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Journal Articles

Design and Fabrication of Leadless Package Structure for Pressure Sensors

Junwang Tian, Zhong Jin, Xin Tang, Wenxian Peng, Junfu Liu, Yunpeng Liu, Taotao Chen, Jinqing Xiao, Junhui Li

J. Electron. Packag. December 2022, 144(4): 041005.

Paper No: EP-21-1036

DOI: https://doi.org/10.1115/1.4052246

Published Online: November 22, 2021

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Topics: Design, Glass, Manufacturing, Pressure, Pressure sensors, Silver, Thermal stresses, Bonding, Stress, Temperature

Journal Articles

Novel Transient Liquid Phase Bonding for High-Temperature Automotive Power Electronics Systems

Yanghe Liu, Shailesh N. Joshi, Ercan M. Dede

J. Electron. Packag. March 2020, 142(1): 011003.

Paper No: EP-19-1014

DOI: https://doi.org/10.1115/1.4044476

Published Online: September 19, 2019

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Topics: Bonding, Electronics, High temperature, Manufacturing, Stress, Tension-leg platforms, Thermal stresses, Tin, Transients (Dynamics), Temperature

Journal Articles

Thermal Cycling Study of Quilt Packaging

M. Ashraf Khan, Quanling Zheng, David Kopp, Wayne Buckhanan, Jason M. Kulick, Patrick Fay, Alfred M. Kriman, Gary H. Bernstein

J. Electron. Packag. June 2015, 137(2): 021008.

Paper No: EP-14-1057

DOI: https://doi.org/10.1115/1.4029245

Published Online: June 1, 2015

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Topics: Cycles, Packaging, Quadratic programming, Solders, Testing, Stress, Copper, Failure, Reliability, Tin

Journal Articles

Analysis of Thermal Stress and Its Influence on Carrier Mobility in Three-Dimensional Microelectronic Chip Stack

R. W. Johnson, Y.-L. Shen

J. Electron. Packag. June 2015, 137(2): 021011.

Paper No: EP-14-1045

DOI: https://doi.org/10.1115/1.4029345

Published Online: June 1, 2015

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Topics: Electron mobility, Solders, Stress, Thermal stresses, Intermetallic compounds, Deformation

Journal Articles

Effects of Voids in Sintered Silver Joint on Thermal and Optoelectronic Performances of High Power Laser Diode

Yi Yan, Youliang Guan, Xu Chen, Guo-Quan Lu

J. Electron. Packag. December 2013, 135(4): 041003.

Paper No: EP-13-1030

DOI: https://doi.org/10.1115/1.4025247

Published Online: September 4, 2013

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Topics: High power lasers, Lasers, Silver, Thermal stresses, Finite element analysis, Temperature, Wavelength, Currents, Simulation, Manufacturing

Journal Articles

Thermal-Structural Performance of Orthotropic Pin Fin in Electronics Cooling Applications

A. F. M. Arif, Syed M. Zubair, S. Pashah

J. Electron. Packag. December 2012, 134(4): 041005.

DOI: https://doi.org/10.1115/1.4007258

Published Online: October 30, 2012

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Topics: Composite materials, Computer cooling, Flow (Dynamics), Geometry, Heat, Heat sinks, Stress, Temperature, Thermal analysis, Epoxy adhesives

Journal Articles

Thermal Stresses of Through Silicon Vias and Si Chips in Three Dimensional System in Package

Takahiro Kinoshita, Takashi Kawakami, Tatsuhiro Hori, Keiji Matsumoto, Sayuri Kohara, Yasumitsu Orii, Fumiaki Yamada, Morihiro Kada

J. Electron. Packag. June 2012, 134(2): 020903.

DOI: https://doi.org/10.1115/1.4006515

Published Online: June 11, 2012

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Topics: Finite element methods, Silicon, Silicon chips, Simulation, Stress, System-in-package, Thermal stresses, Temperature, Stress concentration

Journal Articles

The Use of Potting Materials for Electronic-Packaging Survivability in Smart Munitions

