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Journal Articles

Experimental Study and Mitigation of Pressure Drop Oscillation Using Active Control

Qi Jin, John T. Wen, Shankar Narayanan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041102.
Paper No: EP-21-1081
https://doi.org/10.1115/1.4051942
Published Online: August 20, 2021
View Article titled, Experimental Study and Mitigation of Pressure Drop Oscillation Using Active Control
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Topics: Compressors, Design, Flow (Dynamics), Heat, Oscillations, Pressure drop, Secondary cells, Stability, Stress, Valves
Journal Articles

Metallic Phase Change Material's Microstructural Stability Under Repetitive Melting/Solidification Cycles

Rafael Báez, Luis E. González, Manny X. de Jesús-López, Pedro O. Quintero, Lauren M. Boteler
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031110.
Paper No: EP-20-1013
https://doi.org/10.1115/1.4047063
Published Online: May 13, 2020
View Article titled, Metallic Phase Change Material's Microstructural Stability Under Repetitive Melting/Solidification Cycles
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Topics: Cycles, Melting, Metals, Solidification, Temperature, Alloys, Stability
Journal Articles

Dynamic Numerical Microchannel Evaporator Model to Investigate Parallel Channel Instabilities

Tom Saenen, John R. Thome
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 010901.
Paper No: EP-15-1091
https://doi.org/10.1115/1.4032490
Published Online: March 10, 2016
View Article titled, Dynamic Numerical Microchannel Evaporator Model to Investigate Parallel Channel Instabilities
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Topics: Flow (Dynamics), Heat conduction, Microchannels, Algorithms, Simulation, Stability
Journal Articles

Vacuum Packaging of MEMS by Self-Assembly

Royi Naveh, Eyal Zussman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2012, 134(2): 021003.
https://doi.org/10.1115/1.4006138
Published Online: June 11, 2012
View Article titled, Vacuum Packaging of MEMS by Self-Assembly
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Topics: Cavities, Self-assembly, Solders, Vacuum, Sealing (Process), Manufacturing, Stability, Surface tension, Microelectromechanical systems, Shear (Mechanics)
Journal Articles

Steady-State Behavior of a Three-Dimensional Pool-Boiling System

Michel Speetjens
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Thermal Issues In Emerging Technologies Theory And Applications, Theta
J. Electron. Packag. December 2008, 130(4): 041102.
https://doi.org/10.1115/1.2993147
Published Online: November 13, 2008
View Article titled, Steady-State Behavior of a Three-Dimensional Pool-Boiling System
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Topics: Bifurcation, Boiling, Cooling, Fluids, Heat, Heat flux, Pool boiling, Steady state, Temperature, Heat transfer
Journal Articles

Impact of TXV and Compressor in the Stability of a High-End Computer Refrigeration System

Yasin Makwana, Dereje Agonafer, Fellow ASME, Dan Manole
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 554–559.
https://doi.org/10.1115/1.1827272
Published Online: January 24, 2005
View Article titled, Impact of TXV and Compressor in the Stability of a High-End Computer Refrigeration System
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Topics: Compressors, Refrigeration, Temperature, Stress, Computers, Stability, Vapors, Valves
Journal Articles

Computer Simulation of Solder Bridging Phenomena

T. J. Singler, Xu Zhang, K. A. Brakke
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1996, 118(3): 122–126.
https://doi.org/10.1115/1.2792141
Published Online: September 1, 1996
View Article titled, Computer Simulation of Solder Bridging Phenomena
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Topics: Computer simulation, Solders, Bridges (Structures), Liquid metals, Stability, Equilibrium (Physics)
Journal Articles

Effects of Solder Joint Voiding and Seating Plane Stability on Surface Mount Lead Standoff

M. K. Schwiebert
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1994, 116(2): 89–91.
https://doi.org/10.1115/1.2905510
Published Online: June 1, 1994
View Article titled, Effects of Solder Joint Voiding and Seating Plane Stability on Surface Mount Lead Standoff
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Topics: Solder joints, Stability, Surface mount packaging, Solders, Rocks, Surface mount technology
Journal Articles

Application of an Epoxy Cap in a Flip-Chip Package Design

E. Suhir
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1989, 111(1): 16–20.
https://doi.org/10.1115/1.3226501
Published Online: March 1, 1989
View Article titled, Application of an Epoxy Cap in a Flip-Chip Package Design
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Topics: Design, Epoxy adhesives, Epoxy resins, Flip-chip packages, Stress, Buckling, Thermal expansion, Compression, Diluents, Low temperature