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Journal Articles

Experimental Method to Measure High-Temperature Hygroscopic Swelling in Epoxy Mold Compounds and Dielectric Build-Up Films

Ian Chin, Wei Keat Loh, Seow Chien Kee, Yi He, Mohd. Zulkifly Abdullah, Masahiro Tsuriya
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2025, 147(1): 011009.
Paper No: EP-23-1055
https://doi.org/10.1115/1.4066083
Published Online: August 24, 2024
View Article titled, Experimental Method to Measure High-Temperature Hygroscopic Swelling in Epoxy Mold Compounds and Dielectric Build-Up Films
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Topics: Absorption, Epoxy resins, High temperature, Temperature, Thermal expansion
Journal Articles

Impact of Aging on Mechanical Properties of Thermally Conductive Gap Fillers

Abel Misrak, Tushar Chauhan, Pavan Rajmane, Rabin Bhandari, Dereje Agonafer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2020, 142(1): 011011.
Paper No: EP-19-1064
https://doi.org/10.1115/1.4045157
Published Online: November 8, 2019
View Article titled, Impact of Aging on Mechanical Properties of Thermally Conductive Gap Fillers
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Topics: Fillers (Materials), Fourier transform infrared spectroscopy, Infrared spectroscopy, Mechanical properties, Stress, Temperature, Testing, Thermomechanics, High temperature, Reliability
Journal Articles

Mechanical Characterization of Thermal Interface Materials and Its Challenges

Vijay Subramanian, Jorge Sanchez, Joseph Bautista, Yi He, Jinlin Wang, Abhishek Das, Jesus Gerardo Reyes Schuldes, Kyle Yazzie, Hemanth K. Dhavaleswarapu, Pramod Malatkar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. March 2019, 141(1): 010804.
Paper No: EP-18-1086
https://doi.org/10.1115/1.4042805
Published Online: March 13, 2019
View Article titled, Mechanical Characterization of Thermal Interface Materials and Its Challenges
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Topics: Adhesion, Compression, Shear (Mechanics), Temperature, Thermal expansion, Stress, Thermomechanics, Silicon
Journal Articles

Correlation of Warpage Distribution With the Material Property Scattering for Warpage Range Prediction of PBGA Components

Qiming Zhang, Jeffery C. C. Lo, S. W. Ricky Lee, Wei Xu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041005.
Paper No: EP-17-1072
https://doi.org/10.1115/1.4041064
Published Online: September 10, 2018
View Article titled, Correlation of Warpage Distribution With the Material Property Scattering for Warpage Range Prediction of PBGA Components
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Topics: Ball-Grid-Array packaging, Electromagnetic scattering, Materials properties, Radiation scattering, Scattering (Physics), Temperature, Thermal expansion, Warping, Simulation, Laminates
Journal Articles

Two-Phase Thermal Ground Planes: Technology Development and Parametric Results

Avram Bar-Cohen, Kaiser Matin, Nicholas Jankowski, Darin Sharar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. March 2015, 137(1): 010801.
Paper No: EP-14-1069
https://doi.org/10.1115/1.4028890
Published Online: November 14, 2014
View Article titled, Two-Phase Thermal Ground Planes: Technology Development and Parametric Results
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Topics: Cooling, Copper, Flat heat pipes, Fluids, Heat, Heat pipes, Silicon, Stress, Teams, Thermal conductivity
Journal Articles

Norris–Landzberg Acceleration Factors and Goldmann Constants for SAC305 Lead-Free Electronics

Pradeep Lall, Aniket Shirgaokar, Dinesh Arunachalam
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2012, 134(3): 031008.
https://doi.org/10.1115/1.4006863
Published Online: July 19, 2012
View Article titled, Norris–Landzberg Acceleration Factors and Goldmann Constants for SAC305 Lead-Free Electronics
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Topics: Cycles, Eigenvalues, Electronics, Failure, Model development, Reliability, Solders, Temperature, Thermal expansion, Thermomechanics
Journal Articles

