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Keywords: anisotropic conductive adhesive
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Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 260–265.
Published Online: October 27, 2006
... layer in the SBU process. The effect of RCC on the reliability of flip chip joints with anisotropically conductive adhesive film (ACF) was studied. Two substrates were used. The difference between the substrates was RCC laminated on the other substrate. The reliability of the test samples was studied...
Journal Articles