1-20 of 98
Technical Briefs
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

A Comparison of Biaxial Bending Strength of Thin Silicon Dies in the Ball-on-Ring and PoEF Tests

M. Y. Tsai, T. C. Kuo
Journal: Journal of Electronic Packaging
Article Type: Technical Briefs
J. Electron. Packag. September 2023, 145(3): 034502.
Paper No: EP-22-1060
DOI: https://doi.org/10.1115/1.4056717
Published Online: February 8, 2023
View Article
PDF
Topics: Bending strength, Silicon, Stress, Displacement, Failure mechanisms
Journal Articles

Artificial Intelligence for Power Electronics in Electric Vehicles: Challenges and Opportunities

Paul Paret, Donal Finegan, Sreekant Narumanchi
Journal: Journal of Electronic Packaging
Article Type: Technical Briefs
J. Electron. Packag. September 2023, 145(3): 034501.
Paper No: EP-22-1053
DOI: https://doi.org/10.1115/1.4056306
Published Online: December 9, 2022
View Article
PDF
Topics: Artificial intelligence, Design, Electric vehicles, Electronics, Thermal management, Semiconductor devices, Reliability, Manufacturing, Semiconductors (Materials)
Journal Articles

Multifunctional Magnetic Nanocomposite Encapsulant for Electromagnetic Interference Shielding in Power Electronics

Hayden Carlton, Ange Iradukunda, Asif Imran, Sarah Myane, Noah Akey, Fang Luo, David Huitink
Journal: Journal of Electronic Packaging
Article Type: Technical Briefs
J. Electron. Packag. June 2022, 144(2): 024502.
Paper No: EP-21-1049
DOI: https://doi.org/10.1115/1.4053642
Published Online: February 16, 2022
View Article
PDF
Topics: Electromagnetic interference, Electronics, Nanocomposites, Silicones, Nanoparticles, Iron
Journal Articles

Simplified and Detailed Analysis of Data Center Particulate Contamination at Server and Room Level Using Computational Fluid Dynamics

Satyam Saini, Pardeep Shahi, Pratik Bansode, Jimil M. Shah, Dereje Agonafer
Journal: Journal of Electronic Packaging
Article Type: Technical Briefs
J. Electron. Packag. June 2022, 144(2): 024501.
Paper No: EP-21-1070
DOI: https://doi.org/10.1115/1.4053363
Published Online: January 28, 2022
View Article
PDF
Topics: Computational fluid dynamics, Data centers, Heat sinks, Particulate matter, Simulation, Contamination, Flow (Dynamics), Particle flow
Journal Articles

Experimental Study on Thermal Contact Resistance Improvement for Optical Fiber by Using Low-Melting Temperature Alloy

Wen-Xiao Chu, Hao-Yu Lin, Chi-Chuan Wang
Journal: Journal of Electronic Packaging
Article Type: Technical Briefs
J. Electron. Packag. March 2020, 142(1): 014502.
Paper No: EP-19-1039
DOI: https://doi.org/10.1115/1.4044774
Published Online: September 24, 2019
View Article
PDF
Topics: Contact resistance, Melting, Optical fiber, Temperature, Pressure, Alloys, Stress, Heating, Surface roughness, Heat sinks
Journal Articles

Additive-Manufactured Organic Interposers

A. Roshanghias, M. Krivec, J. Bardong, A. Binder
Journal: Journal of Electronic Packaging
Article Type: Technical Briefs
J. Electron. Packag. March 2020, 142(1): 014501.
Paper No: EP-19-1040
DOI: https://doi.org/10.1115/1.4044279
Published Online: September 19, 2019
View Article
PDF
Topics: Additive manufacturing, Manufacturing, Printing
Journal Articles

Investigation on Laser Direct Welding of Quad Flat Pack Components

Jianwen Yuan, Chao Huang, Jimin Chen, Furong Liu, Yi Qiu
Journal: Journal of Electronic Packaging
Article Type: Technical Briefs
J. Electron. Packag. December 2013, 135(4): 044501.
Paper No: EP-13-1024
DOI: https://doi.org/10.1115/1.4025251
Published Online: September 6, 2013
View Article
PDF
Topics: Lasers, Temperature, Tensile strength, Welding, Solders, Laser welding, Tin
Journal Articles

Heat Conduction in Mobile Electronic Equipment: Study on the Effects of Some Key Parameters on Heat Source Temperature Based on a Three-Layer Model

Wataru Nakayama
Journal: Journal of Electronic Packaging
Article Type: Technical Briefs
J. Electron. Packag. September 2013, 135(3): 034501.
Paper No: EP-11-1100
DOI: https://doi.org/10.1115/1.4024367
Published Online: June 4, 2013
View Article
PDF
Topics: Heat, Heat conduction, Temperature, Thermal conductivity, Electronic equipment
Journal Articles

A Novel Low Cost Package for Radio Frequency Applications

Sandeep Chaturvedi, Shiban K. Koul
Journal: Journal of Electronic Packaging
Article Type: Technical Briefs
J. Electron. Packag. June 2013, 135(2): 024501.
Paper No: EP-11-1096
DOI: https://doi.org/10.1115/1.4023041
Published Online: March 28, 2013
View Article
PDF
Topics: Design, Laminates, Manufacturing, Simulation, Strip transmission lines, Strips
Journal Articles

Thermal Assessment of Naturally Cooled Electronic Enclosures With Rectangular Fins

A. Tamayol, F. McGregor, M. Bahrami
Journal: Journal of Electronic Packaging
Article Type: Technical Briefs
J. Electron. Packag. September 2012, 134(3): 034501.
DOI: https://doi.org/10.1115/1.4007077
Published Online: July 24, 2012
View Article
PDF
Topics: Fins, Heat transfer, Natural convection, Radiation (Physics), Temperature
Journal Articles

