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Journal Articles

Numerical and Parametric Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics

Wei Tong, Alireza Ganjali, Omidreza Ghaffari, Chady al Sayed, Luc Fréchette, Julien Sylvestre

J. Electron. Packag. December 2022, 144(4): 041011.

Paper No: EP-21-1119

DOI: https://doi.org/10.1115/1.4053310

Published Online: January 28, 2022

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Topics: Boiling, Cooling, Heat, Heat transfer coefficients, Temperature, Critical heat flux, Temperature distribution, Flat heat pipes

Journal Articles

Fabrication Steps and Thermal Modeling of Three-Dimensional Asynchronous Field Programmable Gate Array (3D-AFPGA) With Through Silicon Via and Copper Pillar Bonding Approach

Leila Choobineh, Robert Carrol, Carlos Gutierrez, Robert Geer

J. Electron. Packag. September 2020, 142(3): 031106.

Paper No: EP-19-1098

DOI: https://doi.org/10.1115/1.4046848

Published Online: April 24, 2020

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Topics: Bonding, Columns (Structural), Copper, Design, Gates (Closures), Manufacturing, Modeling, Semiconductor wafers, Silicon, Tiles

Journal Articles

Advanced Characterization Techniques and Analysis of Thermal Properties of AlGaN/GaN Multifinger Power HEMTs on SiC Substrate Supported by Three-Dimensional Simulation

Aleš Chvála, Robert Szobolovszký, Jaroslav Kováč, Jr., Martin Florovič, Juraj Marek, Ľuboš Černaj, Daniel Donoval, Jaroslav Kováč, Christian Dua, Sylvain L. Delage, Jean-Claude Jacquet

J. Electron. Packag. September 2019, 141(3): 031007.

Paper No: EP-18-1093

DOI: https://doi.org/10.1115/1.4043477

Published Online: May 17, 2019

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Topics: Gallium nitride, Heat, Simulation, Temperature, Transistors, Temperature distribution, Temperature measurement, Thermal properties, Gates (Closures), Thermal analysis

Journal Articles

Reduced Order Modeling of Transient Heat Transfer in Microchip Interconnects

Arman Nokhosteen, M. Soltani, Banafsheh Barabadi

J. Electron. Packag. March 2019, 141(1): 011002.

Paper No: EP-18-1029

DOI: https://doi.org/10.1115/1.4041666

Published Online: February 25, 2019

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Topics: Boundary-value problems, Heat, Integrated circuits, Microelectronic devices, Modeling, Principal component analysis, Simulation, Temperature, Temperature distribution, Temperature profiles

Journal Articles

Airflow Management on the Efficiency Index of a Container Data Center Having Overhead Air Supply

Cheng-Hao Wang, Yeng-Yung Tsui, Chi-Chuan Wang

J. Electron. Packag. December 2017, 139(4): 041008.

Paper No: EP-17-1066

DOI: https://doi.org/10.1115/1.4038114

Published Online: October 23, 2017

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Topics: Air flow, Containers, Data centers, Temperature, Temperature distribution, Flow (Dynamics)

Journal Articles

Thermal Performance of a Light Emitting Diode Light Engine for a Multipurpose Automotive Exterior Lighting System With Competing Board Technologies

Umut Zeynep Uras, Mehmet Arık, Enes Tamdoğan

J. Electron. Packag. June 2017, 139(2): 020907.

Paper No: EP-16-1139

DOI: https://doi.org/10.1115/1.4036403

Published Online: June 12, 2017

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Topics: Engines, Light-emitting diodes, Temperature, Lumber, Flat heat pipes, Electronics, Thermal conductivity, Temperature distribution, Vapors

Journal Articles

Assessment of Joule Heating and Temperature Distribution on Printed Circuit Boards Via Electrothermal Simulations

M. Baris Dogruoz

J. Electron. Packag. June 2016, 138(2): 021004.

Paper No: EP-16-1035

DOI: https://doi.org/10.1115/1.4033109

Published Online: April 19, 2016

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Topics: Electric fields, Heating, Joules, Printed circuit boards, Simulation, Temperature, Temperature distribution, Thermal conductivity, Engineering simulation

Journal Articles

Accurate Predetermination of the Process Parameters for Glass/Glass Laser Bonding Based on the Temperature Distribution Analysis