N. H. Chao, J. A. Cordes, D. Carlucci, M. E. DeAngelis, Jyeching Lee

J. Electron. Packag. December 2011, 133(4): 041003.

DOI: https://doi.org/10.1115/1.4005375

Published Online: December 8, 2011

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Topics: Munitions, Simulation, Temperature, Thermal stresses, Transients (Dynamics), Electronic packaging, Microelectromechanical systems

Journal Articles

Thermal Stresses Due to Laser Welding in Bridge-Wire Initiators

Michael R. Maughan, Robert R. Stephens, Donald M. Blackketter, Karl K. Rink

J. Electron. Packag. March 2009, 131(1): 011009.

DOI: https://doi.org/10.1115/1.3068318

Published Online: February 13, 2009

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Topics: Finite element analysis, Glass, Press fits, Shear stress, Stress, Thermal stresses, Welding, Wire, Bridges (Structures), Laser welding

Journal Articles

Nonlinear Viscoelastic Finite Element Analysis of Physical Aging in an Encapsulated Transformer

M. A. Neidigk, Y.-L. Shen

J. Electron. Packag. March 2009, 131(1): 011003.

DOI: https://doi.org/10.1115/1.3068298

Published Online: February 11, 2009

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Topics: Ceramics, Coating processes, Coatings, Computer simulation, Cooling, Epoxy resins, Failure, Ferrites (Magnetic materials), Finite element analysis, Manufacturing

Journal Articles

On Failure Mechanisms in Flip Chip Assembly—Part 1: Short-Time Scale Wave Motion

Yoonchan Oh, C. Steve Suh, Hung-Jue Sue

J. Electron. Packag. June 2008, 130(2): 021008.

DOI: https://doi.org/10.1115/1.2912188

Published Online: May 9, 2008

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Topics: Damage, Failure, Failure mechanisms, Flip-chip devices, High cycle fatigue, Power density, Solders, Stress, Thermal expansion, Wave motion

Journal Articles

Improved Method of C O 2 Laser Cutting of Aluminum Nitride

Raathai Molian, Pranav Shrotriya, Pal Molian

J. Electron. Packag. June 2008, 130(2): 024501.

DOI: https://doi.org/10.1115/1.2912223

Published Online: May 8, 2008

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Topics: Aluminum, Cutting, Fracture (Materials), Laser cutting, Lasers, Thermal stresses, Fracture (Process), Oxygen, Stress

Journal Articles

Interfacial Thermal Stresses in Trilayer Assemblies

H. R. Ghorbani, J. K. Spelt

J. Electron. Packag. September 2005, 127(3): 314–323.

DOI: https://doi.org/10.1115/1.1938205

Published Online: November 24, 2004

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Topics: Shear (Mechanics), Shear stress, Stress, Manufacturing, Plane strain, Thermal stresses, Finite element analysis

Journal Articles

Multi-Physics Simulation of a Microprocessor Package Under Water Cooling

Liu Bao-Min, Mui Y. C.

J. Electron. Packag. September 2004, 126(3): 384–389.

DOI: https://doi.org/10.1115/1.1774197

Published Online: October 6, 2004

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Topics: Cooling, Flow (Dynamics), Simulation, Thermal stresses, Water, Thermal resistance, Temperature, Physics

Journal Articles

The Thermoelastic Analysis of Chip-Substrate System

Linzhi Wu

J. Electron. Packag. September 2004, 126(3): 325–332.

DOI: https://doi.org/10.1115/1.1772413

Published Online: October 6, 2004

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Topics: Fourier series, Heat conduction, Integrated circuits, Stress, Temperature, Thermal stresses, Thermoelasticity, Stress concentration, Reliability, Heat

Journal Articles

A Note on Suhir’s Solution of Thermal Stresses for a Die-Substrate Assembly

M. Y. Tsai, C. H. Hsu, C. N. Han

J. Electron. Packag. March 2004, 126(1): 115–119.

DOI: https://doi.org/10.1115/1.1648056

Published Online: April 30, 2004

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Topics: Manufacturing, Stress, Thermal stresses, Warping, Finite element analysis, Shear (Mechanics), Deformation

