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Journal Articles

Viscoelastic Influence on the Board Level Assessment of Wafer Level Packages Under Drop Impact and Under Thermal Cycling

Abel Misrak, Rabin Bhandari, Dereje Agonafer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011204.
Paper No: EP-21-1110
https://doi.org/10.1115/1.4054784
Published Online: August 3, 2022
View Article titled, Viscoelastic Influence on the Board Level Assessment of Wafer Level Packages Under Drop Impact and Under Thermal Cycling
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Topics: Glass transition, Reliability, Semiconductor wafers, Storage, Stress, Temperature, Testing, Viscoelasticity, Solders, Failure
Journal Articles

Microstructural Evolution of Viscoelastic Properties of Underfills Under Sustained High Temperature Operation

Pradeep Lall, Madhu Kasturi, Haotian Wu, Jeff Suhling, Edward Davis
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021113.
Paper No: EP-21-1059
https://doi.org/10.1115/1.4052715
Published Online: January 4, 2022
View Article titled, Microstructural Evolution of Viscoelastic Properties of Underfills Under Sustained High Temperature Operation
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Topics: Flip-chip, Glass transition, High temperature, Mechanical properties, Oxidation, Solders, Storage, Temperature, Viscoelasticity, Optical microscopes
Journal Articles

On Failure Mechanisms in Flip Chip Assembly—Part 2: Optimal Underfill and Interconnecting Materials

Yoonchan Oh, C. Steve Suh, Hung-Jue Sue
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021009.
https://doi.org/10.1115/1.2912209
Published Online: May 9, 2008
View Article titled, On Failure Mechanisms in Flip Chip Assembly—Part 2: Optimal Underfill and Interconnecting Materials
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Topics: Damage, Epoxy resins, Failure mechanisms, Flip-chip, Flip-chip devices, Reliability, Solder joints, Solders, Viscoelasticity, Waves
Journal Articles

Viscoelastic Influence on Dynamic Properties of PCB Under Drop Impact

Fang Liu, Guang Meng, Mei Zhao
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 266–272.
https://doi.org/10.1115/1.2753910
Published Online: March 15, 2007
View Article titled, Viscoelastic Influence on Dynamic Properties of PCB Under Drop Impact
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Topics: Damping, Deflection, Dynamics (Mechanics), Springs, Viscoelasticity, Viscosity, Dynamic analysis
Journal Articles

Stochastic Characterization and Models to Predict Performance Uncertainty in Photonic Packages

S. Radhakrishnan, G. Subbarayan, L. Nguyen, W. Mazotti
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 229–235.
https://doi.org/10.1115/1.2753885
Published Online: October 22, 2006
View Article titled, Stochastic Characterization and Models to Predict Performance Uncertainty in Photonic Packages
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Topics: Epoxy adhesives, Epoxy resins, Uncertainty, Viscoelasticity, Temperature, Modeling, Lasers, Displacement
Journal Articles

Finite Thickness Influence on Spherical and Conical Indentation on Viscoelastic Thin Polymer Film

V. Gonda, J. den Toonder, J. Beijer, G. Q. Zhang, L. J. Ernst
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 33–37.
https://doi.org/10.1115/1.1846065
Published Online: March 21, 2005
View Article titled, Finite Thickness Influence on Spherical and Conical Indentation on Viscoelastic Thin Polymer Film
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Topics: Polymer films, Thin films, Testing, Creep, Nanoindentation, Stress, Temperature, Viscoelasticity
Journal Articles

Viscoelastic Characterization of Low-Dielectric Constant SiLK Films Using Nanoindentation in Combination With Finite Element Modeling

J. M. J. den Toonder, Y. Ramone, A. R. van Dijken, J. G. J. Beijer, G. Q. Zhang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 276–285.
https://doi.org/10.1115/1.1938990
Published Online: August 12, 2004
View Article titled, Viscoelastic Characterization of Low-Dielectric Constant SiLK Films Using Nanoindentation in Combination With Finite Element Modeling
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Topics: Creep, Finite element analysis, Modeling, Nanoindentation, Stress, Viscoelasticity, Manganese (Metal), Silicon, Relaxation (Physics), Displacement
Journal Articles