40 μm Silver Flip-Chip Interconnect Technology With Solid-State Bonding

Chu-Hsuan Sha, Chin C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031012.
https://doi.org/10.1115/1.4004660
Published Online: September 30, 2011
View Article titled, 40 μm Silver Flip-Chip Interconnect Technology With Solid-State Bonding
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Topics: Bonding, Flip-chip, Silicon chips, Silver, Soldering, Thermal expansion, Pressure, Copper
Journal Articles

Low Temperature Solid State Gold Bonding of Si Chips to Alumina Substrates

Chu-Hsuan Sha, Chin C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021003.
https://doi.org/10.1115/1.4003868
Published Online: June 22, 2011
View Article titled, Low Temperature Solid State Gold Bonding of Si Chips to Alumina Substrates
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Topics: Bonding, Silicon chips, Pressure, Shear (Mechanics), Silicon, Thermal expansion, Low temperature, Temperature
Journal Articles

Comparative Study of Phenolic-Based and Amine-Based Underfill Materials in Flip Chip Plastic Ball Grid Array Package

Z. Kornain, A. Jalar, R. Rasid, S. Abdullah
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041012.
https://doi.org/10.1115/1.4002741
Published Online: December 8, 2010
View Article titled, Comparative Study of Phenolic-Based and Amine-Based Underfill Materials in Flip Chip Plastic Ball Grid Array Package
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Topics: Absorption, Adhesion, Flip-chip, Flip-chip devices, Fracture toughness, Packaging, Reliability, Shear (Mechanics), Temperature, Young's modulus
Journal Articles

Interactions Between Flip Chip Underfill and Solder Alloy

D. Blass, P. Borgesen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2010, 132(3): 031008.
https://doi.org/10.1115/1.4002010
Published Online: September 9, 2010
View Article titled, Interactions Between Flip Chip Underfill and Solder Alloy
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Topics: Alloys, Flip-chip, Flip-chip devices, Solders, Thermal shock, Thermal expansion, Testing, Adhesion, Reliability, Cycles
Journal Articles

Tungsten Carbide as a Diffusion Barrier on Silicon Nitride Active- Metal-Brazed Substrates for Silicon Carbide Power Devices

H. A. Mustain, William D. Brown, Simon S. Ang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2009, 131(3): 034502.
https://doi.org/10.1115/1.3153582
Published Online: July 14, 2009
View Article titled, Tungsten Carbide as a Diffusion Barrier on Silicon Nitride Active- Metal-Brazed Substrates for Silicon Carbide Power Devices
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Topics: Copper, Diffusion (Physics), Silicon, Silicon nitride ceramics, Tungsten, Annealing, High temperature, Metals, Temperature, Electron spectroscopy
Journal Articles

Characterization of Chemical Cure Shrinkage of Epoxy Molding Compound With Application to Warpage Analysis

Guojun Hu, Jing-En Luan, Spencer Chew
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011010.
https://doi.org/10.1115/1.3068321
Published Online: February 13, 2009
View Article titled, Characterization of Chemical Cure Shrinkage of Epoxy Molding Compound With Application to Warpage Analysis
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Topics: Epoxy resins, Finite element analysis, Molding, Shrinkage (Materials), Warping, Thermal expansion, Temperature, Fillers (Materials)
Journal Articles

Nonlinear Viscoelastic Finite Element Analysis of Physical Aging in an Encapsulated Transformer

M. A. Neidigk, Y.-L. Shen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011003.
https://doi.org/10.1115/1.3068298
Published Online: February 11, 2009
View Article titled, Nonlinear Viscoelastic Finite Element Analysis of Physical Aging in an Encapsulated Transformer
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Topics: Ceramics, Coating processes, Coatings, Computer simulation, Cooling, Epoxy resins, Failure, Ferrites (Magnetic materials), Finite element analysis, Manufacturing
Journal Articles

Comparative Studies on Solder Joint Reliability of Plastic and Ceramic Ball Grid Array Packages of the Same Form Factor Under Power and Accelerated Thermal Cycling

