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Journal Articles

Vacuum Packaging of MEMS by Self-Assembly

Royi Naveh, Eyal Zussman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2012, 134(2): 021003.
https://doi.org/10.1115/1.4006138
Published Online: June 11, 2012
View Article titled, Vacuum Packaging of MEMS by Self-Assembly
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Topics: Cavities, Self-assembly, Solders, Vacuum, Sealing (Process), Manufacturing, Stability, Surface tension, Microelectromechanical systems, Shear (Mechanics)
Journal Articles

Translation Solder Self-Alignment Mechanics Modeling for a Flip Chip in the Presence of a Viscous Fluid

Brett Fennell, Sangil Lee, Daniel F. Baldwin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041013.
https://doi.org/10.1115/1.4002825
Published Online: December 8, 2010
View Article titled, Translation Solder Self-Alignment Mechanics Modeling for a Flip Chip in the Presence of a Viscous Fluid
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Topics: Flip-chip devices, Flow (Dynamics), Solders, Modeling, Springs, Surface tension, Viscosity, Fluids, Dampers
Journal Articles

Study on a Pulsating Heat Pipe With Self-Rewetting Fluid

Koji Fumoto, Masahiro Kawaji, Tsuyoshi Kawanami
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2010, 132(3): 031005.
https://doi.org/10.1115/1.4001855
Published Online: September 9, 2010
View Article titled, Study on a Pulsating Heat Pipe With Self-Rewetting Fluid
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Topics: Fluids, Heat pipes, Temperature, Water, Surface tension, Heat transfer, Thermal resistance, Heat
Journal Articles

Numerical and Experimental Analysis of Solder Joint Self-Alignment in Fiber Attachment Soldering

Wei Zhang, Chunqing Wang, Yanhong Tian
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011009.
https://doi.org/10.1115/1.2837518
Published Online: February 12, 2008
View Article titled, Numerical and Experimental Analysis of Solder Joint Self-Alignment in Fiber Attachment Soldering
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Topics: Fibers, Solder joints, Soldering, Solders, Surface tension, Geometry, Shapes, Equilibrium (Physics), Yaw
Journal Articles

Flip-Chip Underfill Packaging Considering Capillary Force, Pressure Difference, and Inertia Effects

Chao-Ming Lin, Win-Jin Chang, Te-Hua Fang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 48–55.
https://doi.org/10.1115/1.2429709
Published Online: May 13, 2006
View Article titled, Flip-Chip Underfill Packaging Considering Capillary Force, Pressure Difference, and Inertia Effects
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Topics: Flip-chip, Flow (Dynamics), Inertia (Mechanics), Packaging, Pressure, Rotation, Surface tension
Journal Articles

Predicting the Liquid Formation for the Solder Joints in Flip Chip Technology

Wen-Hwa Chen, Shu-Ru Lin, Kuo-Ning Chiang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 331–338.
https://doi.org/10.1115/1.2229216
Published Online: September 29, 2005
View Article titled, Predicting the Liquid Formation for the Solder Joints in Flip Chip Technology
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Topics: Flip-chip devices, Solder joints, Solders, Surface tension, Shapes, Flip-chip
Journal Articles

Resin Self-Alignment Processes for Self-Assembly Systems

Jong-Min Kim, Kiyokazu Yasuda, Kozo Fujimoto
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 18–24.
https://doi.org/10.1115/1.1846061
Published Online: March 21, 2005
View Article titled, Resin Self-Alignment Processes for Self-Assembly Systems
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Topics: Resins, Surface tension, Self-assembly
Journal Articles

Solder Joint Shape Prediction Using a Modified Perzyna Viscoplastic Model

Mudasir Ahmad, Ken Hubbard, Mason Hu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 290–298.
https://doi.org/10.1115/1.1938985
Published Online: October 5, 2004
View Article titled, Solder Joint Shape Prediction Using a Modified Perzyna Viscoplastic Model
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Topics: Shapes, Solder joints, Solders, Surface tension, Warping, Finite element analysis, Ball-Grid-Array packaging
Journal Articles

Simulative Analysis on Factors Influencing Solder Joint Bridging of Fine Pitch Devices

Li Ming Yu, Bang Han Sur, Kim Young Pyo, Wang Chun Qing, Zhang Lei
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 22–25.
https://doi.org/10.1115/1.1646421
Published Online: April 30, 2004
View Article titled, Simulative Analysis on Factors Influencing Solder Joint Bridging of Fine Pitch Devices
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Topics: Solder joints, Solders, Surface tension, Wetting
Journal Articles

Optimum Gullwing Fillet Solder Joint Under Thermomechanical Forces

L. L. Meekisho, Mem. ASME,, K. Nelson-Owusu, Mem. ASME,
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 52–56.
https://doi.org/10.1115/1.1646429
Published Online: April 30, 2004
View Article titled, Optimum Gullwing Fillet Solder Joint Under Thermomechanical Forces
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Topics: Solder joints, Solders, Stress, Surface tension, Thermomechanics, Wetting, Geometry, Shapes, Reliability, Finite element analysis
Journal Articles