Hygrothermal Cracking Analysis of Plastic IC Package

Ji Hyuck Yang, Kang Yong Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 164–171.
https://doi.org/10.1115/1.1870016
Published Online: June 8, 2004
View Article titled, Hygrothermal Cracking Analysis of Plastic IC Package
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Topics: Delamination, Fracture (Materials), Fracture (Process), Fracture mechanics, High temperature, Reflow soldering, Vapor pressure, Viscoelasticity, Low temperature, Design
Journal Articles

Packaging Induced Die Stresses—Effect of Chip Anisotropy and Time-Dependent Behavior of a Molding Compound

W. D. van Driel, J. H. J. Janssen, G. Q. Zhang, D. G. Yang, L. J. Ernst
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 520–526.
https://doi.org/10.1115/1.1604153
Published Online: December 15, 2003
View Article titled, Packaging Induced Die Stresses—Effect of Chip Anisotropy and Time-Dependent Behavior of a Molding Compound
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Topics: Anisotropy, Molding, Packaging, Stress, Temperature, Viscoelasticity, Finite element analysis
Journal Articles

An Analytical Model for Time-Dependent Shearing Deformation in Area-Array Interconnects

S. M. Heinrich, S. Shakya, J. Liang, P. S. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2000, 122(4): 328–334.
https://doi.org/10.1115/1.1289631
Published Online: January 28, 2000
View Article titled, An Analytical Model for Time-Dependent Shearing Deformation in Area-Array Interconnects
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Topics: Creep, Displacement, Shear (Mechanics), Stiffness, Shear deformation, Shapes, Stress, Viscoelastic materials, Viscoelasticity, Solders
Journal Articles

Process Induced Stresses of a Flip-Chip Packaging by Sequential Processing Modeling Technique

J. Wang, Z. Qian, S. Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1998, 120(3): 309–313.
https://doi.org/10.1115/1.2792638
Published Online: September 1, 1998
View Article titled, Process Induced Stresses of a Flip-Chip Packaging by Sequential Processing Modeling Technique
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Topics: Flip-chip, Modeling, Packaging, Stress, Manufacturing, Deflection, Finite element analysis, Warping, Alloys, Bonding
Journal Articles

Constitutive Modeling of Polymer Films From Viscoelasticity to Viscoplasticity

Z. Qian, M. Lu, S. Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. June 1998, 120(2): 145–149.
https://doi.org/10.1115/1.2792605
Published Online: June 1, 1998
View Article titled, Constitutive Modeling of Polymer Films From Viscoelasticity to Viscoplasticity
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Topics: Modeling, Polymer films, Viscoelasticity, Viscoplasticity, Deformation, Stress, Chain, Constitutive equations, Drag (Fluid dynamics), Temperature effects
Journal Articles

Creep Behavior of a Flip-Chip Package by Both FEM Modeling and Real Time Moire´ Interferometry

J. Wang, Z. Qian, D. Zou, S. Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. June 1998, 120(2): 179–185.
https://doi.org/10.1115/1.2792617
Published Online: June 1, 1998
View Article titled, Creep Behavior of a Flip-Chip Package by Both FEM Modeling and Real Time Moire´ Interferometry
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Topics: Creep, Finite element methods, Flip-chip packages, Interferometry, Modeling, Deformation, Displacement, Solders, Stress, Finite element analysis
Journal Articles

Finite Element Viscoelastic Analysis of Temperature and Moisture Effects in Electronic Packaging

Arvind Krishna, B. D. Harper, J. K. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1995, 117(3): 192–200.
https://doi.org/10.1115/1.2792091
Published Online: September 1, 1995
View Article titled, Finite Element Viscoelastic Analysis of Temperature and Moisture Effects in Electronic Packaging
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Topics: Electronic packaging, Finite element analysis, Temperature, Stress, Creep, Cycles, Diffusion (Physics), Elastic analysis, Failure mechanisms, Finite element methods
Journal Articles

Influence of Polymer Viscoelasticity on a Bending Bilayer

B. D. Harper
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1994, 116(3): 191–197.
https://doi.org/10.1115/1.2905685
Published Online: September 1, 1994
View Article titled, Influence of Polymer Viscoelasticity on a Bending Bilayer
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Topics: Polymers, Viscoelasticity, Polymer films, Thermal stresses, Epoxy adhesives, Epoxy resins, Microelectronic packaging, Molding, Temperature, Viscoelastic materials