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Journal Articles

Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics Applications

Khalid Alzoubi, Alexander Hensel, Felix Häußler, Bettina Ottinger, Marcel Sippel, Jörg Franke

J. Electron. Packag. September 2023, 145(3): 031008.

Paper No: EP-22-1082

DOI: https://doi.org/10.1115/1.4056992

Published Online: March 8, 2023

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Topics: Electronics, Experimental design, Intermetallic compounds, Optimization, Pressure, Shear strength, Silver, Sintering, Temperature, Failure

Journal Articles

Study on the Microstructure Evolution and Mechanical Properties of Cu/Cu 41 Sn 11 /Cu Solder Joint During High-Temperature Aging

Gangli Yang, Xiaoyan Li, Xu Han, Hu Zhang, Linjie Wen, Shanshan Li

J. Electron. Packag. September 2023, 145(3): 031001.

Paper No: EP-22-1057

DOI: https://doi.org/10.1115/1.4056329

Published Online: December 9, 2022

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Topics: Mechanical properties, Solder joints, Tin, High temperature, Shear strength

Journal Articles

Shear and Fatigue Properties of Lead-Free Solder Joints: Modeling and Microstructure Analysis

Xin Wei, Mohamed El Amine Belhadi, Sa'd Hamasha, Ali Alahmer, Rong Zhao, Bart Prorok, A. R. Nazmus Sakib

J. Electron. Packag. June 2023, 145(2): 021007.

Paper No: EP-22-1044

DOI: https://doi.org/10.1115/1.4055318

Published Online: September 28, 2022

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Topics: Alloys, Fatigue, Shear (Mechanics), Shear strength, Solders, Tin, Stress, Solder joints, Fatigue testing, Fatigue life

Journal Articles

Joint Analysis and Reliability Test of Epoxy-Based Nano Silver Paste Under Different Pressure-Less Sintering Processes

Xinyue Wang, Zejun Zeng, Guoqi Zhang, Jing Zhang, Pan Liu

J. Electron. Packag. December 2022, 144(4): 041013.

Paper No: EP-21-1109

DOI: https://doi.org/10.1115/1.4053432

Published Online: February 1, 2022

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Topics: Epoxy resins, Pressure, Silver, Sintering, Temperature, Reliability, Shear strength, Epoxy adhesives, Shear (Mechanics)

Journal Articles

Fatigue Testing of Copper Nanoparticle-Based Joints and Bonds

Rajesh Sharma Sivasubramony, Maan Zaid Kokash, Sanoop Thekkut, Ninad Shahane, Patrick Thompson, Kabir Mirpuri, Yuki Kawana, Christopher M. Greene, Peter Borgesen

J. Electron. Packag. March 2022, 144(1): 011007.

Paper No: EP-20-1120

DOI: https://doi.org/10.1115/1.4050871

Published Online: August 6, 2021

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Topics: Annealing, Cycles, Damage, Deformation, Dislocations, Fatigue, Fatigue life, Nanoparticles, Particulate matter, Shear strength

Journal Articles

Application of Alumina-Based Ceramic Paste for High-Temperature Electronics Packaging

Ardalan Nasiri, Simon Ang

J. Electron. Packag. June 2021, 143(2): 020902.

Paper No: EP-20-1060

DOI: https://doi.org/10.1115/1.4049292

Published Online: February 22, 2021

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Topics: Bonding, Ceramics, Electronic packaging, Hardening (Curing), High temperature, Shear strength, Temperature, Fracture (Materials), Fourier transform infrared spectroscopy, Aluminum

Journal Articles

Effect of Cu Foam and Ag-Coated Layer on the Microstructure and Mechanical Behavior of Nano-Ag Sintered Joint

Yang Liu, Zhao Li, Min Zhou, Xianghua Zeng, Fenglian Sun

J. Electron. Packag. September 2021, 143(3): 031002.

Paper No: EP-20-1047

DOI: https://doi.org/10.1115/1.4049128

Published Online: January 19, 2021

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Topics: Bonding, Coating processes, Coatings, Composite materials, Mechanical behavior, Shear (Mechanics), Shear strength, Sintering, Fracture (Materials), Deformation

Journal Articles

Low-Temperature Bonding of Cu Through Self-Propagating Reaction Under Various Temperatures and Pressures