S. B. Park, Rahul Joshi, Izhar Ahmed, Soonwan Chung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2008, 130(4): 041004.
https://doi.org/10.1115/1.2993146
Published Online: November 17, 2008
View Article titled, Comparative Studies on Solder Joint Reliability of Plastic and Ceramic Ball Grid Array Packages of the Same Form Factor Under Power and Accelerated Thermal Cycling
Open the PDF for Comparative Studies on Solder Joint Reliability of Plastic and Ceramic Ball Grid Array Packages of the Same Form Factor Under Power and Accelerated Thermal Cycling in another window
Topics: Ball-Grid-Array packages, Ceramics, Computational fluid dynamics, Deformation, Finite element analysis, Flip-chip devices, Interferometry, Manufacturing, Reliability, Solder joints
Journal Articles

Direct Silver to Copper Bonding Process

Pin J. Wang, Jong S. Kim, Chin C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Design Innovations
J. Electron. Packag. December 2008, 130(4): 045001.
https://doi.org/10.1115/1.2993144
Published Online: November 14, 2008
View Article titled, Direct Silver to Copper Bonding Process
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Topics: Bonding, Copper, Silver, Electronic packaging, Thermal expansion, Stress, Scanning electron microscopy
Journal Articles

Nonlinear Stress Modeling Scheme to Analyze Semiconductor Packages Subjected to Combined Thermal and Hygroscopic Loading

Samson Yoon, Changsoo Jang, Bongtae Han
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. June 2008, 130(2): 024502.
https://doi.org/10.1115/1.2912181
Published Online: May 14, 2008
View Article titled, Nonlinear Stress Modeling Scheme to Analyze Semiconductor Packages Subjected to Combined Thermal and Hygroscopic Loading
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Topics: Diffusion (Physics), Finite element analysis, Heat transfer, Modeling, Semiconductors (Materials), Stress, Stress analysis (Engineering), Temperature, Deformation, Thermal expansion
Journal Articles

On Failure Mechanisms in Flip Chip Assembly—Part 1: Short-Time Scale Wave Motion

Yoonchan Oh, C. Steve Suh, Hung-Jue Sue
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021008.
https://doi.org/10.1115/1.2912188
Published Online: May 9, 2008
View Article titled, On Failure Mechanisms in Flip Chip Assembly—Part 1: Short-Time Scale Wave Motion
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Topics: Damage, Failure, Failure mechanisms, Flip-chip devices, High cycle fatigue, Power density, Solders, Stress, Thermal expansion, Wave motion
Journal Articles

Shorter Field Life in Power Cycling for Organic Packages

S. B. Park, Izhar Z. Ahmed
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 28–34.
https://doi.org/10.1115/1.2429706
Published Online: May 1, 2006
View Article titled, Shorter Field Life in Power Cycling for Organic Packages
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Topics: Computational fluid dynamics, Finite element analysis, Flip-chip devices, Manufacturing, Reliability, Solders, Temperature, Ball-Grid-Array packaging, Structural analysis, Cycles
Journal Articles

Discussion on the Reliability Issues of Solder-Bump and Direct-Solder Bonded Power Device Packages Having Double-Sided Cooling Capability

John G. Bai, Jesus N. Calata, Guo-Quan Lu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 208–214.
https://doi.org/10.1115/1.2229218
Published Online: August 26, 2005
View Article titled, Discussion on the Reliability Issues of Solder-Bump and Direct-Solder Bonded Power Device Packages Having Double-Sided Cooling Capability
Open the PDF for Discussion on the Reliability Issues of Solder-Bump and Direct-Solder Bonded Power Device Packages Having Double-Sided Cooling Capability in another window
Topics: Cooling, Finite element analysis, Reliability, Solders, Temperature, Stress, Thermomechanics, Thermal expansion
Journal Articles

Development of Novel Filler Technology for No-Flow and Wafer Level Underfill Materials

Slawomir Rubinsztajn, Donald Buckley, John Campbell, David Esler, Eric Fiveland, Ananth Prabhakumar, Donna Sherman, Sandeep Tonapi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 77–85.
https://doi.org/10.1115/1.1846067
Published Online: June 3, 2005
View Article titled, Development of Novel Filler Technology for No-Flow and Wafer Level Underfill Materials
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Topics: Fillers (Materials), Flip-chip devices, Flow (Dynamics), Reliability, Resins, Semiconductor wafers, Flip-chip, Thermal expansion, Epoxy resins, Solder joints