Humidity-Induced Voltage Shift on MEMS Pressure Sensors

J. Albert Chiou, Mem. ASME, Steven Chen, Jinbao Jiao
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 470–474.
https://doi.org/10.1115/1.1615249
Published Online: December 15, 2003
View Article titled, Humidity-Induced Voltage Shift on MEMS Pressure Sensors
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Topics: Bonding, Diaphragms (Mechanical devices), Diaphragms (Structural), Finite element analysis, Microelectromechanical systems, Pressure, Pressure sensors, Silicon, Stress, Surface tension
Journal Articles

Simulation of Void Growth in Molten Solder Bumps

Ronald L. Panton, Fellow ASME, Jong W. Lee, Lakhi Goenka, Achyuta Achari
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 329–334.
https://doi.org/10.1115/1.1569954
Published Online: September 17, 2003
View Article titled, Simulation of Void Growth in Molten Solder Bumps
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Topics: Bubbles, Melting, Solders, Flow (Dynamics), Surface tension, Viscosity, Temperature
Journal Articles

A Two-Body Formulation for Solder Joint Shape Prediction

F. P. Renken, G. Subbarayan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1998, 120(3): 302–308.
https://doi.org/10.1115/1.2792637
Published Online: September 1, 1998
View Article titled, A Two-Body Formulation for Solder Joint Shape Prediction
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Topics: Shapes, Solder joints, Solders, Drops, Ball-Grid-Array packaging, Ceramics, Design, Fatigue life, Finite element analysis, Flip-chip
Journal Articles

Solder Joint Formation Simulation and Component Tombstoning Prediction During Reflow

X. Wu, X. Dou, C.-P. Yeh, K. Waytt
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. June 1998, 120(2): 141–144.
https://doi.org/10.1115/1.2792601
Published Online: June 1, 1998
View Article titled, Solder Joint Formation Simulation and Component Tombstoning Prediction During Reflow
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Topics: Simulation, Solder joints, Solders, Geometry, Engineering simulation, Failure, Reliability, Wetting, Alloys, Computer simulation
Journal Articles

Electronic Packaging Reflow Shape Prediction for the Solder Mask Defined Ball Grid Array

K.-N. Chiang, W.-L. Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. June 1998, 120(2): 175–178.
https://doi.org/10.1115/1.2792616
Published Online: June 1, 1998
View Article titled, Electronic Packaging Reflow Shape Prediction for the Solder Mask Defined Ball Grid Array
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Topics: Ball-Grid-Array packaging, Electronic packaging, Shapes, Solder masks, Solder joints, Density, Energy conservation, Failure, Fatigue, Gravity (Force)
Journal Articles

Prediction of Solder Joint Geometries in Array-Type Interconnects

S. M. Heinrich, M. Schaefer, S. A. Schroeder, P. S. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1996, 118(3): 114–121.
https://doi.org/10.1115/1.2792140
Published Online: September 1, 1996
View Article titled, Prediction of Solder Joint Geometries in Array-Type Interconnects
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Topics: Solder joints, Solders, Reliability, Shapes, Surface tension, Engineers, Fatigue, Flip-chip, Geometry, Necking
Journal Articles

Simulation and Interpretation of Wetting Balance Tests Using the Surface Evolver

D. C. Whalley, P. P. Conway
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1996, 118(3): 134–141.
https://doi.org/10.1115/1.2792143
Published Online: September 1, 1996
View Article titled, Simulation and Interpretation of Wetting Balance Tests Using the Surface Evolver
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Topics: Simulation, Wetting, Solders, Surface tension, Electromagnetic scattering, Errors, Modeling, Shapes, Solder joints, Soldering
Journal Articles

Effect of Chip and Pad Geometry on Solder Joint Formation in SMT

S. M. Heinrich, P. E. Liedtke, N. J. Nigro, A. F. Elkouh, P. S. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1993, 115(4): 433–439.
https://doi.org/10.1115/1.2909353
Published Online: December 1, 1993
View Article titled, Effect of Chip and Pad Geometry on Solder Joint Formation in SMT
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Topics: Geometry, Solder joints, Solders, Density, Gravity (Force), Printed circuit boards, Computer software, Computers, Design, Engineers
Journal Articles

Shape and Force Relationships for Molten Axisymmetric Solder Connections

R. H. Katyl, W. T. Pimbley
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1992, 114(3): 336–341.
https://doi.org/10.1115/1.2905460
Published Online: September 1, 1992
View Article titled, Shape and Force Relationships for Molten Axisymmetric Solder Connections
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Topics: Shapes, Solders, Collapse, Computational methods, Equilibrium (Physics), Gravity (Force), Surface tension
Journal Articles

Quasi-Static Modeling of the Self-Alignment Mechanism in Flip-Chip Soldering—Part I: Single Solder Joint

S. K. Patra, Y. C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1991, 113(4): 337–342.
https://doi.org/10.1115/1.2905417
Published Online: December 1, 1991
View Article titled, Quasi-Static Modeling of the Self-Alignment Mechanism in Flip-Chip Soldering—Part I: Single Solder Joint
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Topics: Flip-chip, Modeling, Solder joints, Soldering, Solders, Energy conservation, Manufacturing, Reflow soldering, Reliability, Stress