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Journal Articles

Mechanical Properties of Doped Solder SAC-Q for High Strain Rate Testing at Extreme Surrounding Temperatures for 6 Months of Isothermal Aging

Pradeep Lall, Vishal Mehta, Jeff Suhling, Ken Blecker
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2024, 146(3): 031006.
Paper No: EP-22-1025
https://doi.org/10.1115/1.4064521
Published Online: March 11, 2024
View Article titled, Mechanical Properties of Doped Solder SAC-Q for High Strain Rate Testing at Extreme Surrounding Temperatures for 6 Months of Isothermal Aging
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Topics: Elastic moduli, Mechanical properties, Solders, Stress, Stress-strain curves, Temperature, Tensile strength, Testing, Viscoplasticity, Finite element analysis
Journal Articles

High Strain Rate Mechanical Properties of SAC-Q Solder for Extreme Temperatures After Exposure to Isothermal Aging Up to 90 Days

Pradeep Lall, Vishal Mehta, Jeff Suhling, Ken Blecker
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021108.
Paper No: EP-21-1060
https://doi.org/10.1115/1.4052073
Published Online: October 6, 2021
View Article titled, High Strain Rate Mechanical Properties of SAC-Q Solder for Extreme Temperatures After Exposure to Isothermal Aging Up to 90 Days
Open the PDF for High Strain Rate Mechanical Properties of SAC-Q Solder for Extreme Temperatures After Exposure to Isothermal Aging Up to 90 Days in another window
Topics: Elastic moduli, Mechanical properties, Solders, Stress, Stress-strain curves, Temperature, Tensile strength, Testing, Operating temperature, High temperature
Journal Articles

State of the Art of Lead-Free Solder Joint Reliability

John H. Lau
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. June 2021, 143(2): 020803.
Paper No: EP-20-1059
https://doi.org/10.1115/1.4048037
Published Online: September 3, 2020
View Article titled, State of the Art of Lead-Free Solder Joint Reliability
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Topics: Alloys, Creep, Failure, Reliability, Solder joints, Solders, Temperature, Viscoplasticity, Lead-free solders, Stress
Journal Articles

Reliability Modeling of Lead-Free Solder Joints in Wafer-Level Chip Scale Packages

Jie-Hua Zhao, Vikas Gupta, Alok Lohia, Darvin Edwards
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2010, 132(1): 011005.
https://doi.org/10.1115/1.4000754
Published Online: March 4, 2010
View Article titled, Reliability Modeling of Lead-Free Solder Joints in Wafer-Level Chip Scale Packages
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Topics: Constitutive equations, Creep, Density, Fatigue, Finite element methods, Hardening, Lead-free solders, Modeling, Reliability, Semiconductor wafers
Journal Articles

A Damage-Mechanics-Based Constitutive Model for Solder Joints

C. Basaran, Y. Zhao, H. Tang, J. Gomez
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 208–214.
https://doi.org/10.1115/1.1939822
Published Online: July 23, 2004
View Article titled, A Damage-Mechanics-Based Constitutive Model for Solder Joints
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Topics: Constitutive equations, Creep, Damage, Flow (Dynamics), Hardening, Kinematics, Solder joints, Solders, Stress, Temperature
Journal Articles

Time Integration Algorithm for a Cyclic Damage Coupled Thermo-Viscoplasticity Model for 63Sn-37Pb Solder Applications

Xianjie Yang, C. L. Chow, K. J. Lau
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 148–158.
https://doi.org/10.1115/1.1649246
Published Online: April 30, 2004
View Article titled, Time Integration Algorithm for a Cyclic Damage Coupled Thermo-Viscoplasticity Model for 63Sn-37Pb Solder Applications
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Topics: Algorithms, Computer simulation, Constitutive equations, Damage, Hardening, Shear (Mechanics), Solders, Stress, Viscoplasticity, Finite element analysis
Journal Articles

