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Keywords: SAC alloys
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Journal Articles

Anand Model Constants of Sn–Ag–Cu Solders: What Do They Actually Mean?

Mohammad A. Gharaibeh, James M. Pitarresi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2025, 147(2): 021001.
Paper No: EP-24-1080
https://doi.org/10.1115/1.4067137
Published Online: December 9, 2024
... through comprehensive nonlinear finite element simulations. Anand model coefficients for different SAC alloys, including SAC105, SAC205, SAC305, and SAC405, were sourced from existing literature and used to establish a systematic study matrix for each parameter. These coefficients were then integrated...
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Topics: Deformation, Density, Finite element analysis, Solders, Stress, Thermomechanics, Creep, Simulation, Alloys, Hardening
Journal Articles

Individual Phase Mechanical Properties at Different Temperatures of Sn–Ag–Cu Lead-Free Solders Incorporating Special Pileup Effects Using Nanoindentation

Muhammad Sadiq, Jean-Sebastien Lecomte, Mohammed Cherkaoui
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2015, 137(3): 031005.
Paper No: EP-13-1135
https://doi.org/10.1115/1.4029836
Published Online: September 1, 2015
... April 17, 2015. Assoc. Editor: Tong Cui. 12 12 2013 10 10 2014 17 04 2015 Sn–Ag–Cu (SAC) alloys are considered as good replacements of Sn–Pb alloys which are banned due to the toxic nature of Pb. But, SAC alloys have a coarse microstructure that consists of β-Sn rich...
View Article titled, Individual Phase Mechanical Properties at Different Temperatures of Sn–Ag–Cu Lead-Free Solders Incorporating Special Pileup Effects Using Nanoindentation
Open the PDF for Individual Phase Mechanical Properties at Different Temperatures of Sn–Ag–Cu Lead-Free Solders Incorporating Special Pileup Effects Using Nanoindentation in another window
Topics: Alloys, Mechanical properties, Nanoindentation, Temperature, Tin, Young's modulus, Lead-free solders