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Keywords: HASMAP
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 179–189.
Published Online: July 5, 2006
... characteristics of the fpBGA package. New experimental data were developed for in-plane and/or out-of-plane displacements of the package and the package–board assembly using HASMAP and Shadow Moiré interferometry. In general, a good agreement was obtained between...