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Journal Articles

Simultaneous Measurement of Temperature and Strain in Electronic Packages Using Multiframe Super-Resolution Infrared Thermography and Digital Image Correlation

Sara K. Lyons, Aditya Chandramohan, Justin A. Weibel, Suresh V. Garimella

J. Electron. Packag. December 2022, 144(4): 041019.

Paper No: EP-21-1161

DOI: https://doi.org/10.1115/1.4054263

Published Online: April 22, 2022

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Topics: Resolution (Optics), Temperature, Thermography, Deformation, Temperature measurement, Emissivity

Journal Articles

Error Reduction in Infrared Thermography by Multiframe Super-Resolution

Aditya Chandramohan, Sara K. Lyons, Justin A. Weibel, Suresh V. Garimella

J. Electron. Packag. December 2018, 140(4): 041008.

Paper No: EP-18-1028

DOI: https://doi.org/10.1115/1.4041360

Published Online: October 1, 2018

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Topics: Emissivity, Errors, Resolution (Optics), Temperature, Thermography, Uncertainty

Journal Articles

Transient Data Processing of Flow Boiling Local Heat Transfer in a Multi-Microchannel Evaporator Under a Heat Flux Disturbance

Houxue Huang, Nicolas Lamaison, John R. Thome

J. Electron. Packag. March 2017, 139(1): 011005.

Paper No: EP-16-1083

DOI: https://doi.org/10.1115/1.4035386

Published Online: January 5, 2017

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Topics: Boiling, Flow (Dynamics), Fluids, Heat conduction, Heat flux, Heat transfer, Heat transfer coefficients, Microchannels, Pressure drop, Temperature

Journal Articles

Maximum Resolution of a Probe-Based, Steady-State Thermal Interface Material Characterization Instrument

Ronald J. Warzoha, Andrew N. Smith, Maurice Harris

J. Electron. Packag. March 2017, 139(1): 011004.

Paper No: EP-16-1075

DOI: https://doi.org/10.1115/1.4035178

Published Online: December 29, 2016

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Topics: Heat, Instrumentation, Probes, Resolution (Optics), Steady state, Uncertainty, Heat flux, Measurement uncertainty, Fillers (Materials), Temperature measurement

Journal Articles

Comparison of Warpage Measurement Capabilities and Results Obtained by Using Laser and Digital Fringe Projection Methods

Sungbum Kang, I. Charles Ume

J. Electron. Packag. September 2014, 136(3): 031007.

Paper No: EP-13-1074

DOI: https://doi.org/10.1115/1.4027425

Published Online: May 12, 2014

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Topics: Diffraction gratings, Lasers, Resolution (Optics), Warping, Printed circuit boards, Accuracy and precision

Journal Articles

Room Level Modeling of Air Flow in a Contained Data Center Aisle

Vaibhav K. Arghode, Yogendra Joshi

J. Electron. Packag. March 2014, 136(1): 011011.

Paper No: EP-13-1087

DOI: https://doi.org/10.1115/1.4026540

Published Online: February 14, 2014

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Topics: Air entrainment, Air flow, Containment, Data centers, Flow (Dynamics), Modeling, Temperature, Tiles, Momentum, Resolution (Optics)

Journal Articles

Application of Synchrotron Radiation X-Ray Microtomography to Nondestructive Evaluation of Thermal Fatigue Process in Flip Chip Interconnects

Hiroyuki Tsuritani, Toshihiko Sayama, Yoshiyuki Okamoto, Takeshi Takayanagi, Kentaro Uesugi, Takao Mori

J. Electron. Packag. June 2011, 133(2): 021007.

DOI: https://doi.org/10.1115/1.4003992

Published Online: June 23, 2011

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Topics: Cycles, Fatigue, Fatigue cracks, Flip-chip, Flip-chip devices, Nondestructive evaluation, Solders, Synchrotron radiation, X-rays, Imaging

Journal Articles

A Novel Projection Moiré System for Measuring PWBA Warpage Using Simulated Optimized Convective Reflow Process

