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Keywords: anisotropic media
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021006.
Published Online: May 8, 2008
... resistance. 17 01 2006 09 09 2007 08 05 2008 adhesive bonding anisotropic media conductive adhesives contact resistance delamination elastic moduli integrated circuit packaging internal stresses resins anisotropic conductive adhesive bonding force adhesion strength...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 149–156.
Published Online: August 14, 2006
.... anisotropic conductive adhesive lead-free assembly thermal aging temperature-humidity aging Z bond adhesive conductive adhesives electronics packaging surface mount technology microassembling integrated circuit packaging ball grid arrays ageing contact resistance anisotropic media 04...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 375–380.
Published Online: February 14, 2005
... of the particle and exposing the underlying polymeric portion were also observed. 20 02 2004 14 02 2005 anisotropic media electronics packaging mechanical contact contact resistance abrasion friction mechanical testing adhesives anisotropic conductive film (ACF) mechanical shock...