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Keywords: DOTCOMP
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2011, 133(1): 011003.
Published Online: March 3, 2011
... “thinkable” boundary conditions that are experienced by the SFP device in practical situations. The commercial optimization tool developed by the DELPHI team, DOTCOMP , is used for generating the compact thermal model. A detailed validation of the CTM of the SFP in real-time applications using FLOTHERM 7.2...