Wenbo Zhu, Xiaoting Wang, Mingyu Li

J. Electron. Packag. June 2020, 142(2): 021006.

Paper No: EP-19-1070

DOI: https://doi.org/10.1115/1.4046341

Published Online: March 9, 2020

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Topics: Bonding, Temperature, Temperature profiles, Tin, Solders, Low temperature, Pressure, Shear strength, Heat, Melting

Journal Articles

Low-Temperature Fabrication of Three-Dimensional Ceramic Substrate by Molding Inorganic Aluminosilicate Paste

Hao Cheng, Yang Peng, Yun Mou, Qinglei Sun, Mingxiang Chen

J. Electron. Packag. December 2019, 141(4): 041003.

Paper No: EP-18-1070

DOI: https://doi.org/10.1115/1.4043645

Published Online: May 24, 2019

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Topics: Cements (Adhesives), Ceramics, Dams, Manufacturing, Reliability, Shear strength, Low temperature, Molding, Temperature, Viscosity

Journal Articles

Lead-Free Alternatives for Interconnects in High-Temperature Electronics

Sandeep Mallampati, Liang Yin, David Shaddock, Harry Schoeller, Junghyun Cho

J. Electron. Packag. March 2018, 140(1): 010906.

Paper No: EP-17-1101

DOI: https://doi.org/10.1115/1.4039027

Published Online: March 2, 2018

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Topics: Alloys, Electronics, High temperature, Solders, Temperature, Testing, Thermal conductivity, Failure, Melting, Tensile testing

Journal Articles

Enhanced Bonding by Applied Current in Cu-to-Cu Joints Fabricated Using 20 μ m Cu Microbumps

Sung Woo Ma, Chanho Shin, Young-Ho Kim

J. Electron. Packag. December 2017, 139(4): 041004.

Paper No: EP-17-1044

DOI: https://doi.org/10.1115/1.4037474

Published Online: September 5, 2017

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Topics: Bonding, Contact resistance, Electrodiffusion, Shear strength, Temperature, Heating, Joules

Journal Articles

Temporary Bonding/Debonding of Silicon Substrates Based on Propylene Carbonate

Zhiyuan Zhu, Min Yu, Lisha Liu, Yufeng Jin

J. Electron. Packag. December 2015, 137(4): 044501.

Paper No: EP-15-1062

DOI: https://doi.org/10.1115/1.4031750

Published Online: October 20, 2015

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Topics: Adhesives, Bonding, Silicon, Temperature, Shear strength, Ultraviolet radiation

Journal Articles

Multiple Quality Characteristics Optimization of Ball Grid Array Wire Bonding Process

Tzeng Yih-Fong, Chen Fu-Chen, Chen Chih-Huang

J. Electron. Packag. December 2015, 137(4): 041004.

Paper No: EP-14-1080

DOI: https://doi.org/10.1115/1.4031471

Published Online: October 1, 2015

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Topics: Ball-Grid-Array packaging, Optimization, Principal component analysis, Shear strength, Wire, Wire bonding, Design, Performance evaluation, Process design

Journal Articles

A Shear Strength Degradation Model for Anisotropic Conductive Adhesive Joints Under Hygrothermal Conditions

Bo Tao, Guanghua Wu, Zhouping Yin, Youlun Xiong

J. Electron. Packag. December 2013, 135(4): 041008.

Paper No: EP-12-1112

DOI: https://doi.org/10.1115/1.4025840

Published Online: November 12, 2013

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Topics: Shear strength

Journal Articles

Solid State Bonding of Silver Foils to Metalized Alumina Substrates at 260°C

Chu-Hsuan Sha, Pin J. Wang, Wen P. Lin, Chin C. Lee

J. Electron. Packag. December 2011, 133(4): 041007.

DOI: https://doi.org/10.1115/1.4005295

Published Online: December 9, 2011

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Topics: Bonding, Diffusion bonding (Metals), Pressure, Silver, Shear (Mechanics), Shear strength, Solders, Atoms, Temperature

Journal Articles

On-Line Quality Detection of Ultrasonic Wire Bonding via Refining Analysis of Electrical Signal From Ultrasonic Generator

Wuwei Feng, Qingfeng Meng, Youbo Xie, Hong Fan

J. Electron. Packag. December 2010, 132(4): 041002.

DOI: https://doi.org/10.1115/1.4002900

Published Online: November 19, 2010

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Topics: Bonding, Feature extraction, Signals, Wire bonding, Generators, Principal component analysis, Wire, Damping, Artificial neural networks, Shear strength

