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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2003, 125(1): 157–161.
Published Online: March 14, 2003
... Point of View,” MCB Microelectronics Int., Vol. 13, Issue 1. Jaeger, P., and Lee, N.-C., 1992, “A model study of low residue no-clean solder paste,” Proc., Nepcon West , Anaheim, CA. Lee , N.-C. , 1999 , “ Optimizing the reflow profile via defect mechanism analysis ,” Soldering...