Yanyi Xiao, Wen Wang, Jianhua Zhang

J. Electron. Packag. June 2016, 138(2): 021006.

Paper No: EP-15-1051

DOI: https://doi.org/10.1115/1.4033106

Published Online: April 15, 2016

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Topics: Bonding, Glass, Lasers, Temperature, Temperature distribution, Fittings, Sealing (Process)

Journal Articles

A Method for Thermal Performance Characterization of Ultrathin Vapor Chambers Cooled by Natural Convection

Gaurav Patankar, Simone Mancin, Justin A. Weibel, Suresh V. Garimella, Mark A. MacDonald

J. Electron. Packag. March 2016, 138(1): 010903.

Paper No: EP-15-1083

DOI: https://doi.org/10.1115/1.4032345

Published Online: March 10, 2016

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Topics: Calibration, Condensers (steam plant), Copper, Flat heat pipes, Heat, Heat losses, Natural convection, Temperature, Thermal resistance, Vapors

Journal Articles

Multiscale Transient Thermal Analysis of Microelectronics

Banafsheh Barabadi, Satish Kumar, Valeriy Sukharev, Yogendra K. Joshi

J. Electron. Packag. September 2015, 137(3): 031002.

Paper No: EP-13-1037

DOI: https://doi.org/10.1115/1.4029835

Published Online: September 1, 2015

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Topics: Microelectronic devices, Modeling, Simulation, Temperature, Thermal analysis, Transients (Dynamics), Temperature distribution

Journal Articles

Multiphysics Analysis for Temperature Rise of Electronic Connectors Using a Multiscale Model

K.-C. Liao, H.-L. Lu

J. Electron. Packag. September 2015, 137(3): 031012.

Paper No: EP-15-1034

DOI: https://doi.org/10.1115/1.4030803

Published Online: September 1, 2015

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Topics: Computer simulation, Molten salt reactors, Temperature, Temperature distribution

Journal Articles

A New Analytical Method for Calculating Maximum Junction Temperature of Packaged Devices Incorporating the Temperature Distribution at the Base of the Substrate

J. H. L. Ling, A. A. O. Tay

J. Electron. Packag. March 2015, 137(1): 014502.

Paper No: EP-13-1133

DOI: https://doi.org/10.1115/1.4028120

Published Online: October 6, 2014

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Topics: Temperature, Temperature distribution, Finite element analysis, Junctions, Heat

Journal Articles

Effect of Through-Silicon-Via Joule Heating on Device Performance for Low-Powered Mobile Applications

Fahad Mirza, Gaurang Naware, Ankur Jain, Dereje Agonafer

J. Electron. Packag. December 2014, 136(4): 041008.

Paper No: EP-13-1122

DOI: https://doi.org/10.1115/1.4028076

Published Online: September 19, 2014

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Topics: Heating, Joules, Junctions, Mechanical admittance, Silicon, Temperature, Heat, Temperature distribution

Journal Articles

Thermal Analysis of Air-Cooled Electronic Units With Integrated Offset Strip-Fin Heat Sink

Bengt Sundén, Gongnan Xie

J. Electron. Packag. June 2014, 136(2): 024501.

Paper No: EP-13-1058

DOI: https://doi.org/10.1115/1.4026538

Published Online: April 29, 2014

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Topics: Cooling, Heat, Heat sinks, Strips, Temperature, Thermal analysis, Thermal resistance, Electrical conductance, Invar, Temperature distribution

Journal Articles

A New Accurate Closed-Form Analytical Solution for Junction Temperature of High-Powered Devices

J. H. L. Ling, A. A. O. Tay

J. Electron. Packag. March 2014, 136(1): 011007.

Paper No: EP-13-1072

DOI: https://doi.org/10.1115/1.4026352

Published Online: January 16, 2014

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Topics: Gates (Closures), Heat, Temperature, Temperature distribution, Junctions, Finite element analysis, Thermal conductivity

Journal Articles

Effects of Voids in Sintered Silver Joint on Thermal and Optoelectronic Performances of High Power Laser Diode

Yi Yan, Youliang Guan, Xu Chen, Guo-Quan Lu

J. Electron. Packag. December 2013, 135(4): 041003.

Paper No: EP-13-1030

DOI: https://doi.org/10.1115/1.4025247

Published Online: September 4, 2013

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Topics: High power lasers, Lasers, Silver, Thermal stresses, Finite element analysis, Temperature, Wavelength, Currents, Simulation, Manufacturing

