.... modeling interface thermomechanical properties debonding nanoindentation test aluminium chromium copper heat transfer molecular dynamics method nanoindentation nanotechnology Young's modulus 24 11 2009 17 01 2011 07 06 2011 07 06 2011 2011 American Society...

... 24 11 2010 aluminium boundary layers computational fluid dynamics contact resistance convection finite volume methods heat sinks metal foams With the development of new high power-density electronics arises the need for more effective means of dissipating the excess heat...

...(98)00110-3 20 08 2009 14 04 2010 11 06 2010 11 06 2010 aluminium electromigration sputtering thin film circuits EM high purity Al film grain boundary diffusion AFD activation energy Thin films, which are thin material layers ranging from...

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... (solid) gold copper aluminium fractography shear fracture gold ball bond copper ball bond thermosonic bonding interface In integrated circuit (IC) chip manufacturing, wire bonding is a high yield, high speed automated process. Fine gold and copper wires are largely used for bonding...

... configuration for even larger enhancement in heat transfer. 25 05 2005 23 09 2005 heat sinks cooling electronics packaging convection porous materials metal foams aluminium Horton , C. W. , and Rogers , F. T. , 1945 , “ Convection Currents in Porous Media ,” J. Appl...

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... through porous media permeability aluminium convection Today’s trend in the electronic equipment industry toward denser and more powerful products requires a higher level of performance from cooling technology. Many ideas for cooling methods have been proposed—among them is the pin fin heat...

... devices polymers dielectric materials fracture delamination thermal stress cracking aluminium silicon Flip chip bonding technology using anisotropic conductive films (ACFs) has been used for decades in the area LCD display applications. In recent, there has been growing interest in using...

... 01 December 2003 08 07 2004 heat transfer heat sinks flow through porous media forced convection electronics packaging permeability flow simulation aluminium temperature distribution The trend in electronics industry toward smaller and more powerful products has...

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... 2003 fine-pitch technology soldering flip-chip devices integrated circuit interconnections integrated circuit packaging aluminium microassembling Since the inception of C4 (controlled collapse chip connection) technology by IBM for their solid logic technology (SLT) more than...

... in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received February 2003. Associate Editor: E. Suhir. 01 February 2003 15 12 2003 gold copper aluminium integrated circuit interconnections integrated circuit packaging integrated circuit reliability ageing lead bonding hardness...

...) forced convection thermal resistance foams porous materials flow through porous media boundary layers cooling aluminium The large-scale integration of electronic circuits has resulted in a continuous increase in chip power dissipation requirements. According to the SIA roadmap 1...

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