1.2905419
Published Online: December 1, 1991
View Article titled, Thermal Stresses in Layered Electrical Assemblies Bonded With Solder
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Topics: Solders, Thermal stresses, Plane strain, Corners (Structural elements), Stress, Creep, Residual stresses, Three-dimensional models, Cooling, Finite element model
Journal Articles

Thermomechanical Behavior of Multilayer Structures in Microelectronics

I. M. Daniel, T.-M. Wang, J. T. Gotro
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1990, 112(1): 11–15.
https://doi.org/10.1115/1.2904332
Published Online: March 1, 1990
View Article titled, Thermomechanical Behavior of Multilayer Structures in Microelectronics
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Topics: Deformation, Epoxy adhesives, Epoxy resins, Glass, Hardening (Curing), Laminates, Lamination, Microelectronic devices, Polymerization, Residual stresses
Journal Articles

Slow Crack Growth in Glasses and Ceramics Under Residual and Applied Stresses

F. Erdogan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1989, 111(1): 61–67.
https://doi.org/10.1115/1.3226510
Published Online: March 1, 1989
View Article titled, Slow Crack Growth in Glasses and Ceramics Under Residual and Applied Stresses
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Topics: Ceramics, Fracture (Materials), Glass, Stress, Residual stresses, Failure, Plates (structures), Surface cracks