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Keywords: Bumpless
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 113–119.
Published Online: June 3, 2005
... ACF joints by maintaining low contact resistance. By contrast, high contact resistance was found in assemblies treated with higher reflow. Under humidity aging (85°C/85%RH), bumpless chips proved to be unreliable due to corrosion mechanism. Moreover, ACF had shown degradation in chemical and physical...
