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Journal Articles

Development of a High Cycle Fatigue Life Prediction Model for Thin Film Silicon Structures

Chia-Cheng Chang, Sheng-Da Lin, Kuo-Ning Chiang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031008.
Paper No: EP-18-1004
https://doi.org/10.1115/1.4040297
Published Online: June 26, 2018
View Article titled, Development of a High Cycle Fatigue Life Prediction Model for Thin Film Silicon Structures
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Topics: Stress, High cycle fatigue, Displacement, Silicon, Thin films, Fatigue life
Journal Articles

Determination of Energy Release Rate Through Sequential Crack Extension

Scott McCann, Gregory T. Ostrowicki, Anh Tran, Timothy Huang, Tobias Bernhard, Rao R. Tummala, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2017, 139(4): 041003.
Paper No: EP-17-1033
https://doi.org/10.1115/1.4037334
Published Online: August 25, 2017
View Article titled, Determination of Energy Release Rate Through Sequential Crack Extension
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Topics: Fracture (Materials), Thin films, Copper
Journal Articles

Characterization of Bulk and Thin Film Fracture in Electronic Packaging

Vijay Subramanian, Kyle Yazzie, Tsgereda Alazar, Bharat Penmecha, Pilin Liu, Yiqun Bai, Pramod Malatkar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2017, 139(2): 020912.
Paper No: EP-17-1010
https://doi.org/10.1115/1.4036661
Published Online: June 12, 2017
View Article titled, Characterization of Bulk and Thin Film Fracture in Electronic Packaging
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Topics: Failure, Fracture (Materials), Fracture toughness, Solder masks, Stress, Thin films, Membranes, Fracture (Process), Electronic packaging, Testing
Journal Articles

Effect of the Crystallinity on the Electromigration Resistance of Electroplated Copper Thin-Film Interconnections

Takeru Kato, Ken Suzuki, Hideo Miura
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2017, 139(2): 020911.
Paper No: EP-16-1144
https://doi.org/10.1115/1.4036442
Published Online: June 12, 2017
View Article titled, Effect of the Crystallinity on the Electromigration Resistance of Electroplated Copper Thin-Film Interconnections
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Topics: Atoms, Copper, Current density, Diffusion (Physics), Electrodiffusion, Grain boundaries, Reliability, Temperature, Thin films, Heating
Journal Articles

Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials

Dongliang Zhao, Xin Qian, Xiaokun Gu, Saad Ayub Jajja, Ronggui Yang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. December 2016, 138(4): 040802.
Paper No: EP-16-1067
https://doi.org/10.1115/1.4034605
Published Online: October 6, 2016
View Article titled, Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials
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Topics: Temperature, Thermal conductivity, Thin films, Transients (Dynamics), Heat, Steady state, Sensors, Bulk solids, Thermoreflectance, Lasers
Journal Articles

Stretchable Thin Film Materials: Fabrication, Application, and Mechanics

Yu Wang, Zhengwei Li, Jianliang Xiao
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. June 2016, 138(2): 020801.
Paper No: EP-15-1122
https://doi.org/10.1115/1.4032984
Published Online: April 18, 2016
View Article titled, Stretchable Thin Film Materials: Fabrication, Application, and Mechanics
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Topics: Buckling, Manufacturing, Thin films, Deformation, Plasma desorption mass spectrometry, Electronics, Design
Journal Articles

Analysis of ZnO Thin Film as Thermal Interface Material for High Power Light Emitting Diode Application

S. Shanmugan, O. Zeng Yin, P. Anithambigai, D. Mutharasu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 011001.
Paper No: EP-13-1112
https://doi.org/10.1115/1.4032029
Published Online: March 10, 2016
View Article titled, Analysis of ZnO Thin Film as Thermal Interface Material for High Power Light Emitting Diode Application
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Topics: Boundary-value problems, Thin films, Light-emitting diodes, Temperature, Thermal resistance
Journal Articles

Effect of Crystallographic Quality of Grain Boundaries on Both Mechanical and Electrical Properties of Electroplated Copper Thin Film Interconnections

Naokazu Murata, Naoki Saito, Kinji Tamakawa, Ken Suzuki, Hideo Miura
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2015, 137(3): 031001.
Paper No: EP-11-1060
https://doi.org/10.1115/1.4029931
Published Online: September 1, 2015
View Article titled, Effect of Crystallographic Quality of Grain Boundaries on Both Mechanical and Electrical Properties of Electroplated Copper Thin Film Interconnections
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Topics: Annealing, Copper, Grain boundaries, Thin films, Electrical properties, Electron backscatter diffraction
Journal Articles

Thermal Resistance Analysis of High Power Light Emitting Diode Using Aluminum Nitride Thin Film-Coated Copper Substrates as Heat Sink

S. Shanmugan, D. Mutharasu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2014, 136(3): 034502.
Paper No: EP-13-1099
https://doi.org/10.1115/1.4027379
Published Online: May 12, 2014
View Article titled, Thermal Resistance Analysis of High Power Light Emitting Diode Using Aluminum Nitride Thin Film-Coated Copper Substrates as Heat Sink
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Topics: Aluminum, Calibration, Copper, Currents, Heat sinks, Junctions, Light-emitting diodes, Temperature, Thermal resistance, Thin films
Journal Articles