Journal Articles

Thermal-Structural Performance of Orthotropic Pin Fin in Electronics Cooling Applications

A. F. M. Arif, Syed M. Zubair, S. Pashah

J. Electron. Packag. December 2012, 134(4): 041005.

DOI: https://doi.org/10.1115/1.4007258

Published Online: October 30, 2012

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Topics: Composite materials, Computer cooling, Flow (Dynamics), Geometry, Heat, Heat sinks, Stress, Temperature, Thermal analysis, Epoxy adhesives

Journal Articles

Thermal Modeling Technique for Multiple Transistors Within Silicon Chip

Tohru Suwa, Hamid Hadim

J. Electron. Packag. December 2011, 133(4): 041015.

DOI: https://doi.org/10.1115/1.4005291

Published Online: December 23, 2011

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Topics: Finite element analysis, Heat, Modeling, Silicon chips, Temperature, Temperature distribution, Transistors

Journal Articles

Reliability Evaluation on Deterioration of Power Device Using Coupled Electrical-Thermal-Mechanical Analysis

Takashi Anzawa, Qiang Yu, Masanori Yamagiwa, Tadahiro Shibutani, Masaki Shiratori

J. Electron. Packag. September 2010, 132(3): 031012.

DOI: https://doi.org/10.1115/1.4002451

Published Online: September 30, 2010

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Topics: Bonding, Crack propagation, Fatigue life, Fracture (Materials), Reliability, Solder joints, Temperature, Temperature distribution, Wire, Wire bonding

Journal Articles

Novel Design of Thermal-Via Configurations for Collector-Up HBTs

Pei-Hsuan Lee, Hsien-Cheng Tseng, Jung-Hua Chou

J. Electron. Packag. December 2009, 131(4): 044501.

DOI: https://doi.org/10.1115/1.4000282

Published Online: October 21, 2009

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Topics: Design, Finite element model, Gallium arsenide, Temperature, Temperature distribution, Transistors, Finite element analysis, Packaging, Heat

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Journal citation

NARROW

Numerical and Parametric Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics

Fabrication Steps and Thermal Modeling of Three-Dimensional Asynchronous Field Programmable Gate Array (3D-AFPGA) With Through Silicon Via and Copper Pillar Bonding Approach

Advanced Characterization Techniques and Analysis of Thermal Properties of AlGaN/GaN Multifinger Power HEMTs on SiC Substrate Supported by Three-Dimensional Simulation

Reduced Order Modeling of Transient Heat Transfer in Microchip Interconnects

Airflow Management on the Efficiency Index of a Container Data Center Having Overhead Air Supply

Thermal Performance of a Light Emitting Diode Light Engine for a Multipurpose Automotive Exterior Lighting System With Competing Board Technologies

Assessment of Joule Heating and Temperature Distribution on Printed Circuit Boards Via Electrothermal Simulations

Accurate Predetermination of the Process Parameters for Glass/Glass Laser Bonding Based on the Temperature Distribution Analysis

A Method for Thermal Performance Characterization of Ultrathin Vapor Chambers Cooled by Natural Convection

Multiscale Transient Thermal Analysis of Microelectronics

Multiphysics Analysis for Temperature Rise of Electronic Connectors Using a Multiscale Model

A New Analytical Method for Calculating Maximum Junction Temperature of Packaged Devices Incorporating the Temperature Distribution at the Base of the Substrate

Effect of Through-Silicon-Via Joule Heating on Device Performance for Low-Powered Mobile Applications

Thermal Analysis of Air-Cooled Electronic Units With Integrated Offset Strip-Fin Heat Sink

A New Accurate Closed-Form Analytical Solution for Junction Temperature of High-Powered Devices

Effects of Voids in Sintered Silver Joint on Thermal and Optoelectronic Performances of High Power Laser Diode

Thermal-Structural Performance of Orthotropic Pin Fin in Electronics Cooling Applications

Thermal Modeling Technique for Multiple Transistors Within Silicon Chip

Reliability Evaluation on Deterioration of Power Device Using Coupled Electrical-Thermal-Mechanical Analysis

Novel Design of Thermal-Via Configurations for Collector-Up HBTs

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