Failure Analysis of Miniature Solder Specimen

Y. Wei, C. L. Chow, H. E. Fang, M. K. Neilsen, T. J. Lim, W. Lu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 100–105.
https://doi.org/10.1115/1.1648060
Published Online: April 30, 2004
View Article titled, Failure Analysis of Miniature Solder Specimen
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Topics: Damage, Failure analysis, Finite element analysis, Solders, Creep, Fatigue, Constitutive equations, Nonequilibrium thermodynamics, Stress, Displacement
Journal Articles

Thermomechanical Analysis of Solder Joints Under Thermal and Vibrational Loading

Cemal Basaran, Assoc. Prof., and Director,, Rumpa Chandaroy, Staff Consultant,
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. March 2002, 124(1): 60–66.
https://doi.org/10.1115/1.1400752
Published Online: March 15, 2001
View Article titled, Thermomechanical Analysis of Solder Joints Under Thermal and Vibrational Loading
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Topics: Constitutive equations, Damage, Fatigue life, Solder joints, Stress, Thermomechanics, Vibration, Finite element analysis, Reliability, Thermal expansion
Journal Articles

A Damage Coupling Framework of Unified Viscoplasticity for the Fatigue of Solder Alloys

Z. Qian, W. Ren, S. Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1999, 121(3): 162–168.
https://doi.org/10.1115/1.2792679
Published Online: September 1, 1999
View Article titled, A Damage Coupling Framework of Unified Viscoplasticity for the Fatigue of Solder Alloys
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Topics: Alloys, Damage, Fatigue, Solders, Viscoplasticity, Constitutive equations, Creep, Damage mechanics, Deformation, Elasticity
Journal Articles

Viscoplastic Deformation of 40 Pb/60Sn Solder Alloys—Experiments and Constitutive Modeling

Katsuhiko Sasaki, Associate Professor,, Ken-ichi Ohguchi, Research Associate,, Hiromasa Ishikawa, Mem. ASME, Professor,
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. December 2001, 123(4): 379–387.
https://doi.org/10.1115/1.1371927
Published Online: August 24, 1999
View Article titled, Viscoplastic Deformation of 40 Pb/60Sn Solder Alloys—Experiments and Constitutive Modeling
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Topics: Alloys, Compression, Constitutive equations, Creep, Deformation, Simulation, Solders, Stress, Temperature, Tension
Journal Articles

Modeling the Deformation Behavior of a Sn-Pb Solder Alloy Using the Simplified Viscoplasticity Theory Based on Overstress (VBO)

L. Maciucescu, T.-L. Sham, E. Krempl
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1999, 121(2): 92–98.
https://doi.org/10.1115/1.2792673
Published Online: June 1, 1999
View Article titled, Modeling the Deformation Behavior of a Sn-Pb Solder Alloy Using the Simplified Viscoplasticity Theory Based on Overstress (VBO)
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Topics: Alloys, Deformation, Modeling, Solders, Tin, Viscoplasticity, Accounting, Creep, Solder joints, Stress analysis (Engineering)
Journal Articles

Constitutive Modeling of Polymer Films From Viscoelasticity to Viscoplasticity

Z. Qian, M. Lu, S. Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. June 1998, 120(2): 145–149.
https://doi.org/10.1115/1.2792605
Published Online: June 1, 1998
View Article titled, Constitutive Modeling of Polymer Films From Viscoelasticity to Viscoplasticity
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Topics: Modeling, Polymer films, Viscoelasticity, Viscoplasticity, Deformation, Stress, Chain, Constitutive equations, Drag (Fluid dynamics), Temperature effects
Journal Articles

Prediction of Fatigue Failure of 60Sn-40Pb Solder Using Constitutive Model for Cyclic Viscoplasticity

Hiromasa Ishikawa, Katsuhiko Sasaki, Ken-ichi Ohguchi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1996, 118(3): 164–169.
https://doi.org/10.1115/1.2792147
Published Online: September 1, 1996
View Article titled, Prediction of Fatigue Failure of 60Sn-40Pb Solder Using Constitutive Model for Cyclic Viscoplasticity
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Topics: Constitutive equations, Fatigue failure, Solders, Viscoplasticity, Alloys, Deformation, Density, Compression, Creep, Fatigue life