Solid-State Microrefrigeration in Conjunction With Liquid Cooling

Younes Ezzahri, Ali Shakouri
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2010, 132(3): 031002.
https://doi.org/10.1115/1.4001853
Published Online: September 8, 2010
View Article titled, Solid-State Microrefrigeration in Conjunction With Liquid Cooling
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Topics: Cooling, Temperature, Thermoelectric coolers, Thin films
Journal Articles

Integration of Ta–N Thin Film Resistors on Anodic Alumina MCM-D Substrate

Dapeng Zhu, Xiaoqin Lin, Le Luo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011006.
https://doi.org/10.1115/1.3068305
Published Online: February 12, 2009
View Article titled, Integration of Ta–N Thin Film Resistors on Anodic Alumina MCM-D Substrate
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Topics: Resistors, Thin films, Tantalum
Journal Articles

Lattice Boltzmann Modeling of Subcontinuum Energy Transport in Crystalline and Amorphous Microelectronic Devices

Rodrigo Escobar, Brian Smith, Cristina Amon
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2006, 128(2): 115–124.
https://doi.org/10.1115/1.2188951
Published Online: January 19, 2006
View Article titled, Lattice Boltzmann Modeling of Subcontinuum Energy Transport in Crystalline and Amorphous Microelectronic Devices
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Topics: Phonons, Silicon, Temperature, Thermal conductivity, Thin films, Lattice Boltzmann methods, Mean free path, Microelectronic devices, Electrical conductivity
Journal Articles

Finite Thickness Influence on Spherical and Conical Indentation on Viscoelastic Thin Polymer Film

V. Gonda, J. den Toonder, J. Beijer, G. Q. Zhang, L. J. Ernst
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 33–37.
https://doi.org/10.1115/1.1846065
Published Online: March 21, 2005
View Article titled, Finite Thickness Influence on Spherical and Conical Indentation on Viscoelastic Thin Polymer Film
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Topics: Polymer films, Thin films, Testing, Creep, Nanoindentation, Stress, Temperature, Viscoelasticity
Journal Articles

State-of-the-Art of Thermo-Mechanical Characterization of Thin Polymer Films

K. M. B. Jansen, V. Gonda, L. J. Ernst, H. J. L. Bressers, G. Q. Zhang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technology Review
J. Electron. Packag. December 2005, 127(4): 530–536.
https://doi.org/10.1115/1.2070092
Published Online: December 22, 2004
View Article titled, State-of-the-Art of Thermo-Mechanical Characterization of Thin Polymer Films
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Topics: Deflection, Electromagnetic scattering, Film thickness, Nanoindentation, Polymer films, Polymers, Radiation scattering, Scattering (Physics), Stress, Thermomechanics
Journal Articles

The Alignment Shift Formation Mechanism of Thin Film Based DWDM Module With Solder Assembly Packaging

Samuel I-En Lin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 273–281.
https://doi.org/10.1115/1.1756592
Published Online: October 6, 2004
View Article titled, The Alignment Shift Formation Mechanism of Thin Film Based DWDM Module With Solder Assembly Packaging
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Topics: Solders, Metals, Manufacturing, Thin films, Deformation
Journal Articles

Environmental Aging and Deadhesion of Polyimide Dielectric Films

Steven Murray, Craig Hillman, Michael Pecht
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 390–397.
https://doi.org/10.1115/1.1773853
Published Online: October 6, 2004
View Article titled, Environmental Aging and Deadhesion of Polyimide Dielectric Films
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Topics: Adhesion, Damage, Fatigue, Stress, Temperature, Thin films, Polymers, Failure, Fracture (Materials), Design
Journal Articles

Design of Micro-Temperature Sensor Array With Thin Film Thermocouples

Jong-Jin Park, Minoru Taya
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 286–289.
https://doi.org/10.1115/1.1997157
Published Online: August 4, 2004
View Article titled, Design of Micro-Temperature Sensor Array With Thin Film Thermocouples
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Topics: Heat conduction, Sensors, Temperature, Thermocouples, Thin films, Copper, Steady state, Heat, Flow (Dynamics), Finite element analysis
Journal Articles

Multiscale Mechanics in Microelectronics: A Paradigm in Miniaturization

M. G. D. Geers, V. Kouznetsova, W. A. M. Brekelmans
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 255–261.
https://doi.org/10.1115/1.1939007
Published Online: June 24, 2004
View Article titled, Multiscale Mechanics in Microelectronics: A Paradigm in Miniaturization
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Topics: Continuum mechanics, Deformation, Dislocations, Lumber, Microelectronic devices, Plasticity, Strain gradient, Boundary-value problems, Metals, Stress
Journal Articles

Packaging of Optical MEMS Devices

Yee L. Low, Ronald E. Scotti, David A. Ramsey, Cristian A. Bolle, Steven P. O’Neill, Khanh C. Nguyen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 325–328.
https://doi.org/10.1115/1.1535933
Published Online: September 17, 2003
View Article titled, Packaging of Optical MEMS Devices
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Topics: Ceramics, Microelectromechanical systems, Packaging, Thin films
Journal Articles

Intrinsic Strain Modeling and Residual Stress Analysis for Thin-Film Processing of Layered Structures

Mehrdad N. Ghasemi Nejhad, Mem. ASME, Chiling Pan, Hongwei Feng
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 4–17.
https://doi.org/10.1115/1.1512295
Published Online: March 14, 2003
View Article titled, Intrinsic Strain Modeling and Residual Stress Analysis for Thin-Film Processing of Layered Structures
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Topics: Finite element analysis, Modeling, Residual stresses, Stress, Stress analysis (Engineering), Temperature, Thin films, Microelectromechanical systems