Journal Articles

Sub- 100 μ m SnAg Solder Bumping Technology and the Bump Reliability

Xiaoqin Lin, Le Luo

J. Electron. Packag. March 2009, 131(1): 011014.

DOI: https://doi.org/10.1115/1.2957333

Published Online: February 18, 2009

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Topics: Solders, Shear strength, Reliability, Tin

Journal Articles

The Effects of Multiple Zincation Process on Aluminum Bond Pad Surface for Electroless Nickel Immersion Gold Deposition

M. K. Md Arshad, I. Ahmad, A. Jalar, G. Omar, U. Hashim

J. Electron. Packag. September 2006, 128(3): 246–250.

DOI: https://doi.org/10.1115/1.2229223

Published Online: November 29, 2005

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Topics: Adhesion, Aluminum, Atomic force microscopy, Nickel, Shear strength, Solders, Focused ion beams, Metallurgy, Scanning electron microscopy, X-rays

Journal Articles

Flip-Chip Ball Grid Array Lead-Free Solder Joint Under Reliability Test

Ming-Hwa R. Jen, Lee-Cheng Liu, Jenq-Dah Wu

J. Electron. Packag. December 2005, 127(4): 446–451.

DOI: https://doi.org/10.1115/1.2070090

Published Online: January 13, 2005

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Topics: Ball-Grid-Array packaging, Flip-chip, High temperature, Lead-free solders, Reliability, Shear (Mechanics), Failure mechanisms, Solders, Shear strength, Adhesion

Journal Articles

Analysis of the Micro-Mechanical Properties in Aged Lead-Free, Fine Pitch Flip Chip Joints

Changqing Liu, Paul Conway, Dezhi Li, Michael Hendriksen

J. Electron. Packag. September 2004, 126(3): 359–366.

DOI: https://doi.org/10.1115/1.1773391

Published Online: October 6, 2004

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Topics: Flip-chip, Nanoindentation, Shear (Mechanics), Solders, Tin, Flip-chip devices, Intermetallic compounds, Testing, Reliability, Shear strength

Journal citation

NARROW

Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics Applications

Study on the Microstructure Evolution and Mechanical Properties of Cu/Cu 41 Sn 11 /Cu Solder Joint During High-Temperature Aging

Shear and Fatigue Properties of Lead-Free Solder Joints: Modeling and Microstructure Analysis

Joint Analysis and Reliability Test of Epoxy-Based Nano Silver Paste Under Different Pressure-Less Sintering Processes

Fatigue Testing of Copper Nanoparticle-Based Joints and Bonds

Application of Alumina-Based Ceramic Paste for High-Temperature Electronics Packaging

Effect of Cu Foam and Ag-Coated Layer on the Microstructure and Mechanical Behavior of Nano-Ag Sintered Joint

Low-Temperature Bonding of Cu Through Self-Propagating Reaction Under Various Temperatures and Pressures

Low-Temperature Fabrication of Three-Dimensional Ceramic Substrate by Molding Inorganic Aluminosilicate Paste

Lead-Free Alternatives for Interconnects in High-Temperature Electronics

Enhanced Bonding by Applied Current in Cu-to-Cu Joints Fabricated Using 20 μ m Cu Microbumps

Temporary Bonding/Debonding of Silicon Substrates Based on Propylene Carbonate

Multiple Quality Characteristics Optimization of Ball Grid Array Wire Bonding Process

A Shear Strength Degradation Model for Anisotropic Conductive Adhesive Joints Under Hygrothermal Conditions

Solid State Bonding of Silver Foils to Metalized Alumina Substrates at 260°C

On-Line Quality Detection of Ultrasonic Wire Bonding via Refining Analysis of Electrical Signal From Ultrasonic Generator

Sub- 100 μ m SnAg Solder Bumping Technology and the Bump Reliability

The Effects of Multiple Zincation Process on Aluminum Bond Pad Surface for Electroless Nickel Immersion Gold Deposition

Flip-Chip Ball Grid Array Lead-Free Solder Joint Under Reliability Test

Analysis of the Micro-Mechanical Properties in Aged Lead-Free, Fine Pitch Flip Chip Joints

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