Journal Articles

Controlled Fracture of Nonmetallic Thin Wafers Using a Laser Thermal Shock Method

T. Elperin, G. Rudin

J. Electron. Packag. March 2004, 126(1): 142–147.

DOI: https://doi.org/10.1115/1.1649245

Published Online: April 30, 2004

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Topics: Fracture (Materials), Laser beams, Lasers, Microcracks, Semiconductor wafers, Thermal shock, Thermal stresses, Temperature

Journal Articles

Thermal Stress and Deflection Analysis of a Glass Window (Circular Plate) Elastically Restrained Along its Edge in a Photonic Device

John H. Lau, Fellow ASME, Steve Erasmus, Yida Zou

J. Electron. Packag. December 2003, 125(4): 602–608.

DOI: https://doi.org/10.1115/1.1604807

Published Online: December 15, 2003

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Topics: Deflection, Glass, Stress, Boundary-value problems, Pressure, Temperature, Double refraction, Thermal stresses

Journal Articles

Modeling of Thermal Stress in Microelectronic and Photonic Structures: Role, Attributes, Challenges, and Brief Review

E. Suhir, Fellow ASME,

J. Electron. Packag. June 2003, 125(2): 261–267.

DOI: https://doi.org/10.1115/1.1569510

Published Online: June 10, 2003

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Topics: Modeling, Stress, Thermal stresses, Finite element analysis, Photonics, Thermal expansion, Design, Microelectronic devices, Optical fiber, Manufacturing

Journal Articles

Thermomechanical Stress Analysis of Multi-Layered Electronic Packaging

Yujun Wen, PhD candidate, Cemal Basaran, Assoc. Prof. and Director

J. Electron. Packag. March 2003, 125(1): 134–138.

DOI: https://doi.org/10.1115/1.1535446

Published Online: March 14, 2003

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Topics: Delamination, Electronic packaging, Finite element analysis, Finite element methods, Laminates, Stress, Stress analysis (Engineering), Thermal stresses, Materials properties, Thermomechanics

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Journal citation

NARROW

Design and Fabrication of Leadless Package Structure for Pressure Sensors

Novel Transient Liquid Phase Bonding for High-Temperature Automotive Power Electronics Systems

Thermal Cycling Study of Quilt Packaging

Analysis of Thermal Stress and Its Influence on Carrier Mobility in Three-Dimensional Microelectronic Chip Stack

Effects of Voids in Sintered Silver Joint on Thermal and Optoelectronic Performances of High Power Laser Diode

Thermal-Structural Performance of Orthotropic Pin Fin in Electronics Cooling Applications

Thermal Stresses of Through Silicon Vias and Si Chips in Three Dimensional System in Package

The Use of Potting Materials for Electronic-Packaging Survivability in Smart Munitions

Thermal Stresses Due to Laser Welding in Bridge-Wire Initiators

Nonlinear Viscoelastic Finite Element Analysis of Physical Aging in an Encapsulated Transformer

On Failure Mechanisms in Flip Chip Assembly—Part 1: Short-Time Scale Wave Motion

Improved Method of C O 2 Laser Cutting of Aluminum Nitride

Interfacial Thermal Stresses in Trilayer Assemblies

Multi-Physics Simulation of a Microprocessor Package Under Water Cooling

The Thermoelastic Analysis of Chip-Substrate System

A Note on Suhir’s Solution of Thermal Stresses for a Die-Substrate Assembly

Controlled Fracture of Nonmetallic Thin Wafers Using a Laser Thermal Shock Method

Thermal Stress and Deflection Analysis of a Glass Window (Circular Plate) Elastically Restrained Along its Edge in a Photonic Device

Modeling of Thermal Stress in Microelectronic and Photonic Structures: Role, Attributes, Challenges, and Brief Review

Thermomechanical Stress Analysis of Multi-Layered Electronic Packaging

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