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Journal Articles

Experimental and Numerical Investigation of Electromigration Behavior of Printed Silver Wire Under High Current Density

Haibin Zhang, Quan Sun, Zhidan Sun, Yebo Lu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021006.
Paper No: EP-22-1017
https://doi.org/10.1115/1.4055469
Published Online: September 28, 2022
View Article titled, Experimental and Numerical Investigation of Electromigration Behavior of Printed Silver Wire Under High Current Density
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Topics: Current density, Silver, Wire, Temperature gradient, Electrodiffusion
Journal Articles

Understanding Thermal Lagging Behaviors in Thermoelectric Elements With the Dual-Phase-Lag Model

Wing K. Yeung, Tung T. Lam
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031011.
Paper No: EP-21-1028
https://doi.org/10.1115/1.4052948
Published Online: December 27, 2021
View Article titled, Understanding Thermal Lagging Behaviors in Thermoelectric Elements With the Dual-Phase-Lag Model
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Topics: Heat flux, Relaxation (Physics), Temperature, Elemental semiconductors, Temperature gradient, Heat
Journal Articles

Microfeature Heat Exchanger Using Variable-Density Arrays for Near-Isothermal Cold-Plate Operation

Noris Gallandat, Danielle Hesse, J. Rhett Mayor
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 010908.
Paper No: EP-15-1096
https://doi.org/10.1115/1.4032347
Published Online: March 10, 2016
View Article titled, Microfeature Heat Exchanger Using Variable-Density Arrays for Near-Isothermal Cold-Plate Operation
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Topics: Convection, Density, Flow (Dynamics), Heat, Heat exchangers, Heat transfer, Hydrofoil, Pressure drop, Temperature, Water
Journal Articles

Multi-Objective Optimization to Improve Both Thermal and Device Performance of a Nonuniformly Powered Micro-Architecture

Saket Karajgikar, Dereje Agonafer, Kanad Ghose, Bahgat Sammakia, Cristina Amon, Gamal Refai-Ahmed
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2010, 132(2): 021008.
https://doi.org/10.1115/1.4001852
Published Online: June 25, 2010
View Article titled, Multi-Objective Optimization to Improve Both Thermal and Device Performance of a Nonuniformly Powered Micro-Architecture
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Topics: Junctions, Temperature, Pareto optimization, Delays, Temperature gradient, Engines
Journal Articles

Influence of Thermomigration on Lead-Free Solder Joint Mechanical Properties

Mohd F. Abdulhamid, Cemal Basaran
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011002.
https://doi.org/10.1115/1.3068296
Published Online: February 11, 2009
View Article titled, Influence of Thermomigration on Lead-Free Solder Joint Mechanical Properties
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Topics: Annealing, Lead-free solders, Mechanical properties, Solder joints, Solders, Temperature gradient, Tin, Testing, Elastic moduli, Nanoindentation
Journal Articles

Compact Thermal Models: A Global Approach

Mohamed-Nabil Sabry, Hossam Saleh Abdelmeguid
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Thermal Issues In Emerging Technologies Theory And Applications, Theta
J. Electron. Packag. December 2008, 130(4): 041107.
https://doi.org/10.1115/1.2993132
Published Online: November 14, 2008
View Article titled, Compact Thermal Models: A Global Approach
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Topics: Boundary-value problems, Cooling, Heat, Reliability, Temperature, Thermal analysis, Heat flux, Modeling, Resistors, Heat transfer
Journal Articles

Flexible Profile Compact Thermal Models for Practical Geometries

Mohamed-Nabil Sabry
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 256–259.
https://doi.org/10.1115/1.2753908
Published Online: April 16, 2007
View Article titled, Flexible Profile Compact Thermal Models for Practical Geometries
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Topics: Boundary-value problems, Errors, Heat, Heat flux, Heating, Temperature, Temperature gradient, Integrated circuit packaging, Multi-chip modules, Reliability
Journal Articles

Highlights from the European Thermal Project PROFIT

Clemens J. M. Lasance
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technology Review
J. Electron. Packag. December 2004, 126(4): 565–570.
https://doi.org/10.1115/1.1827258
Published Online: January 24, 2005
View Article titled, Highlights from the European Thermal Project PROFIT
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Topics: Modeling, Reliability, Safety, Steady state, Temperature, Computer software, Electronic products, Temperature gradient
Journal Articles

Transverse Temperature Gradient Effect on Fin Efficiency for Micro-Channel Design

Mohamed-Nabil Sabry
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section On Therminic
J. Electron. Packag. December 2001, 123(4): 344–350.
https://doi.org/10.1115/1.1390342
Published Online: March 21, 2001
View Article titled, Transverse Temperature Gradient Effect on Fin Efficiency for Micro-Channel Design
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Topics: Design, Fluids, Heat transfer, Microchannels, Temperature, Temperature gradient, Flow (Dynamics), Heat, Cooling
Journal Articles

Thermoelastic Modeling of a PWB With Simulated Circuit Traces Subjected to Infrared Reflow Soldering With Experimental Validation

Y. Polsky, I. C. Ume
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1999, 121(4): 263–270.
https://doi.org/10.1115/1.2793850
Published Online: December 1, 1999
View Article titled, Thermoelastic Modeling of a PWB With Simulated Circuit Traces Subjected to Infrared Reflow Soldering With Experimental Validation
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Topics: Circuits, Modeling, Printed circuit boards, Reflow soldering, Thermoelasticity, Warping, Copper, Elasticity, Lamination, Micromechanics (Engineering)
Journal Articles

Nonlinear Analysis of Full-Matrix and Perimeter Plastic Ball Grid Array Solder Joints