Reinhard E. Powell, I. Charles Ume

J. Electron. Packag. June 2009, 131(2): 021006.

DOI: https://doi.org/10.1115/1.3103938

Published Online: April 1, 2009

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Topics: Warping, Printed circuit boards, Measurement systems, Resolution (Optics)

Journal Articles

Microscale and Nanoscale Thermal Characterization Techniques

J. Christofferson, K. Maize, Y. Ezzahri, J. Shabani, X. Wang, A. Shakouri

J. Electron. Packag. December 2008, 130(4): 041101.

DOI: https://doi.org/10.1115/1.2993145

Published Online: November 13, 2008

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Topics: Imaging, Microscale devices, Nanoscale phenomena, Probes, Resolution (Optics), Temperature, Thermal characterization, Thermoreflectance, Wavelength, Atomic force microscopy

Journal Articles

On the Thermal Performance Characteristics of Three-Dimensional Multichip Modules

Wen-Hwa Chen, ASME Fellow, Professor, Hsien-Chie Cheng, ASME Member, Associate Professor, Chih-Han Lin, Graduate Student

J. Electron. Packag. September 2004, 126(3): 374–383.

DOI: https://doi.org/10.1115/1.1773198

Published Online: October 6, 2004

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Topics: Design, Finite element analysis, Finite element model, Heat, Heat conduction, Junctions, Manufacturing, Modeling, Multi-chip modules, Natural convection

Journal Articles

Measurement of Thermal Deformation of Interconnect Layers Using SIEM

Sheng Chang and, Fu-Pen Chiang, Yifan Guo

J. Electron. Packag. September 2002, 124(3): 310–313.

DOI: https://doi.org/10.1115/1.1481367

Published Online: July 26, 2002

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Topics: Deformation, Dielectric materials, Displacement, Electron microscopy, Interferometry, Packaging, Reliability, Resolution (Optics), Thermal deformation, Thermal expansion

Journal Articles

Microwave Imaging for the Integrity Assessment of IC Packages

Y. Ju, M. Saka, H. Abe´

J. Electron. Packag. March 2001, 123(1): 42–46.

DOI: https://doi.org/10.1115/1.1326440

Published Online: July 18, 2000

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Topics: Delamination, Imaging, Microwaves, Sensors, Inspection, Reliability, Resolution (Optics), Dimensions, Shapes

Journal Articles

Experimental Study on Electric-Current Induced Damage Evolution at the Crack Tip in Thin Film Conductors

A.-F. Bastawros, K.-S. Kim

J. Electron. Packag. December 1998, 120(4): 354–359.

DOI: https://doi.org/10.1115/1.2792646

Published Online: December 1, 1998

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Topics: Damage, Electric current, Fracture (Materials), Thin films, Electrodes, Temperature, Aluminum, Melting, Brittle fracture, Coating processes

Journal Articles

Applications of Digital Speckle Correlation to Microscopic Strain Measurement and Materials’ Property Characterization

H. Lu

J. Electron. Packag. September 1998, 120(3): 275–279.

DOI: https://doi.org/10.1115/1.2792633

Published Online: September 1, 1998

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Topics: Hardware, Manufacturing, Reliability, Resolution (Optics), Strain measurement

Journal Articles

Measurement of Wafer Surface Using Shadow Moire´ Technique With Talbot Effect

S. Wei, S. Wu, I. Kao, F. P. Chiang

J. Electron. Packag. June 1998, 120(2): 166–170.

DOI: https://doi.org/10.1115/1.2792612

Published Online: June 1, 1998

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Topics: Semiconductor wafers, Shades and shadows, Diffraction gratings, Diffraction patterns, Inspection, Resolution (Optics), Warping, Lasers, Light sources, Probes

Journal Articles

Verification of Numerical Models Used in Microelectronics Packaging Design by Interferometric Displacement Measurement Methods

B. Han, Y. Guo, C. K. Lim, D. Caletka

J. Electron. Packag. September 1996, 118(3): 157–163.

DOI: https://doi.org/10.1115/1.2792146

Published Online: September 1, 1996

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Topics: Computer simulation, Design, Displacement measurement, Microelectronic packaging, Interferometry, Displacement, Cycles, Electronic packaging, Geometry, Modeling

