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Keywords: Moiré interferometry
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Journal Articles

Comparative Studies on Solder Joint Reliability of Plastic and Ceramic Ball Grid Array Packages of the Same Form Factor Under Power and Accelerated Thermal Cycling

S. B. Park, Rahul Joshi, Izhar Ahmed, Soonwan Chung
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. December 2008, 130(4): 041004.
https://doi.org/10.1115/1.2993146
Published Online: November 17, 2008
... field condition. In this work, the comparative study of PC and ATC was conducted for the reliability of board level interconnects. The comparison was made using both ceramic and organic flip chip ball grid array packages. Moiré interferometry was adopted for the experimental stress analysis. In PC...
View Article titled, Comparative Studies on Solder Joint Reliability of Plastic and Ceramic Ball Grid Array Packages of the Same Form Factor Under Power and Accelerated Thermal Cycling
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Topics: Ball-Grid-Array packages, Ceramics, Computational fluid dynamics, Deformation, Finite element analysis, Flip-chip devices, Interferometry, Manufacturing, Reliability, Solder joints
Journal Articles

A Global–Local Approach for Mechanical Deformation and Fatigue Durability of Microelectronic Packaging Systems

T. Zhang, S. Rahman, K. K. Choi, K. Cho, P. Baker, M. Shakil, D. Heitkamp
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 179–189.
https://doi.org/10.1115/1.2721092
Published Online: July 5, 2006
... initiation HASMAP Moiré interferometry Commercial-off-the-shelf (COTS) electronics are being utilized on military and commercial platforms to leverage technology growth and maximize affordability. The traditional approach to the selection and evaluation of COTS...
View Article titled, A Global–Local Approach for Mechanical Deformation and Fatigue Durability of Microelectronic Packaging Systems
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Topics: Deformation, Durability, Fatigue, Fatigue cracks, Fatigue life, Solder joints, Solders, Cycles, Fracture (Materials), Stress