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Keywords: Area array
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Journal Articles

Interfacial Compounds Characteristic and Its Reliability Effects on SAC305 Microjoints in Flip Chip Assemblies

Ye Tian, Ning Ren, Xiaoxia Jian, Tie Geng, Yiping Wu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031007.
Paper No: EP-18-1009
https://doi.org/10.1115/1.4040298
Published Online: June 11, 2018
... failure of solder joints under stress conditions [ 5 – 7 ]. Area array COB Failure analysis Flip chip Reliability Solder 28 01 2018 12 05 2018 Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the J OURNAL OF E LECTRONIC P ACKAGING...
View Article titled, Interfacial Compounds Characteristic and Its Reliability Effects on SAC305 Microjoints in Flip Chip Assemblies
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Topics: Flip-chip assemblies, Reliability, Soldering, Tin, Solders, Finite element analysis, Fracture (Materials), Intermetallic compounds
Journal Articles

Ball Grid Array Interconnection Properties of Solderable Polymer–Solder Composites With Low-Melting-Point Alloy Fillers

Byung-Seung Yim, Young-Eui Shin, Jong-Min Kim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2017, 139(4): 041007.
Paper No: EP-17-1007
https://doi.org/10.1115/1.4038028
Published Online: October 13, 2017
... January 25, 2017; final manuscript received September 24, 2017; published online October 13, 2017. Assoc. Editor: Kaushik Mysore. 25 01 2017 24 09 2017 Area array BGA Composite materials SMT Underfill In recent years, ball grid array (BGA) packages have been widely used...
View Article titled, Ball Grid Array Interconnection Properties of Solderable Polymer–Solder Composites With Low-Melting-Point Alloy Fillers
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Topics: Ball-Grid-Array packaging, Composite materials, Fillers (Materials), Solders, Wetting, Polymers, Melting, Statistical process control, Flow (Dynamics)
Journal Articles

Experimental Analysis of a Novel Piezoelectric Jetting System for Micrograms Deposition in Electronic Assemblies

Rajiv L. Iyer, Daryl L. Santos
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031009.
Paper No: EP-17-1012
https://doi.org/10.1115/1.4037144
Published Online: July 14, 2017
... manuscript received May 31, 2017; published online July 14, 2017. Assoc. Editor: Xiulin Ruan. 30 01 2017 31 05 2017 Area array BGA Conductive adhesives Conductive Inks Conformal coatings Electronic Flip chip High density interconnects Microsystems PWB Rework SMT Underfill...
View Article titled, Experimental Analysis of a Novel Piezoelectric Jetting System for Micrograms Deposition in Electronic Assemblies
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Topics: Adhesives, Drops, Nozzles, Pistons, Experimental design, Manufacturing, Experimental analysis, Fluids
Journal Articles

Far Back End of Line Aluminum Stress Reduction Methods for Two-Dimensional/2.5D Fine Pitch Assemblies

Krishna Tunga, Thomas Wassick, Maryse Cournoyer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031004.
Paper No: EP-16-1110
https://doi.org/10.1115/1.4036368
Published Online: June 14, 2017
... of ASME for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received October 2, 2016; final manuscript received March 28, 2017; published online June 14, 2017. Assoc. Editor: Kaushik Mysore. 02 10 2016 28 03 2017 3D packaging Area array Chip stacking Failure...
View Article titled, Far Back End of Line Aluminum Stress Reduction Methods for Two-Dimensional/2.5D Fine Pitch Assemblies
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Topics: Aluminum, Stress, Solder joints, Design
Journal Articles

Evolution of Hardware Morphology of Large-Scale Computers and the Trend of Space Allocation for Thermal Management

Wataru Nakayama
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. March 2017, 139(1): 010801.
Paper No: EP-16-1092
https://doi.org/10.1115/1.4035019
Published Online: November 23, 2016
... aiming at developments of highly energy-efficient cooling systems [ 1 ]. Area array MCM Memory Packaging PWB Thermal analysis 29 07 2016 18 10 2016 Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the J OURNAL OF E LECTRONIC P...
View Article titled, Evolution of Hardware Morphology of Large-Scale Computers and the Trend of Space Allocation for Thermal Management
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Topics: Circuits, Computers, Printed circuit boards, Hardware
Journal Articles

Optimal Shock Pulse in a Drop Test Simulation of Standardized Board for Uniform Shock Response

Sharan Kallolimath, Jiang Jenny Zhou
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2016, 138(4): 041001.
Paper No: EP-14-1082
https://doi.org/10.1115/1.4034187
Published Online: August 10, 2016
... September 29, 2014; final manuscript received July 14, 2016; published online August 10, 2016. Assoc. Editor: Toru Ikeda. 29 09 2014 14 07 2016 3D packaging Area array COB CSP FR-4 Wafer level packaging Mechanical failures of hand-held devices lose their effective...
View Article titled, Optimal Shock Pulse in a Drop Test Simulation of Standardized Board for Uniform Shock Response
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Topics: Electrons, Finite element analysis, Lumber, Shock (Mechanics), Simulation, Stress, Solder joints, Modeling, Symmetry (Physics), Boundary-value problems