Journal Articles

Thermal Deformation Analysis of Various Electronic Packaging Products by Moire´ and Microscopic Moire´ Interferometry

B. Han, Y. Guo

J. Electron. Packag. September 1995, 117(3): 185–191.

DOI: https://doi.org/10.1115/1.2792090

Published Online: September 1, 1995

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Topics: Electronic packaging, Interferometry, Thermal deformation, Deformation, Packaging, Design, Displacement measurement, Mechanical behavior, Optimization, Product development

Journal Articles

Investigation and Prediction of Creep and Creep-Like Behavior of Solids by Laser Methods

E. V. Cherstvov, A. N. Mokhel, R. L. Salganik, V. N. Soutorshin

J. Electron. Packag. September 1992, 114(3): 310–313.

DOI: https://doi.org/10.1115/1.2905456

Published Online: September 1, 1992

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Topics: Creep, Lasers, Solids, Resolution (Optics)

Journal Articles

Temperature Mapping of Localized Hot Spots on Microelectronic Chip Surfaces

S. Heng, W. Z. Black

J. Electron. Packag. September 1991, 113(3): 286–293.

DOI: https://doi.org/10.1115/1.2905408

Published Online: September 1, 1991

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Topics: Temperature, Emissivity, Image processing, Temperature measurement, Computer software, Computers, Hardware, Heat flux, Infrared imaging, Overlays (Materials engineering)

Journal Articles

Fatigue Properties of Microelectronics Solder Joints

N. Nir, T. D. Dudderar, C. C. Wong, A. R. Storm

J. Electron. Packag. June 1991, 113(2): 92–101.

DOI: https://doi.org/10.1115/1.2905390

Published Online: June 1, 1991

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Topics: Fatigue properties, Microelectronic devices, Solder joints, Shear (Mechanics), Tin, Vehicles, Computers, Design, Engineering prototypes, Failure

Journal citation

NARROW

Simultaneous Measurement of Temperature and Strain in Electronic Packages Using Multiframe Super-Resolution Infrared Thermography and Digital Image Correlation

Error Reduction in Infrared Thermography by Multiframe Super-Resolution

Transient Data Processing of Flow Boiling Local Heat Transfer in a Multi-Microchannel Evaporator Under a Heat Flux Disturbance

Maximum Resolution of a Probe-Based, Steady-State Thermal Interface Material Characterization Instrument

Comparison of Warpage Measurement Capabilities and Results Obtained by Using Laser and Digital Fringe Projection Methods

Room Level Modeling of Air Flow in a Contained Data Center Aisle

Application of Synchrotron Radiation X-Ray Microtomography to Nondestructive Evaluation of Thermal Fatigue Process in Flip Chip Interconnects

A Novel Projection Moiré System for Measuring PWBA Warpage Using Simulated Optimized Convective Reflow Process

Microscale and Nanoscale Thermal Characterization Techniques

On the Thermal Performance Characteristics of Three-Dimensional Multichip Modules

Measurement of Thermal Deformation of Interconnect Layers Using SIEM

Microwave Imaging for the Integrity Assessment of IC Packages

Experimental Study on Electric-Current Induced Damage Evolution at the Crack Tip in Thin Film Conductors

Applications of Digital Speckle Correlation to Microscopic Strain Measurement and Materials’ Property Characterization

Measurement of Wafer Surface Using Shadow Moire´ Technique With Talbot Effect

Verification of Numerical Models Used in Microelectronics Packaging Design by Interferometric Displacement Measurement Methods

Thermal Deformation Analysis of Various Electronic Packaging Products by Moire´ and Microscopic Moire´ Interferometry

Investigation and Prediction of Creep and Creep-Like Behavior of Solids by Laser Methods

Temperature Mapping of Localized Hot Spots on Microelectronic Chip Surfaces

Fatigue Properties of Microelectronics Solder Joints

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