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Journal Articles

Foreword

Bahgat Sammakia, Dereje Agonafer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Foreword
J. Electron. Packag. December 2004, 126(4): 409.
https://doi.org/10.1115/1.1827273
Published Online: January 24, 2005
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Topics: Heat sinks, Packaging, Thermal engineering, Thermal management, Cooling, Computer cooling, Computers, Inventions, Design, Heat transfer
Journal Articles

Numerical Prediction of Flow and Heat Transfer in an Impingement Heat Sink

S. Sathe, K. M. Kelkar, K. C. Karki, C. Tai, C. Lamb, S. V. Patankar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1997, 119(1): 58–63.
https://doi.org/10.1115/1.2792201
Published Online: March 1, 1997
View Article titled, Numerical Prediction of Flow and Heat Transfer in an Impingement Heat Sink
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Topics: Flow (Dynamics), Heat sinks, Heat transfer, Ceramics, Fins, Nozzles, Cooling, Heat, Temperature, Air flow