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Keywords: PBGA Assembly
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2003, 125(1): 157–161.
Published Online: March 14, 2003
... or functional testing is performed. At this stage, it becomes difficult to determine whether the defect is due to a solder joint or the component itself. Hence controlling the open defect is very important in the PBGA assembling process. It was found that three kinds of defective modes are responsible...
