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Journal Articles

Validation of the Critical Strain-Based Methodology for Evaluating the Mechanical Safety of Ball Grid Array Solder Joints in a Launch Random Vibration Environment

Tae-Yong Park, Hyun-Ung Oh
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2022, 144(1): 011006.
Paper No: EP-20-1108
https://doi.org/10.1115/1.4050512
Published Online: August 6, 2021
View Article titled, Validation of the Critical Strain-Based Methodology for Evaluating the Mechanical Safety of Ball Grid Array Solder Joints in a Launch Random Vibration Environment
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Topics: Fatigue life, Random vibration, Safety, Solder joints, Ball-Grid-Array packaging
Journal Articles

Application-Driven Reliability Research of Next Generation for Automotive Electronics: Challenges and Approaches

Sven Rzepka, Alexander Otto, Dietmar Vogel, Rainer Dudek
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010903.
Paper No: EP-17-1090
https://doi.org/10.1115/1.4039333
Published Online: March 2, 2018
View Article titled, Application-Driven Reliability Research of Next Generation for Automotive Electronics: Challenges and Approaches
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Topics: Electronics, Failure, Reliability, Stress, Temperature, Failure mechanisms, Cycles, Safety, Failure analysis, Simulation
Journal Articles

Highlights from the European Thermal Project PROFIT

Clemens J. M. Lasance
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technology Review
J. Electron. Packag. December 2004, 126(4): 565–570.
https://doi.org/10.1115/1.1827258
Published Online: January 24, 2005
View Article titled, Highlights from the European Thermal Project PROFIT
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Topics: Modeling, Reliability, Safety, Steady state, Temperature, Computer software, Electronic products, Temperature gradient
Journal Articles

Structural Analyses of Spacecraft Electronic Packages

S. Kannappan, V. Kunukkassril
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 1992, 114(1): 96–99.
https://doi.org/10.1115/1.2905449
Published Online: March 1, 1992
View Article titled, Structural Analyses of Spacecraft Electronic Packages
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Topics: Electronic packages, Space vehicles, Structural analysis, Finite element methods, Stress, Computer software, Design, Electronics, Manufacturing, Modal analysis