W. Jung, J. H. Lau, Y.-H. Pao
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1997, 119(3): 163–170.
https://doi.org/10.1115/1.2792229
Published Online: September 1, 1997
View Article titled, Nonlinear Analysis of Full-Matrix and Perimeter Plastic Ball Grid Array Solder Joints
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Topics: Ball-Grid-Array packaging, Solder joints, Reliability, Deformation, Finite element analysis, Manufacturing, Ball-Grid-Array packages, Ceramics, Computation, Constitutive equations
Journal Articles

Dynamic Aspects of Wetting Balance Tests

K. W. Moon, W. J. Boettinger, M. E. Williams, D. Josell, B. T. Murray, W. C. Carter, C. A. Handwerker
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1996, 118(3): 174–183.
https://doi.org/10.1115/1.2792149
Published Online: September 1, 1996
View Article titled, Dynamic Aspects of Wetting Balance Tests
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Topics: Wetting, Plates (structures), Fluids, Glass, Shapes, Solders, Computer software, Equilibrium (Physics), Flow (Dynamics), Shear stress
Journal Articles

Finite Element Viscoelastic Analysis of Temperature and Moisture Effects in Electronic Packaging

Arvind Krishna, B. D. Harper, J. K. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1995, 117(3): 192–200.
https://doi.org/10.1115/1.2792091
Published Online: September 1, 1995
View Article titled, Finite Element Viscoelastic Analysis of Temperature and Moisture Effects in Electronic Packaging
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Topics: Electronic packaging, Finite element analysis, Temperature, Stress, Creep, Cycles, Diffusion (Physics), Elastic analysis, Failure mechanisms, Finite element methods
Journal Articles

Steady-State Investigation of Vapor Deposited Micro Heat Pipe Arrays

A. K. Mallik, G. P. Peterson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1995, 117(1): 75–81.
https://doi.org/10.1115/1.2792070
Published Online: March 1, 1995
View Article titled, Steady-State Investigation of Vapor Deposited Micro Heat Pipe Arrays
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Topics: Heat pipes, Steady state, Vapors, Semiconductor wafers, Temperature, Temperature distribution, Temperature gradient, Thermal conductivity, Computer simulation, Flux (Metallurgy)
Journal Articles

Transient Response Characteristics of Vapor Deposited Micro Heat Pipe Arrays

G. P. Peterson, A. K. Mallik
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1995, 117(1): 82–87.
https://doi.org/10.1115/1.2792072
Published Online: March 1, 1995
View Article titled, Transient Response Characteristics of Vapor Deposited Micro Heat Pipe Arrays
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Topics: Heat pipes, Transients (Dynamics), Vapors, Semiconductor wafers, Computer simulation, Condensation, Imaging, Semiconductor device reliability, Temperature, Temperature gradient
Journal Articles

Two-Phase Electronic Cooling Using Mini-Channel and Micro-Channel Heat Sinks: Part 1—Design Criteria and Heat Diffusion Constraints

Morris B. Bowers, Issam Mudawar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1994, 116(4): 290–297.
https://doi.org/10.1115/1.2905700
Published Online: December 1, 1994
View Article titled, Two-Phase Electronic Cooling Using Mini-Channel and Micro-Channel Heat Sinks: Part 1—Design Criteria and Heat Diffusion Constraints
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Topics: Computer cooling, Design, Heat sinks, Microchannels, Thermal diffusion, Flow (Dynamics), Heat flux, Boiling, Cooling, Critical heat flux
Journal Articles

Study of an Air Cooling Scheme for 3-D Packaging

H. Xie, Y. C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1994, 116(1): 30–36.
https://doi.org/10.1115/1.2905490
Published Online: March 1, 1994
View Article titled, Study of an Air Cooling Scheme for 3-D Packaging
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Topics: Cooling, Packaging, Energy dissipation, Flow (Dynamics), Temperature, Circuits, Electrical measurement, Computer simulation, Flight, Heat sinks
Journal Articles

Modeling of Heat Transfer in the Surface Mounting of Electronic Components

S. K. Rastogi, D. Poulikakos
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1993, 115(4): 373–381.
https://doi.org/10.1115/1.2909346
Published Online: December 1, 1993
View Article titled, Modeling of Heat Transfer in the Surface Mounting of Electronic Components
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Topics: Electronic components, Heat transfer, Modeling, Temperature, Cracking (Materials), Fracture (Process), Printed circuit boards, Temperature gradient, Thermal stresses
Journal Articles

On the Use of Micro Heat Pipes as an Integral Part of Semiconductor Devices

A. K. Mallik, G. P. Peterson, M. H. Weichold
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1992, 114(4): 436–442.
https://doi.org/10.1115/1.2905477
Published Online: December 1, 1992
View Article titled, On the Use of Micro Heat Pipes as an Integral Part of Semiconductor Devices
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Topics: Heat pipes, Semiconductor devices, Computer simulation, Heat, Temperature, Temperature gradient, Density, Flat heat pipes, Flux (Metallurgy), Heat flux
Journal Articles

Predicted Bow of Plastic Packages Due to the Nonuniform Through-Thickness Distribution of Temperature

E. Suhir, L. T. Manzione
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1992, 114(3): 329–335.
https://doi.org/10.1115/1.2905459
Published Online: September 1, 1992
View Article titled, Predicted Bow of Plastic Packages Due to the Nonuniform Through-Thickness Distribution of Temperature
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Topics: Temperature, Molding, Warping, Cycles, Design, Geometry, Hardening (Curing), Materials properties, Molded plastics, Optimization