Bio-inspired Passive Skin Cooling for Handheld Microelectronics Devices

Zhi Huang, Xinsheng Zhang, Ming Zhou, Xiaoding Xu, Xianzheng Zhang, Xuejiao Hu
Journal: Journal of Electronic Packaging
Article Type: Technical Briefs
J. Electron. Packag. March 2012, 134(1): 014501.
DOI: https://doi.org/10.1115/1.4005908
Published Online: March 19, 2012
View Article
PDF
Topics: Biomimetics, Cooling, Energy dissipation, Heat, Microelectronic devices, Skin, Temperature, Natural convection
Journal Articles

Optimization of Microwave Packaging Structure for Directly Modulated Laser Modules Using Three-Dimensional Electromagnetic Model

Wei Han, Marc Rensing, Peter O’Brien, Frank H. Peters
Journal: Journal of Electronic Packaging
Article Type: Technical Briefs
J. Electron. Packag. December 2011, 133(4): 044502.
DOI: https://doi.org/10.1115/1.4005292
Published Online: December 9, 2011
View Article
PDF
Topics: Lasers, Manufacturing, Microwaves, Optimization, Packaging, Reflection, Resonance, Strip transmission lines, Simulation results, Simulation
Journal Articles

A Creep Model for Solder Alloys

Yongchang Lee, Cemal Basaran
Journal: Journal of Electronic Packaging
Article Type: Technical Briefs
J. Electron. Packag. December 2011, 133(4): 044501.
DOI: https://doi.org/10.1115/1.4005288
Published Online: November 17, 2011
View Article
PDF
Topics: Alloys, Creep, Solders
Journal Articles

Accelerated Life Testing in Epoxy Packaged High Luminosity Light Emitting Diodes

Eduardo Nogueira, Manuel Vázquez, Carlos Algora
Journal: Journal of Electronic Packaging
Article Type: Technical Briefs
J. Electron. Packag. September 2011, 133(3): 034501.
DOI: https://doi.org/10.1115/1.4004659
Published Online: September 14, 2011
View Article
PDF
Topics: Epoxy adhesives, Epoxy resins, Failure, Light-emitting diodes, Temperature, Circuits
Journal Articles

Improved Packaging Design for Maximizing the Thermal Performance of Multifinger Collector-Up HBTs

Hsien-Cheng Tseng
Journal: Journal of Electronic Packaging
Article Type: Technical Briefs
J. Electron. Packag. March 2011, 133(1): 014501.
DOI: https://doi.org/10.1115/1.4003515
Published Online: March 9, 2011
View Article
PDF
Topics: Design, Gallium arsenide, Genetic algorithms, Optimization, Packaging, Thermal resistance, Transistors, Thermal stability, Thermal management
Journal Articles

Effects of the Thermocompression Bonding on the Microstructure and Contact Resistance for the Ultrafine Pitch Chip-on-Glass Packaging With Nonconductive Film

Jianhua Zhang, Jinsong Zhang, Lianqiao Yang
Journal: Journal of Electronic Packaging
Article Type: Technical Briefs
J. Electron. Packag. December 2010, 132(4): 044501.
DOI: https://doi.org/10.1115/1.4002898
Published Online: December 3, 2010
View Article
PDF
Topics: Bonding, Contact resistance, Packaging, Tin, Temperature, Pressure, Glass, High temperature, Melting point
Journal Articles

Experimental Analysis Model of an Active Cooling Method for 3D-ICs Utilizing Multidimensional Configured Thermoelectric Coolers

Huy N. Phan, Dereje Agonafer
Journal: Journal of Electronic Packaging
Article Type: Technical Briefs
J. Electron. Packag. June 2010, 132(2): 024501.
DOI: https://doi.org/10.1115/1.4001831
Published Online: June 23, 2010
View Article
PDF
Topics: Cooling, Thermal management, Temperature, Heat sinks, Reliability, Thermoelectric coolers, Air flow
Journal Articles

Three-Dimensional Modeling of Mold Filling in Microchip Encapsulation Process With a Matrix-Array Arrangement

M. K. Abdullah, M. Z. Abdullah, M. A. Mujeebu, Horizon Gitano, Z. M. Ariff, R. Razali, K. A. Ahmad
Journal: Journal of Electronic Packaging
Article Type: Technical Briefs
J. Electron. Packag. March 2010, 132(1): 014502.
DOI: https://doi.org/10.1115/1.4000719
Published Online: March 4, 2010
View Article
PDF
Topics: Cavities, Computer simulation, Epoxy adhesives, Epoxy resins, Finite difference methods, Flow (Dynamics), Integrated circuits, Molding, Pressure, Simulation
Journal Articles

Evaluation of Transverse Shear Effect on Film Delamination in Blister Test

Wei Wang, Yong Huang, Nicole Coutris, Hongseok Noh, Peter J. Hesketh
Journal: Journal of Electronic Packaging
Article Type: Technical Briefs
J. Electron. Packag. March 2010, 132(1): 014501.
DOI: https://doi.org/10.1115/1.4000717
Published Online: February 25, 2010
View Article
PDF
Topics: Delamination, Shear (Mechanics), Film thickness
Journal Articles

Improved Solder Joint Fatigue Models Through Reduced Geometry Dependence of Empirical Fits

D. Bhate, G. Subbarayan, J. Zhao, V. Gupta, D. Edwards
Journal: Journal of Electronic Packaging
Article Type: Technical Briefs
J. Electron. Packag. December 2009, 131(4): 044502.
DOI: https://doi.org/10.1115/1.4000208
Published Online: November 12, 2009
View Article
PDF
Topics: Geometry, Solder joints, Solders, Failure, Fatigue, Alloys, Energy dissipation